JPS59103443U - MOS semiconductor device storage box - Google Patents

MOS semiconductor device storage box

Info

Publication number
JPS59103443U
JPS59103443U JP19855282U JP19855282U JPS59103443U JP S59103443 U JPS59103443 U JP S59103443U JP 19855282 U JP19855282 U JP 19855282U JP 19855282 U JP19855282 U JP 19855282U JP S59103443 U JPS59103443 U JP S59103443U
Authority
JP
Japan
Prior art keywords
semiconductor device
storage box
device storage
mos semiconductor
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19855282U
Other languages
Japanese (ja)
Inventor
東 喜彦
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP19855282U priority Critical patent/JPS59103443U/en
Publication of JPS59103443U publication Critical patent/JPS59103443U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来のMO3半導体装置収納箱の概略構成図
、第2図は缶ケース型パワーMOSトランジスタの斜視
図、第3図は、その収納固定状態を示す要部断面図、第
4図及び第5図はこの考案の一実施例を示すMO3半導
体装置収納箱の一部切断を行った斜視図、及び収納状態
の断面図、第6図はその他の実施例を示す収納状態の収
納箱断面図である。 5.16・・・・・・MO8半導体装置(パワートラン
ジスタ)、6. 7. 17・・間外部導出リード、9
・・・・・・蓋体、13・・・・・・箱本体、11. 
11.−−−−・・。 14.14.・・・・・・導電性部材、12.12・・
開裂条体、15.15・・・・・・畝。 第1図 第2図
Fig. 1 is a schematic configuration diagram of a conventional MO3 semiconductor device storage box, Fig. 2 is a perspective view of a can case type power MOS transistor, Fig. 3 is a sectional view of main parts showing the storage and fixed state, Fig. 4 5 is a partially cutaway perspective view of an MO3 semiconductor device storage box showing one embodiment of this invention, and a cross-sectional view of the storage box in the storage state, and FIG. 6 is a storage box in the storage state showing another embodiment. FIG. 5.16...MO8 semiconductor device (power transistor), 6. 7. 17... Inter-external lead-out lead, 9
......Lid body, 13...Box body, 11.
11. ------... 14.14. ... Conductive member, 12.12...
Cleavage striae, 15.15... ridges. Figure 1 Figure 2

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] MO3半導体装置の外部導出リードを蓋体と箱本体とに
より挟材は固定して収納するとともに、前記蓋体並びに
箱本体の少くとも一方の外部導出リードとの当接箇所に
導電性部材を用いたことを特徴とするMO3半導体装置
収納箱。
The external leads of the MO3 semiconductor device are fixedly housed between the lid and the box body, and a conductive member is used at the contact point of at least one of the lid and the box body with the external leads. MO3 semiconductor device storage box.
JP19855282U 1982-12-28 1982-12-28 MOS semiconductor device storage box Pending JPS59103443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19855282U JPS59103443U (en) 1982-12-28 1982-12-28 MOS semiconductor device storage box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19855282U JPS59103443U (en) 1982-12-28 1982-12-28 MOS semiconductor device storage box

Publications (1)

Publication Number Publication Date
JPS59103443U true JPS59103443U (en) 1984-07-12

Family

ID=30424119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19855282U Pending JPS59103443U (en) 1982-12-28 1982-12-28 MOS semiconductor device storage box

Country Status (1)

Country Link
JP (1) JPS59103443U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009280210A (en) * 2008-05-19 2009-12-03 Nec Tokin Corp Packing material for layered piezoelectric actuator, packed object using the same, packing method, and method for manufacturing packed object
JP2009298446A (en) * 2008-06-13 2009-12-24 Daishinku Corp Storage container for optical device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009280210A (en) * 2008-05-19 2009-12-03 Nec Tokin Corp Packing material for layered piezoelectric actuator, packed object using the same, packing method, and method for manufacturing packed object
JP2009298446A (en) * 2008-06-13 2009-12-24 Daishinku Corp Storage container for optical device

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