JPS59115276A - Packing package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a package for packaging microelectronic components.

Conventionally, in this type of package, the product inside is small and not fixed to the case, so when the inner case is removed from the outer paper case, the micro electronic components inside are There was a drawback that it easily fell out of the case.

Further, even when characteristics are measured with the microelectronic component placed in the inner case, the microelectronic component falls due to a slight vibration, resulting in a lack of ease of handling.

Note that since the microelectronic components are small, it is difficult to find them once they are dropped, and there is a high possibility of them being lost, so care must be taken when handling them.

An object of the present invention is to provide a packaging package that eliminates the drawbacks of the conventional packaging packages for microelectronic components as described above, prevents the microelectronic components from falling from the case during handling work, and improves workability. is to provide.

The packaging package of the present invention is a packaging package for microelectronic components, in which a removable female magnet is attached to a part of the inner case of the package to fix the microelectronic component to the inner case. It is characterized by this.

Next, one embodiment of the present invention will be described with reference to FIGS. 3 and 4.

In the packaging package according to the present invention, a space is provided on the back side of an inner case 2 made of a material such as plastic, so that a thin magnet 3 can be attached to the outer paper case 1. There is. In such a packaging package, the microelectronic components to be packaged inside, such as a component 4 such as a mini-mold transistor, are made of a material that is attracted to a magnet, such as iron, and are made of plastic. It is fixed to case 2. Therefore, even if the plastic inner case is removed from the outer paper case, the problem of the microelectronic components falling due to external vibrations is unlikely to occur.

Note that once the magnet is removed from the plastic inner case, the microelectronic component can be easily taken out as in the conventional case. Further, by using such a magnetic case when measuring the characteristics of the microelectronic component, the microelectronic component can be measured while being fixed to the case, improving work efficiency.

Therefore, the packaging package of the present invention prevents microelectronic components from falling out of the case due to external vibrations, thereby improving work efficiency.

[Brief explanation of the drawing]

1 and 2 are a side sectional view and a front view, respectively, of a conventional packaging package, and FIGS. 3 and 4 are a side sectional view and a front view, respectively, of a packaging package according to an embodiment of the present invention. be. In the figure, reference numeral 1τ...exterior paper case, 2
...Plastic medium case, 3...
Thin magnet, 4... Shows fine/J\electronic parts, respectively.

Claims (1)

[Claims] A package for packaging microelectronic components, characterized in that a removable magnet is fixed to a part of the inner case of the package, and the microelectronic component is fixed to the inner case. Packaging packages for microelectronic components.