JPS5899100A - Bonding type piezoelectric component and its manufacture - Google Patents
Bonding type piezoelectric component and its manufactureInfo
- Publication number
- JPS5899100A JPS5899100A JP56197952A JP19795281A JPS5899100A JP S5899100 A JPS5899100 A JP S5899100A JP 56197952 A JP56197952 A JP 56197952A JP 19795281 A JP19795281 A JP 19795281A JP S5899100 A JPS5899100 A JP S5899100A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- solder
- plate
- bonded
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
Abstract
Description
【発明の詳細な説明】
この発明は、接着型圧電部品とその製造方法に関し、特
にたとえば圧電ブザー、圧電発振子、圧電マイクロフォ
ン、圧電ろ波器、圧電センサおよび各種圧電共振子など
のように圧電板同士あるいは圧電板と金属とを接着した
構造を有し、かつ圧電板の屈曲振動を利用する接着型圧
電部品とそのＩ！造方法に閤する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an adhesive piezoelectric component and a method for manufacturing the same, and in particular to a piezoelectric component such as a piezoelectric buzzer, a piezoelectric oscillator, a piezoelectric microphone, a piezoelectric filter, a piezoelectric sensor, and various piezoelectric resonators. Adhesive piezoelectric components that have a structure in which plates are bonded together or piezoelectric plates and metal are bonded together, and utilize bending vibration of the piezoelectric plates, and their I! Depends on the manufacturing method.
従来は上述のような接着型圧電部品の接着手段としてエ
ポキシ系あるいは変性アクリレート系接着剤を用いてい
た。すなわち、接着すべき２つの物体（圧電板と圧電板
または圧電板と金属板）の間にエポキシ系あるいは変性
アクリレート系接着剤を、スクリーン印刷やはけ塗りな
どの方法によって塗布し、数十分〜数時間高部中に保持
し、加圧しながら接着剤を硬化させていた。Conventionally, epoxy or modified acrylate adhesives have been used as adhesive means for bonding type piezoelectric components as described above. That is, an epoxy or modified acrylate adhesive is applied between two objects to be bonded (piezoelectric plate and piezoelectric plate or piezoelectric plate and metal plate) by a method such as screen printing or brush painting, and then applied for several minutes. It was held in the upper part for ~ several hours to allow the adhesive to cure while applying pressure.
ところで、上述のように有機系接着剤を用いた場合、接
着型圧電部品の接着面一に抵抗および容量が発生し、そ
の値は接着剤の膜厚に左右される。By the way, when an organic adhesive is used as described above, resistance and capacitance are generated on the adhesive surface of the adhesive piezoelectric component, and the values thereof depend on the film thickness of the adhesive.
このような接着面（資）の抵抗および容量は製品の電気
的特性に影響を与えるため、従来は接着剤の塗布量や加
圧の大きさを微妙にコントロールして膜厚を予め決めら
れた一定の厚さにしなければならず、面一であった。し
かも、そのようなコントロールを行なっても所望の特性
を再現性よく得ることが１閣であった。また、接着を完
了した圧電部品をさらに切断にして小型の圧電部品を得
る場合には、接着面内での膜厚のばらつきが切出された
小型の圧電部品の特性のばらつきとなって現われ同爛と
なっていた。このような問題を解消するために銀などの
導電性物質を加えた接着剤を使用し、接着面一の導電性
を良好にすることが考えられる。The resistance and capacitance of such adhesive surfaces (materials) affect the electrical characteristics of the product, so conventionally the film thickness was determined in advance by delicately controlling the amount of adhesive applied and the amount of pressure applied. It had to be a certain thickness and flush. Moreover, even with such control, it was important to obtain desired characteristics with good reproducibility. In addition, when piezoelectric components that have been bonded are further cut to obtain smaller piezoelectric components, variations in film thickness within the bonded surface appear as variations in the characteristics of the cut out small piezoelectric components. It was a mess. In order to solve this problem, it is conceivable to use an adhesive containing a conductive substance such as silver to improve the conductivity of the adhesive surface.
しかし、このような接着剤を用いた場合、膜厚を銀の粒
子径以下にすることが不可能になり製品の―械的特性に
悪影響を与えること、接着強度が導電性物質を含まない
ものに比べて低いこと、接着剤が高価になることなど種
々の問題があった。However, when using such adhesives, it is impossible to reduce the film thickness to less than the silver particle size, which adversely affects the mechanical properties of the product. There were various problems, such as the price being low compared to that of the previous year, and the adhesive being expensive.
