JPS5812991U - printed wiring board equipment - Google Patents
printed wiring board equipmentInfo
- Publication number
- JPS5812991U JPS5812991U JP1981108374U JP10837481U JPS5812991U JP S5812991 U JPS5812991 U JP S5812991U JP 1981108374 U JP1981108374 U JP 1981108374U JP 10837481 U JP10837481 U JP 10837481U JP S5812991 U JPS5812991 U JP S5812991U
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring board
- printed wiring
- copper foil
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す一部断面側面図、第2図は本考案
の一実施例を示す一部断面側面図である。
1・・・・・・ケース、2・・・・・・チップ部品、3
・・・・・・フレキシブル配線基板、4a・・・・・・
ビス、7・・・・・・チップ部品、8・・・・・・リジ
ッド基板、9・・・・・・銅箔、10・・・・・・ピン
。FIG. 1 is a partially sectional side view showing a conventional example, and FIG. 2 is a partially sectional side view showing an embodiment of the present invention. 1... Case, 2... Chip parts, 3
...Flexible wiring board, 4a...
Screw, 7... Chip component, 8... Rigid board, 9... Copper foil, 10... Pin.
Claims (1)
板とを接着し、前記フレキシブル配線基板のアース銅箔
とリジッド基板の銅箔とをオーム接触させ、リジッド基
板によりフレキシブル配線基板の機械的強度を増大させ
るとともにリジッド基板の銅箔によりフレキシブル配線
基板をシールドするよう構成したことを特徴とするプリ
ント配。 線基板装置。[Scope of Claim for Utility Model Registration] A flexible wiring board and a rigid board having copper foil on the entire surface are bonded together, the ground copper foil of the flexible wiring board and the copper foil of the rigid board are brought into ohmic contact, and flexible wiring is formed by the rigid board. A printed wiring board characterized by increasing the mechanical strength of the board and shielding the flexible wiring board with the copper foil of the rigid board. Line board device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981108374U JPS5812991U (en) | 1981-07-20 | 1981-07-20 | printed wiring board equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981108374U JPS5812991U (en) | 1981-07-20 | 1981-07-20 | printed wiring board equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5812991U true JPS5812991U (en) | 1983-01-27 |
Family
ID=29902782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981108374U Pending JPS5812991U (en) | 1981-07-20 | 1981-07-20 | printed wiring board equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812991U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01159056U (en) * | 1988-04-26 | 1989-11-02 | ||
JPH0534244U (en) * | 1991-10-11 | 1993-05-07 | アサヒ産業株式会社 | Stairs for scaffolding |
JPH0616607U (en) * | 1992-07-31 | 1994-03-04 | アルインコ株式会社 | Stairs for temporary scaffolding |
-
1981
- 1981-07-20 JP JP1981108374U patent/JPS5812991U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01159056U (en) * | 1988-04-26 | 1989-11-02 | ||
JPH0534244U (en) * | 1991-10-11 | 1993-05-07 | アサヒ産業株式会社 | Stairs for scaffolding |
JPH0616607U (en) * | 1992-07-31 | 1994-03-04 | アルインコ株式会社 | Stairs for temporary scaffolding |
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