JPS59113178A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To remove the foreign matter suspended on the surface of the molten metal in an evaporation pan only by the lifting operation of the molten metal in a vapor deposition device which sucks up the molten metal of an object to be deposited by evaporation in the evaporation pan in a vacuum vessel from a melting furnace in the atmosphere by providing specifically a baffle plate in the evaporation pan. CONSTITUTION:A baffle plate (plate for removing foreign matter) 8 is fixed in an evaporation pan 3 inclinedly downward in the position upper than the bottom of the pan and lower than a heater 4, and the bottom end thereof forms an aperture 8' substantially smaller than the pan bottom. When the inside of a vacuum vessel is thereupon evacuated to a vacuum, the molten metal 5 of a plating material ascends in a snorkel 11 on account of a pressure difference and enters the pan 3. If the level of the molten metal 5 sucked therein is lower than the bottom end of the plate 8, an oxide film 9 floats over the entire surface of the molten metal surface but if the level rises to the bottom surface of the plate 8 or above, the molten metal 5 ascends through the aperture 8'. The film 9 which is in contact with the aperture 8' has the possibility of ascending together with the molten metal but the greater part of the other film 9 is blocked by the plate 8 and is accumulated under the plate 8.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus that can effectively remove foreign matter within an evaporation pot.

The vapor deposition furnace currently in use as an evaporation source for continuously vacuum-depositing a metal film such as Zn or A4 on a copper strip or the like has a structure as shown in FIG.

In Figure 1, 1 is a copper strip, 2 is a Fivacuum vessel, 3 is an evaporation pot, 4 is a heater, 5 is a molten metal that is a plating material, and 6
1 is an evaporation port, 7 is a heat insulating material, 11 is a snorkel, and 12 is a melting furnace.

An evaporation pot 3 installed in a vacuum container 2 holds a plating material 5 therein, and the plating material 5 is heated by a heater 4. The plating material 5 is heated and evaporated, ejected from the vapor deposition port 6, and continuously plated onto the steel strip 1 running above the vapor deposition port 6.

The plating material 5 is melted in advance in the melting furnace 12, and then sucked up into the evaporation pot 3 via the snorkel 11 due to the pressure difference between the outside air and the inside of the vacuum container 2.

However, in the vacuum evaporation furnace as described above, the evaporation pot 3
Foreign matter such as an oxide film floats on the surface of the molten metal inside, causing the following problems.

(1) Foreign particles are deposited on the copper strip along with metal vapor, giving an adverse impression on the n1 product.

(2) Since the evaporation area (the so-called clean surface with no floating foreign particles) is not necessarily constant, it is difficult to control the amount of evaporation depending on the temperature of the bath or variations in bath temperature.

The cause of these problems is that when the vacuum container 2 is opened to the atmosphere, some Zn may be present in the evaporation pan 3 and the snorkel 11 tube.
It is conceivable that plating materials such as At, At, etc. may remain, and oxidized nitrogen may peel off and float when the liquid is restarted (when the liquid is raised again).

In order to improve the quality of products and control the amount of evaporation, the present invention responds to the need for foreign matter removal measures by installing a stationary foreign matter removal device in a vapor deposition furnace and removing foreign matter only by lifting and lowering the liquid. It was done for that purpose.

That is, the present invention provides a vacuum evaporation apparatus that performs evaporation by sucking up molten metal to be deposited from a melting furnace in the atmosphere to an evaporation pot in a vacuum tank using a pressure difference. The present invention relates to a vacuum evaporation apparatus characterized in that a baffle plate is provided, and the lower end of the baffle plate has an opening that is sufficiently smaller than the bottom of the pot.

FIG. 2 is a diagram showing an embodiment of the apparatus of the present invention.

In Fig. 2, 1 is a copper strip, 2 is a vacuum container, 3 is an evaporation pan, 4 is a heater, 5 is a molten metal plated material, 6 is a vapor deposition port, 7 is a heat insulator, 11 is a snorkel, and 12 is a A melting furnace, 8 a baffle plate (hereinafter referred to as a foreign matter removal plate), and 9 an oxide film.

The foreign matter removal plate 8 is fixed inside the evaporating pot 3 above the bottom of the pot and below the heater 4, and its shape is as shown in FIG. 3(A) or (B) [(a) in each figure is As shown in the plan view and (b) is a side view, the side surface is inclined downward and there is an opening 8' in the center, and the material is plated material 5.
Use materials that are difficult to react with. For example, plating material 5
When is Zn or At, high melting point metal such as Ta, Mo, W, At20g, EliO, ZrO2,
Ceramics such as TiO2 or carbon are suitable.

In FIG. 2, when the inside of the vacuum container 2 is evacuated, the plating material 5 rises inside the system snorkel 11 due to the pressure difference, and the evaporation pot 5
It sucks up inside. At this time, if the reached liquid level of the plating material that has been sucked up is below the lower end of the foreign matter removal plate 8, an oxide film 9 will float on the entire surface of the hot water. Then, the following effects can be obtained.

That is, the hot water level with the oxide film 9 floating on the entire surface of the hot water rises and reaches the level of the lower end of the foreign matter removal plate 8. As the level rises further, the molten metal 5 of the plating material rises through the opening 8' at the lower end of the foreign matter removal plate 8, and at this time, the oxide film that was just in contact with the opening 8' may flow upward together with the molten metal. However, most of the other oxide film is blocked by the foreign matter removal plate 8 and remains below the foreign matter removal plate 8 as shown in FIG.

In this manner, according to the apparatus of the present invention, the oxide film 9 can be kept under the foreign matter removal plate 8, and a fine evaporation surface can be obtained. Furthermore, the device of the present invention does not require any drive mechanism or the like, and is extremely advantageous not only in terms of device cost but also in operating cost.
It can be said that it is a good thing.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining a general vacuum evaporation apparatus, FIG. 2 is a diagram showing an embodiment of the apparatus of the present invention, and FIG. 3 (A
) and (B) are diagrams showing an example of a foreign matter removal plate according to the apparatus of the present invention, in which (a) is a plan view and (b) is a side view. Sub-Agent 1) Meijutsu Agent Ryo Hagiwara - Figure 1 Figure 2 Figure 31 ('A) Figure (B)

Claims (1)

[Claims] In a vacuum evaporation apparatus that performs evaporation by sucking up molten metal to be deposited from a melting furnace in the atmosphere to an evaporation pot in a vacuum tank using a pressure difference, a baffle plate is provided that is inclined upward from the bottom of the pot in the evaporation pot. A vacuum evaporation apparatus characterized in that the lower end of the baffle plate has an opening that is sufficiently smaller than the bottom of the pot.