また、従来の製造方法は長時間のｉｌ！＆瀧保持管保持
とするため、作業効率や生産性の低下を招くという欠点
があった。また、その接着剤硬化のためのｍ度設定や濃
度管理が煩雑となっていた。さらに、接着時の加圧が長
時間にわたるため、接犠剤が好ましくない部位へ流れ込
んだり、しみ出しが起ることがあった。In addition, the conventional manufacturing method requires a long period of time! & Waterfall holding tubes are used, which has the disadvantage of reducing work efficiency and productivity. In addition, the temperature setting and concentration management for curing the adhesive are complicated. Furthermore, since the pressure applied during adhesion lasts for a long time, the sacrificial agent sometimes flows into undesirable areas or oozes out.
それゆえに、この発明の主たる目的は、上述のような種
々の欠点をすべて解消し得る接着型圧電部品とその製・
遊方法を提供することである。Therefore, the main object of the present invention is to provide an adhesive piezoelectric component and its manufacturing method that can eliminate all of the various drawbacks mentioned above.
The goal is to provide a way to play.
この発明は、要約すれば、表面に電極が形成された圧電
板同士あるいは表面に電極が形成された圧電板と金属板
とを接着するための接着剤としてはんだを用いたことで
ある。このような圧電部品は、圧電板とこの圧電板に貼
り合わせる圧電板または金属との接着面にペースト状は
んだを付着させ、そのペースト状はんだを溶かした慢冷
却することによって得られる。In summary, this invention uses solder as an adhesive for bonding piezoelectric plates each having electrodes formed on their surfaces or piezoelectric plates having electrodes formed on their surfaces and a metal plate. Such a piezoelectric component is obtained by attaching a paste solder to the bonding surface of a piezoelectric plate and a piezoelectric plate or metal to be bonded to the piezoelectric plate, and then melting the paste solder and cooling it rapidly.
この発明の上述の目的およびその他の目的と特徴は、図
面をを参照して行なう以下の詳細な説明から−１明らか
となろう。The above objects and other objects and features of the invention will become apparent from the following detailed description taken in conjunction with the drawings.
第１図はこの発明の一実施例の製造工程を示す図である
。なお、この第１図は３１１類の圧電部品を製造する工
程を示している。すなわち、１枚の圧電板と金属板とが
接着されてなるユニモルフ型圧電部品１０の製造工程と
、２枚の圧電板が接着されてなるバイモルフ型圧電部品
２０の製造工程と、１枚の金属板をはさんで２枚の圧電
板が接着されてなるバイモルフ型圧電部品３０の製造工
程とを示している。そして、第１図（ａ ）に示す積層
物１，２および３からは、それぞれ、第１図（０）に示
すユニモルフ型圧電部品１０．バイモルフ型圧電部品２
０およびバイモルフ型圧電部品３０が得られる。FIG. 1 is a diagram showing the manufacturing process of an embodiment of the present invention. In addition, this FIG. 1 shows the process of manufacturing a 311 type piezoelectric component. That is, a manufacturing process for a unimorph type piezoelectric component 10 in which one piezoelectric plate and a metal plate are bonded together, a manufacturing process for a bimorph type piezoelectric component 20 in which two piezoelectric plates are bonded together, and a process for manufacturing a bimorph type piezoelectric component 20 in which one piezoelectric plate and a metal plate are bonded together. The manufacturing process of a bimorph piezoelectric component 30 is shown in which two piezoelectric plates are glued together with a plate in between. From the laminates 1, 2, and 3 shown in FIG. 1(a), the unimorph type piezoelectric component 10 shown in FIG. 1(0) is obtained, respectively. Bimorph type piezoelectric component 2
0 and bimorph type piezoelectric component 30 are obtained.
まず、両面に金属電極が形成された圧電板１１（２１あ
るいは３１）が準備される。この準備された圧電板１１
（２１あるいは３１）の接着面にスクリーン印−あるい
ははけ塗りなどの方法によってペースト状はんだ１４（
２４あるいは３４）が塗布される０次に、ペースト状は
んだ１４（２４あるいは３４）が塗布された圧電板１１
（２１あるいは３１）に接着すべき金属板１２（圧電板
２３あるいは金属板３２）が準備される。この準備され
た金属板１２（圧電板２３あるいは金属板３２）は、予
め５０℃前後に加熱されるのが好ましい、これは、俊速
する加熱および加圧ステップの作業を速めるためである
０次に、圧電板１１（２１あるいは３１）と金属板１２
（圧電板２３あるいは金属板３２）とがペースト状はん
だ１４（２４あるいは３４）を介して重ねられ、第１図
（ａ ）で示すような積層物１（２あるいは３）が得ら
れる。First, a piezoelectric plate 11 (21 or 31) having metal electrodes formed on both sides is prepared. This prepared piezoelectric plate 11
Apply paste solder 14 (21 or 31) to the adhesive surface by applying a screen mark or brushing.
