JPS59108253A - Ion implanting device - Google Patents

Ion implanting device

Info

Publication number
JPS59108253A
JPS59108253A JP20747283A JP20747283A JPS59108253A JP S59108253 A JPS59108253 A JP S59108253A JP 20747283 A JP20747283 A JP 20747283A JP 20747283 A JP20747283 A JP 20747283A JP S59108253 A JPS59108253 A JP S59108253A
Authority
JP
Japan
Prior art keywords
ion
mass
implantation
slits
ion beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20747283A
Other languages
Japanese (ja)
Inventor
Katsumi Tokikuchi
克己 登木口
Kuniyuki Sakumichi
訓之 作道
Hidemi Koike
英巳 小池
Ichiro Shikamata
鹿又 一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20747283A priority Critical patent/JPS59108253A/en
Publication of JPS59108253A publication Critical patent/JPS59108253A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)

Abstract

PURPOSE:To obtain an easy-to-use ion implanting device by making a plurality of slits through a mass separation slit board then directing the ion beam toward desired ion implanting chamber by means of a beam deflecting function of mass separator and a plurality of slits thereby eliminating beam deflecting magnet. CONSTITUTION:A plurality of slits 8', 8'' are made through a mass separation slit board 8. Mass separated ion beam 3 is directed to pass through desired slit 8'' or 8' through regulation of magnet exciting current of a mass separator 2. In other word, deflecting function similar to the beam deflecting magnet is provided to the mass separator 2. Ion beam 3 passed through each slit will reach to each rotary disc 6, 6'. Ion beam under implantation is standstill while sweeping function is realized by moving the rotary discs 6, 6' mechanically against the beam. Consequently the discs 6, 6' under implantation will move radially in arrow direction with correspondence to rotation resulting in uniform ion implantation into a wafer.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は主として半導体装置の製造に用いるイオン打込
み装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention mainly relates to an ion implantation apparatus used for manufacturing semiconductor devices.

〔発明の背景〕[Background of the invention]

イオン打込み装置では、単位時間当りのウェハへの打込
み処理枚数は、ビーム電流、ウェハ交換時間およびそれ
に伴う打込み室の排気時間等に主に依存する。特に打込
み量が少々い場合には、上記処理枚数はウェハ交換時間
および排気時間によって制限を受けるので、これらの時
間を々るべく短縮することが要求される。最近、大電流
打込み装置では、ウェハ処理能力を増加させることを目
的として、打込み室を2台備え、一方が打込みを行って
いる間に他方の打込み室にウェハを装着、排気しておく
ものが使われつつある。以下、その代表的構成例につき
図面を用いて説明する。
In an ion implantation apparatus, the number of wafers that can be implanted per unit time depends mainly on the beam current, the wafer exchange time, the accompanying evacuation time of the implantation chamber, and the like. Particularly when the implantation amount is small, the number of wafers processed is limited by the wafer exchange time and evacuation time, so it is required to shorten these times as much as possible. Recently, in order to increase the wafer processing capacity, high-current implantation equipment is equipped with two implantation chambers, and while one implantation is being performed, the other implantation chamber is loaded with wafers and evacuated. It is being used. Hereinafter, typical configuration examples thereof will be explained using the drawings.

第1図は、上記打込み室を2台備えだイオン打込み装置
の要部構成を示すもめで、同図(a)は平面図、(b)
は正面図である。図面を簡明にするために、後述する本
発明に直接関係しない打込み室の構造等は図示を省略し
た。
Figure 1 shows the main structure of an ion implantation device equipped with two implantation chambers, with (a) being a plan view and (b) being a plan view.
is a front view. In order to simplify the drawings, the structure of the driving chamber and the like that are not directly related to the present invention, which will be described later, are omitted from the drawings.

第1図において、1はイオン源、2は質量分離器である
。イオン源1かも出たイオンビームろには種々のイオン
種を含んでいるので、打込みに必要なイオンを分離する
ために、磁場を用いた質量分離器2(2′、2はその磁
極を示す)が使われる。
In FIG. 1, 1 is an ion source and 2 is a mass separator. The ion beam filter emitted from the ion source 1 contains various ion species, so in order to separate the ions necessary for implantation, a mass separator 2 (2', 2 indicates the magnetic pole) using a magnetic field is used. ) is used.

