JPS5899848U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5899848U
JPS5899848U JP19517581U JP19517581U JPS5899848U JP S5899848 U JPS5899848 U JP S5899848U JP 19517581 U JP19517581 U JP 19517581U JP 19517581 U JP19517581 U JP 19517581U JP S5899848 U JPS5899848 U JP S5899848U
Authority
JP
Japan
Prior art keywords
columnar part
electrode
electrode body
bodies
insulating tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19517581U
Other languages
Japanese (ja)
Inventor
波多腰 英文
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP19517581U priority Critical patent/JPS5899848U/en
Publication of JPS5899848U publication Critical patent/JPS5899848U/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による半導体装置の等価回路図、第2図
は従来の方式による第1図の回路の構成の一例を示す側
面図、第3図は本考案の一実施例の側面図、第4図は同
じく断面図、第5図はその使用状態を示す側面図である
。 3・・・端部電極体、4・・・中央電極体、5・・・ダ
イオード片、6・・・ガラス管体。
FIG. 1 is an equivalent circuit diagram of a semiconductor device according to the present invention, FIG. 2 is a side view showing an example of the configuration of the circuit of FIG. 1 according to a conventional method, and FIG. 3 is a side view of an embodiment of the present invention. FIG. 4 is a sectional view, and FIG. 5 is a side view showing the state in which it is used. 3... End electrode body, 4... Center electrode body, 5... Diode piece, 6... Glass tube body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一つの中央電極体と、二つの端部電極体と、それぞれ同
じ極性の電極が中央電極体に接触し他の電極が端部電極
体に接触する二つのグイオード半導体素体と、二つの電
極体間に跨がり前記素体を気密封止する絶縁管体とを備
え、各電極体は各々径大の柱状部で径小の柱状部とを同
軸的に一体に結合してならていて径小の柱状部の端面に
おいて半導体素体の電極に接触し、絶縁管体は内面が電
極体の径小の柱状部の側面に密着し、外径が電極体の径
大の柱状部の外径より大きくないことを特徴とする半導
体装置。
One center electrode body, two end electrode bodies, two guiode semiconductor bodies in which electrodes of the same polarity contact the center electrode body and other electrodes contact the end electrode bodies, and two electrode bodies. and an insulating tube body that spans between them and hermetically seals the element body, and each electrode body has a columnar part with a large diameter and a columnar part with a small diameter coaxially joined together. The end face of the columnar part of the insulating tube contacts the electrode of the semiconductor element, the inner surface of the insulating tube is in close contact with the side surface of the small diameter columnar part of the electrode body, and the outer diameter is larger than the outer diameter of the large diameter columnar part of the electrode body. A semiconductor device characterized by not being large.
JP19517581U 1981-12-26 1981-12-26 semiconductor equipment Pending JPS5899848U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19517581U JPS5899848U (en) 1981-12-26 1981-12-26 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19517581U JPS5899848U (en) 1981-12-26 1981-12-26 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5899848U true JPS5899848U (en) 1983-07-07

Family

ID=30108458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19517581U Pending JPS5899848U (en) 1981-12-26 1981-12-26 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5899848U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333040A (en) * 1976-09-09 1978-03-28 Nec Corp Delay circuit
JPS5333357B2 (en) * 1973-11-13 1978-09-13
JPS5636163B2 (en) * 1974-08-09 1981-08-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333357B2 (en) * 1973-11-13 1978-09-13
JPS5636163B2 (en) * 1974-08-09 1981-08-22
JPS5333040A (en) * 1976-09-09 1978-03-28 Nec Corp Delay circuit

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