24 or 34) is applied. Next, the piezoelectric plate 11 is applied with paste solder 14 (24 or 34).
A metal plate 12 (piezoelectric plate 23 or metal plate 32) to be bonded to (21 or 31) is prepared. This prepared metal plate 12 (piezoelectric plate 23 or metal plate 32) is preferably heated to around 50°C in advance. This is to speed up the heating and pressing steps. , the piezoelectric plate 11 (21 or 31) and the metal plate 12
(piezoelectric plate 23 or metal plate 32) are stacked together with paste solder 14 (24 or 34) interposed therebetween, to obtain a laminate 1 (2 or 3) as shown in FIG. 1(a).
次に、積層物１（２あるいは３）はペースト状はんだの
通常の融点である１４０℃〜１８０℃より約３０℃高い
ビートプレート（図示せず）上に移され、加圧される。Next, the laminate 1 (2 or 3) is transferred onto a beat plate (not shown) that is approximately 30° C. higher than the normal melting point of paste solder, 140° C. to 180° C., and pressurized.
すなわち、このヒートプレート上で第１図（ｂ）に示す
ような加圧および加熱が行なわれる。このとき、ペース
ト状はんだは加熱によって博−される、加熱溶融された
はんだは従来のエポキシ系や変性アクリレート系などの
接着剤に比べて粘度が小さく流れが非常に良好である。That is, pressure and heating are performed on this heat plate as shown in FIG. 1(b). At this time, the paste solder is formed by heating, and the heated and melted solder has a lower viscosity than conventional epoxy adhesives or modified acrylate adhesives, and has a very good flowability.
そのため、圧電板１１（２１あるいは３１）と金属板１
２（圧電板２３あるいは金属板３２）とを加圧すればは
んだが接着面全面にすきまなく広がり、接着面全面を完
全に接着することができる。また、はんだは導電性が良
好なため、接着面一に抵抗がほとんど発生せずまた容量
をもつことがない、したがうて、従来のように接着剤の
膜厚と精度を厳しく管理する必要がなく、接着手段塗布
工程や加圧工程を容易にすることができる。Therefore, piezoelectric plate 11 (21 or 31) and metal plate 1
2 (piezoelectric plate 23 or metal plate 32), the solder spreads over the entire surface to be bonded without any gaps, and the entire surface to be bonded can be completely bonded. In addition, since solder has good conductivity, there is almost no resistance on the same bonded surface and no capacitance, so there is no need to strictly control the adhesive film thickness and accuracy as in the past. , the adhesive means application process and pressurizing process can be facilitated.
次に、ビートプレート上から積層物１（２あるいは３）
が離され、空冷によってはんだが固化される。はんだは
約１０秒間で固化し、接着が完了する。このように、接
着のための時間は従来に比べて著しく知糟される。なお
、第２図および第３図に示すように圧電板における接着
面の電極を圧電板あるいは接着すべき金属板の大きさよ
りも若干小さくすることによってはんだの流れ出しを防
止することができる。しかし、第２図および第３図に示
すように電極を形成せずに余分なはんだかにじみ出した
としても、そのにじみ出したはんだは他の部分に付着す
ることなく瞬間的に球状に固化し容易に取り除くことが
できる。Next, layer 1 (2 or 3) from above the beat plate.
is separated and the solder is solidified by air cooling. The solder solidifies in about 10 seconds, completing the bonding. In this way, the time required for adhesion is significantly reduced compared to the prior art. As shown in FIGS. 2 and 3, the solder can be prevented from flowing out by making the electrode on the bonding surface of the piezoelectric plate slightly smaller than the piezoelectric plate or the metal plate to be bonded. However, as shown in Figures 2 and 3, even if the excess solder oozes out without forming an electrode, the oozing solder instantly solidifies into a spherical shape without adhering to other parts and easily solidifies. can be removed.
