JPS5911304Y2 - heat transfer panel - Google Patents

Description

[Detailed description of the invention] The present invention relates to the structure of a heat transfer panel, and relates to a heat transfer panel that transfers heat from under the floor to the floor surface by providing a heat transfer material on a panel that is composed of a heat insulating material. .

Panels used for underfloor heating, which have become popular recently, are made up of only heat insulating material, making it difficult for the heat under the floor to reach the panel surface, making them uneconomical in terms of thermal efficiency.

The present invention relates to an improvement of such a conventional panel used for underfloor heating, and by incorporating a heat transfer material into the panel, heating heat from the underfloor space is efficiently transmitted to the panel surface.

To explain the present invention with reference to the accompanying drawings, FIG. 1 shows a cross-sectional view of a heat transfer panel of the present invention, and FIG. 2 is a structural cross-sectional view showing an example of its use.

A indicates the entire panel, and 3 indicates a heat insulating material such as a synthetic resin foam that constitutes the panel.

The heat-transfer material 1 is coated around the heat-insulating material 2, and the material of the heat-transfer material 1 is not particularly specified, but from the viewpoint of good thermal conductivity and ease of processing, aluminum foil or the like is used. Appropriate.

In the panel of the present invention, the upper and lower parts of the heat transfer material 1 are divided at an appropriate intermediate position and communicated with each other by a heat transfer material 3 of the same quality.

Therefore, in this panel, as shown in the figure, the heat insulating material 2 is the heat transfer material 3.
The heat transfer materials 1 and 3 are divided by
It moves upward along the

An example of the implementation of this invention will be explained with reference to FIG. 2. The figure shows a schematic diagram of the structure of underfloor heating, and a hot water supply pipe 4 for heating is connected to the lower part of the heat transfer panel A of the invention, and the upper surface thereof A heat conductive plate 5 is laid down.

Therefore, when using the panel A of the present invention, the heating heat transmitted from the lower heat conductive plate 5 is effectively transferred to the panel surface by the heat transfer bodies 1 and 3 provided on the panel, on the average. .

Next, the following table shows a comparison of the increase in panel surface temperature when a conventional heat insulating panel is used and when the panel of the present invention is used.

As shown in the table, when the temperature of the heat conductive plate 5 is 53°C and the outside temperature is 20°C or higher, when the panel of the present invention is used, the heat conduction effect is much better than that of conventional panels, and the heating effect is effectively exhibited. This provides an extremely useful panel that can be used to

[Brief explanation of drawings]

FIG. 1 shows a sectional view of the heat transfer panel of the present invention, and FIG. 2 shows an embodiment thereof. 1, 2... Heat conducting material for heat transfer, 3... Heat insulating material. No.

Claims (1)

[Scope of utility model registration request] The periphery of the heat insulating material 2, such as foamed resin, is covered with a heat transfer material such as aluminum foil 1, and the coated heat insulating material 2 is divided into appropriate parts, with a heat transfer material 3 interposed between them, and upper and lower aluminum foils are formed. foil 1
A heat transfer panel characterized by being connected to the