質量分離されたイオンビーム6は質量分離スリット板4
のスリットを通り、ビーム偏向磁石5の磁極5.50間
を通り抜け、打込み室にある回転円盤乙に達する。偏向
磁石らによりイオンビーム6は(29図においては紙面
に対し直角方向に、(1))図では水平方向に偏向を受
ける。即ち、(1))図に示しだように、イオンビーム
6が回転円盤6.6′のいずれか一方の所定の位置を照
射するように向けられ、上記円盤6.6上に装着された
ウェハ7にイオン打込みを行う。均一打込みを行うだめ
には、イオンビーム6は回転円盤6.6′のそれぞれの
中心00′に対し半径方向に掃引する必要があシ、この
ビーl、掃引も偏向磁石5によって行なわれる。一方の
回転円盤例えば乙の方で打込み処理を行なっている間に
、他方の回転円盤6′の方では、ウーハの装着、予備排
気等を行ない、次の打込み処理の準備をしておく。回転
巴盤乙の方の打込み処理が完了した段階で、今度は回転
円盤6′の方の打込みにかメる。このように交互に打込
みを行なうことにより、ウェハの装着、真空引きなどに
よる時間のロスが事実上零になり、ウェハ処理枚数の増
大が可能になる。
The mass separated ion beam 6 passes through the mass separation slit plate 4
The beam passes through the slit, passes between the magnetic poles 5 and 50 of the beam deflection magnet 5, and reaches the rotating disk B in the driving chamber. The ion beam 6 is deflected by the deflection magnets (in the direction perpendicular to the plane of the paper in FIG. 29, and in the horizontal direction in FIG. 29 (1)). That is, (1)) As shown in the figure, the ion beam 6 is directed so as to irradiate a predetermined position on either one of the rotating disks 6.6', and the wafer mounted on the disk 6.6 is 7. Perform ion implantation. In order to achieve uniform implantation, the ion beam 6 must be swept in the radial direction with respect to the respective centers 00' of the rotating disks 6, 6', and this beam sweeping is also effected by the deflection magnets 5. While the driving process is being carried out on one of the rotary disks, for example B, the other rotating disk 6' is equipped with a woofer, preliminary exhaust, etc., in preparation for the next driving process. Once the driving process for rotary tomoe disk B is completed, it is time to start driving for rotary disk 6'. By performing implantation alternately in this manner, time loss due to wafer mounting, evacuation, etc. can be virtually eliminated, making it possible to increase the number of wafers processed.

しかしながら、上述したような従来技術では、ビーム偏
向磁石5でビーム偏向とビーム掃引の機能を併用させて
いるため、均一な打込みを実現するために偏向磁石5に
高精度なビーム偏向、掃引制御を要求していた。
However, in the conventional technology as described above, the beam deflection magnet 5 has both beam deflection and beam sweeping functions, so the deflection magnet 5 has to perform highly accurate beam deflection and sweep control in order to achieve uniform implantation. was demanding.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記の問題点を解消し、取扱いの容易
なイオン打込み装置を提供することにある。
An object of the present invention is to solve the above problems and provide an ion implantation device that is easy to handle.

〔発明の概要〕[Summary of the invention]

上記の目的を達成するだめに、本発明の装置では、ビー
ム偏向磁石を省き、そのビーム偏向機能を質量分離器に
、掃引機能を円盤に受持だせるよう構成した。
In order to achieve the above object, the apparatus of the present invention is configured such that the beam deflection magnet is omitted and the beam deflection function is carried out by the mass separator, and the sweep function is carried out by the disk.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を実施例によって詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to Examples.

第2図は本発明のイオン打込み装置の要部構成図である
。図において前出のものと同一符号のものは同一または
均等部分を示すものとし、説明は適宜省略する。8は質
量分離スリット板で、複数のスIJ 7 +−8’、8
″が設けられている。質量分離したイオノビーム3は、
質量分離器2の磁石励磁電流の調整で所望のスリット8
“あるいは8′を通過するよう方向づけられる。即ち、
質量分離器2にビーノ、偏向磁石と同等な偏向機能を持
たせる。上記各スリットを通った後のイオンビーム6は
、各回転円盤6.6′に到達する。打込み中のイオンビ
ーム6は静止しており、掃引機能は」二記回転円盤66
′をビームに対し機械的に移動させることにより実現し
ている。従って打込み作業中の円盤6.6は、第2図に
矢印で示したように回転と共に円盤の半径方向に動き、
ウェハに均一なイオン打込みを行なうことができる。
FIG. 2 is a block diagram of the main parts of the ion implantation apparatus of the present invention. In the figures, the same reference numerals as those mentioned above indicate the same or equivalent parts, and the explanation will be omitted as appropriate. 8 is a mass separation slit plate, which has a plurality of slits IJ 7 +-8', 8
The mass-separated ion beam 3 is
A desired slit 8 is created by adjusting the magnet excitation current of the mass separator 2.
“Or oriented to pass through 8′, i.e.
The mass separator 2 is provided with a deflection function equivalent to that of a beano deflection magnet. The ion beam 6 after passing through each of the slits reaches each rotating disk 6.6'. The ion beam 6 during implantation is stationary, and the sweep function is performed by the rotating disk 66.
This is achieved by mechanically moving ′ with respect to the beam. Therefore, the disk 6.6 during the driving operation moves in the radial direction of the disk as it rotates, as shown by the arrow in FIG.
Uniform ion implantation can be performed on the wafer.