上述のようにして接着が完了すると、第１図（０）に示
すようにユニモルフ型圧電部品１゜（バイモルフ型圧電
部品２０あるいは３０）が得られる。さらに、必要に応
じて切断され第１図（ｄ ）に示すように小型の圧電部
品が作られる。When the bonding is completed as described above, a unimorph piezoelectric component 1° (bimorph piezoelectric component 20 or 30) is obtained as shown in FIG. 1(0). Furthermore, it is cut as necessary to produce a small piezoelectric component as shown in FIG. 1(d).
なお、接着面の電極は導電性銀ペーストを焼き付けたも
のおよび各種のスパッタ、あるいは蒸着のいずれであっ
ても接着することが可能である。Note that the electrode on the bonding surface can be bonded by baking a conductive silver paste, by various sputtering methods, or by vapor deposition.
また、圧電板や金属板は円板、矩形板などその形状にか
かわらず接着することができる。さらに、接着面の電極
はエツチングなどによって任意の形状に加工されてもよ
くその形状に応じた接着ができる。Furthermore, piezoelectric plates and metal plates can be bonded regardless of their shape, such as a circular plate or a rectangular plate. Further, the electrode on the bonding surface may be processed into any shape by etching or the like, and adhesion can be made in accordance with that shape.
第４図はこの発明の一実施例の接着型圧電部品のインピ
ーダンス特性のばらつきと、従来の接着型圧電部品のイ
ンピーダンス特性のばらつきとを示すグラフである。な
お、横軸は周波数を示し、複輪はレベル変化を表わし１
目盛が１０ｄＢを示している。FIG. 4 is a graph showing variations in impedance characteristics of an adhesive type piezoelectric component according to an embodiment of the present invention and variations in impedance characteristics of a conventional adhesive type piezoelectric component. The horizontal axis shows the frequency, and the double wheels represent level changes.
The scale indicates 10 dB.
実験では、３０Ｘ２０■■！の両面に鍜電楊が蒸着され
た圧電板２枚を２組準備し、一方の組はエポキシ系接着
剤で接着し、他方の−はペースト状はんだで接着した。In the experiment, 30X20■■! Two sets of two piezoelectric plates each having a coating film deposited on both sides were prepared, one set was adhered with an epoxy adhesive, and the other - with paste solder.
なお、接着はいずれの組も７００ｇで加重し、エポキシ
系接着剤は１５０℃で１時−の硬化を行ない、ペースト
状はんだは１４３℃一点のものを使用した。そして、接
着の完了した２組の圧電部品を１５個の正方形板に切り
出し、それぞれの正方形板のインピーダンス特性のばら
つきを調べた。この実験では、レベル！ＬをＬ−２０１
ｏａ Ｒａ ／Ｒ１（ｄ Ｂ）で定義している。なお
、Ｒａは反共振抵抗であり、Ｒ１は共振抵抗である。For adhesion, a load of 700 g was applied to each set, the epoxy adhesive was cured for 1 hour at 150°C, and a single piece of paste solder was used at 143°C. Then, the two sets of piezoelectric components with completed adhesion were cut into 15 square plates, and variations in impedance characteristics of each square plate were examined. In this experiment, level! L to L-201
It is defined as oa Ra /R1(d B). Note that Ra is an anti-resonance resistance and R1 is a resonance resistance.
第４図において、白糠Ａはエポキシ系接着剤を用いた組
で最小のレベル変化を示した正方形バイモルフの圧電部
品の特性を示し、曲線Ｂはエポキシ系接着剤を用いた組
で最大のレベル変化を示した正方形バイモルフの圧電部
品の特性を示している。＊た、曲線Ｃはペースト状はん
だを用いた組で最小のレベル変化を示した正方形バイモ
ルフの圧電部品の特性を示し、曲線りはペースト状はん
だを用いた組で最大のレベル変化を示した正方形バイモ
ルフの圧電部品の特性を示している。この第４図から明
らかなように、エポキシ系接着剤を用いた場合にはレベ
ル差しの値が最小のもので２０ｄ Ｂ （曲線Ａ）、最
大のもので６０ｄＢ（曲線Ｂ）と格差が大きいのに対し
て、ペースト状はんだを使用した場合には最小のもので
６０ｄ Ｂ （曲線Ｃ）、最大のもので８５ｄ Ｂ （
曲線Ｄ）と格差が小さい、すなわち、ペースト状はんだ
を用いた場合には切り出された各圧電部晶面のＬの格差
が小さい。このことは、接着した圧電部品を切り出して
さらに小型の製品を作る場合、各製品間の特性のばらつ
きが小さいことを示している。またペースト状はんだを
用いた場合は各々の圧電部品におけるＬが全体的に大き
い。一般的に、圧電部品ではＬが大きいものを要求され
ることが多く、そのような要求に対し有利となる。たと
えばＬの値が大きいことを要求される発振子などにおい
て有利となる。そして、圧電ブザーやマイクロホンなど
では音圧や感度の改善および品質の均一化を図ることが
できる。In Figure 4, Shiranuka A shows the characteristics of a square bimorph piezoelectric component that showed the smallest level change in the set using epoxy adhesive, and curve B shows the maximum level change in the set using epoxy adhesive. The characteristics of a square bimorph piezoelectric component are shown. *Curve C shows the characteristics of a square bimorph piezoelectric component that showed the smallest level change in the group using paste solder, and the curve C shows the characteristics of a square bimorph piezoelectric component that showed the largest level change in the group using paste solder. It shows the characteristics of bimorph piezoelectric components. As is clear from Figure 4, when epoxy adhesive is used, the level difference is large, with a minimum level difference of 20 dB (curve A) and a maximum level difference of 60 dB (curve B). On the other hand, when paste solder is used, the minimum value is 60 dB (curve C) and the maximum value is 85 dB (
There is a small difference from curve D), that is, when paste solder is used, the difference in L between the crystal planes of each piezoelectric part cut out is small. This shows that when smaller products are made by cutting out bonded piezoelectric components, the variation in characteristics between each product is small. Furthermore, when paste solder is used, L in each piezoelectric component is generally large. Generally, piezoelectric components are often required to have a large L, and this is advantageous in meeting such requirements. For example, this is advantageous in an oscillator that requires a large value of L. In piezoelectric buzzers, microphones, etc., sound pressure and sensitivity can be improved and quality can be made uniform.
以上のように、この発明によれば、接着剤としてはんだ
を用いたので、従来に比べて接着時間を短縮することが
でき生産性を向上することができる。また、接着面間の
抵抗および容量を非常に小さくすることができるため、
特性のばらつきが小さい接着型圧電部品を得ることがで
きる。さらに、従来のような有機系接着剤の場合、熱や
有Ｉｌ溶剤によって接着強度が劣化することも多いとさ
れるが、この発明の接着方式においては、とりわけ耐溶
剤性において優れ、熱による影響もはんだ融点以下では
ｇ廟とならない。As described above, according to the present invention, since solder is used as the adhesive, the bonding time can be shortened compared to the conventional method, and productivity can be improved. In addition, the resistance and capacitance between the bonding surfaces can be made extremely small.
A bonded piezoelectric component with small variations in characteristics can be obtained. Furthermore, in the case of conventional organic adhesives, it is said that the adhesive strength often deteriorates due to heat or Il-containing solvents, but the adhesive method of the present invention has excellent solvent resistance and is less susceptible to heat effects. If the temperature is below the melting point of the solder, it will not become a melting point.
第１図はこの発明の一実施例の製造工程を示す図である
。第２図および第３図は好ましい電極形成状曝を示す図
である。第４図はこの発明の一実施例の接着型圧電部品
と従来の接着型圧電部品との特性のばらつきの差を実験
した結果を示すグラフである。
図において、１１，２１．３１は圧電板、１２゜３２は
金属板、１４，２４．３４はペースト状はんだを示す。FIG. 1 is a diagram showing the manufacturing process of an embodiment of the present invention. FIGS. 2 and 3 are diagrams showing preferred electrode formation patterns. FIG. 4 is a graph showing the results of an experiment to determine the difference in characteristic variations between the bonded piezoelectric component according to an embodiment of the present invention and the conventional bonded piezoelectric component. In the figure, 11, 21.31 are piezoelectric plates, 12.32 are metal plates, and 14, 24.34 are paste solder.