第5図は上記質量分離スリット板8の説明図である。第
2図に示した回転円盤乙の方を使う時はスリット8を、
回転円盤6の方を使う時はスリット8をイオンビーム3
が通る様にする。
FIG. 5 is an explanatory diagram of the mass separation slit plate 8. When using the rotating disk A shown in Figure 2, use the slit 8.
When using the rotating disk 6, connect the slit 8 to the ion beam 3.
Let it pass.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明のイオン打込み装置では、質
量分離スリット板に複数のスリットを設けることにより
、ビーム偏向磁石が不要となり、装置の簡略化ができる
ばかりでなく、イオンビームの偏向と掃引の制御を別々
に行なうことができるので、調整が簡単になり、かつイ
オン打込みの均一化が容易に実現できる。
As explained above, in the ion implantation device of the present invention, by providing a plurality of slits in the mass separation slit plate, a beam deflection magnet is not required, which not only simplifies the device, but also allows for easy deflection and sweeping of the ion beam. Since the controls can be performed separately, adjustments can be made easily and uniform ion implantation can be easily achieved.

なお、本発明の詳細な説明に当っては、拐込み室が2つ
の場合で説明したが、スリットの数を必要に応じ増やす
ことにより打込み室の増設が可能なことは言うまでもな
いことである。
In the detailed description of the present invention, the case where there are two slotting chambers has been explained, but it goes without saying that the number of slotting chambers can be increased by increasing the number of slits as necessary.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のイオン打込み装置の要部構成を示すもの
で、同図(a)は平面図、(1))は正面図である。 第2図は本発明のイオン打込み装置の要部構成図第6図
は本発明の装置に使用する質量分離スリット板の説明図
である。 1・・イオン源 2(2,2)・・・質量分離器(磁極)6・・イオンビ
ーム 4.8・・・質量分離スリット板 5(5′、5“)・・・ビーム偏向磁石(磁極)6.6
′・・回転円盤 7・・・ウェハ 8 、 8  ・・・ ス リ  ノ  ト代理人弁理
士  中村純之助 大 1 図
FIG. 1 shows the main structure of a conventional ion implantation device, in which (a) is a plan view and (1) is a front view. FIG. 2 is a block diagram of the main parts of the ion implantation apparatus of the present invention. FIG. 6 is an explanatory diagram of a mass separation slit plate used in the apparatus of the present invention. 1...Ion source 2 (2, 2)...Mass separator (magnetic pole) 6...Ion beam 4.8...Mass separation slit plate 5 (5', 5'')...Beam deflection magnet ( magnetic pole) 6.6
'...Rotating disk 7...Wafer 8, 8...Surinote Patent Attorney Junnosuke Dai Nakamura 1 Figure

Claims (1)

【特許請求の範囲】[Claims] イオン源と、上記イオン源から出たイオンビームのイオ
ン分離を行なう質量分離器及び質量分離スリット板と、
イオン打込みを行なう複数台の打込み室とを備えだイオ
ン打込み装置において、上記質量分離スリット板に複数
個のスリットを設け、上記質量分離器のビーム偏向機能
と上記複数のスリットを用いて所望の打込み室にイオン
ビームを指向させるよう構成したことを特徴とするイオ
ンビームみ装置。
an ion source, a mass separator and a mass separation slit plate that perform ion separation of the ion beam emitted from the ion source;
In an ion implantation apparatus equipped with a plurality of implantation chambers for performing ion implantation, a plurality of slits are provided in the mass separation slit plate, and a desired implantation is performed using the beam deflection function of the mass separator and the plurality of slits. An ion beam viewing device characterized by being configured to direct an ion beam into a chamber.
JP20747283A 1983-11-07 1983-11-07 Ion implanting device Pending JPS59108253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20747283A JPS59108253A (en) 1983-11-07 1983-11-07 Ion implanting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20747283A JPS59108253A (en) 1983-11-07 1983-11-07 Ion implanting device

Publications (1)

Publication Number Publication Date
JPS59108253A true JPS59108253A (en) 1984-06-22

Family

ID=16540321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20747283A Pending JPS59108253A (en) 1983-11-07 1983-11-07 Ion implanting device

Country Status (1)

Country Link
JP (1) JPS59108253A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103479A (en) * 2013-04-02 2014-10-15 无锡华润上华科技有限公司 Magnetic analyzer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319759A (en) * 1976-08-09 1978-02-23 Fujitsu Ltd Preparation of semiconductor device
JPS5478091A (en) * 1977-12-05 1979-06-21 Hitachi Ltd Ion implanting unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319759A (en) * 1976-08-09 1978-02-23 Fujitsu Ltd Preparation of semiconductor device
JPS5478091A (en) * 1977-12-05 1979-06-21 Hitachi Ltd Ion implanting unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103479A (en) * 2013-04-02 2014-10-15 无锡华润上华科技有限公司 Magnetic analyzer
CN104103479B (en) * 2013-04-02 2017-02-15 无锡华润上华科技有限公司 Magnetic analyzer

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