Claims (3)
面に電極が形成された圧電板と金属とを接着した構造で
あって、屈曲振動を利用する圧電部品において、接着剤
としてはんだを用いたことを特徴とする、接着型圧電部
品。(1) A piezoelectric component that uses bending vibration and has a structure in which piezoelectric plates with electrodes formed on their surfaces are bonded together or a piezoelectric plate with electrodes formed on their surfaces and a metal is bonded together using solder as an adhesive. An adhesive piezoelectric component characterized by:
ップ、 前記圧電板と貼り合わせる圧電板または金属を準備する
ステップ、 前記圧電板と貼り合わされるべき圧電板または金属との
接着面の少なくとも一方にペースト状はんだを付着させ
るステップ、 前記ペースト状はんだを漕がずステップ、および前記ペ
ースト状はんだを冷却するステップを含む、接着型圧電
部品の製造方法。(2) preparing a piezoelectric plate with electrodes formed on its surface; preparing a piezoelectric plate or metal to be bonded to the piezoelectric plate; and at least the bonding surface between the piezoelectric plate and the piezoelectric plate or metal to be bonded. A method of manufacturing an adhesive piezoelectric component, comprising the steps of: attaching paste solder to one side; not applying the paste solder; and cooling the paste solder.
電極が前記圧電板よりも小さい圧電板を準備するステッ
プを含む１．特許請求の範囲第２項記載の接着型圧電部
品の製造方法。(3) The step of preparing the piezoelectric plate includes the step of preparing a piezoelectric plate in which the electrode to be bonded is smaller than the piezoelectric plate. A method for manufacturing an adhesive piezoelectric component according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56197952A JPS5899100A (en) | 1981-12-08 | 1981-12-08 | Bonding type piezoelectric component and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56197952A JPS5899100A (en) | 1981-12-08 | 1981-12-08 | Bonding type piezoelectric component and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5899100A true JPS5899100A (en) | 1983-06-13 |
Family
ID=16383030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56197952A Pending JPS5899100A (en) | 1981-12-08 | 1981-12-08 | Bonding type piezoelectric component and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899100A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0265090A2 (en) * | 1986-10-22 | 1988-04-27 | The Singer Company | Method for making multisensor piezoelectric elements |
| US5189310A (en) * | 1989-12-05 | 1993-02-23 | Hewlett-Packard Company | BICMOS logic gate circuit and structures |
| JP2002204000A (en) * | 2001-01-05 | 2002-07-19 | Seiko Instruments Inc | Method of manufacturing piezoelectric-substance device and ultrasonic motor using the device |
-
1981
- 1981-12-08 JP JP56197952A patent/JPS5899100A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0265090A2 (en) * | 1986-10-22 | 1988-04-27 | The Singer Company | Method for making multisensor piezoelectric elements |
| US5189310A (en) * | 1989-12-05 | 1993-02-23 | Hewlett-Packard Company | BICMOS logic gate circuit and structures |
| JP2002204000A (en) * | 2001-01-05 | 2002-07-19 | Seiko Instruments Inc | Method of manufacturing piezoelectric-substance device and ultrasonic motor using the device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5899100A (en) | Bonding type piezoelectric component and its manufacture | |
| JPH04164310A (en) | Manufacture of chip type solid electrolytic capacitor | |
| CN111130482A (en) | Processing method of quartz crystal resonator electrode | |
| JP2001024460A (en) | Manufacture of piezoelectric diaphragm | |
| JPS59110217A (en) | Piezoelectric oscillating parts in chip shape and its manufacture | |
| JP2995550B2 (en) | Manufacturing method of crystal resonator element | |
| JPS6349991Y2 (en) | ||
| JPH04204224A (en) | Ceramic or quartz load cell | |
| JPS59128809A (en) | Production of elastic surface wave element | |
| JPS61236300A (en) | Manufacture of piezoelectric sounding body | |
| JPS59107414A (en) | Magnetic head | |
| JPS59880Y2 (en) | Vibrator for piezoelectric buzzer | |
| SU866781A1 (en) | Method of manufacturing piezoceramic transducers | |
| JPH08148965A (en) | Surface mounted type piezoelectric component | |
| JPH0362606A (en) | Manufacture of ultrasonic wave delay line | |
| JPS5853839Y2 (en) | piezoelectric sounding body | |
| JPS63196106A (en) | Manufacture of surface acoustic wave filter element | |
| JPS6091799A (en) | Composite piezoelectric laminating body | |
| JPH022212B2 (en) | ||
| JPH01193171A (en) | Adhesion method of wafer | |
| JPS58161520A (en) | Production of ultrasonic delay line | |
| JPS6133504B2 (en) | ||
| JPS61137211A (en) | Magnetic head | |
| JPH0565118U (en) | Chip type piezoelectric resonator | |
| JPH0314399B2 (en) |