JPS5897840U - bonding equipment - Google Patents

bonding equipment

Info

Publication number
JPS5897840U
JPS5897840U JP1981191746U JP19174681U JPS5897840U JP S5897840 U JPS5897840 U JP S5897840U JP 1981191746 U JP1981191746 U JP 1981191746U JP 19174681 U JP19174681 U JP 19174681U JP S5897840 U JPS5897840 U JP S5897840U
Authority
JP
Japan
Prior art keywords
wire
wedge
head
cutter
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981191746U
Other languages
Japanese (ja)
Inventor
秀明 三好
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1981191746U priority Critical patent/JPS5897840U/en
Publication of JPS5897840U publication Critical patent/JPS5897840U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はボンディング装置の構成。第２図はボンディン
グ作業の手順説明図。第３図は本考案におけるワイヤー
切断時の状態説明図。 １・・・ボンディングヘッド、２・・・超音波振動体、
３・・・ウェッジ、４・・・スプール、５・・・ワイヤ
ー、６・・・クランプ、７・・・カッター、８・・・被
ボンデイング体、９・・・回転ケーブル、１０・・・Ｘ
軸移動テーブル、１１・・・Ｙ軸移動テーブル。Figure 1 shows the configuration of the bonding device. FIG. 2 is an explanatory diagram of the procedure of bonding work. FIG. 3 is an explanatory diagram of the state when the wire is cut in the present invention. 1... Bonding head, 2... Ultrasonic vibrator,
3...Wedge, 4...Spool, 5...Wire, 6...Clamp, 7...Cutter, 8...Bonding object, 9...Rotating cable, 10...X
Axis moving table, 11...Y-axis moving table.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボンディングヘッドに装着され、先端部に斜めのワイヤ
ー貫通孔を設けた振動伝達用ウェッジを固定した超音波
振動体と、該ウェッジの外部前面に並んで配設されたカ
ッターと、該ウェッジと前記ボンディングヘッドの上部
に設けたワイヤースプール間の適所に設けたクランプと
、被ボンデイング体を回転せしめる回転テーブルと、Ｘ
及びＹ軸方向に移動せしめるＸ−Ｙ移動テーブルとから
なり、前記ウェッジ、カッター及びクランプの３者は前
記ホンディングヘッドの内部に収納された駆動機構によ
り上昇、下降されるように制御されており、シーケンス
制御のもとで位置決めされ、ボンディング作業が終った
あと、カッターによりワイヤーの切断部に傷が入れられ
、水平方向にワイヤーが引き離されるように構成されて
いることを特徴とする請ンデイング装置。an ultrasonic vibrator attached to a bonding head and fixed to a vibration transmitting wedge having a diagonal wire through hole at its tip; a cutter arranged in line on the external front surface of the wedge; and the wedge and the bonding member. A clamp installed at a suitable location between the wire spools installed at the top of the head, a rotating table for rotating the object to be bonded, and an X
and an X-Y moving table that moves in the Y-axis direction, and the wedge, cutter, and clamp are controlled to be raised and lowered by a drive mechanism housed inside the honding head. , a bending device characterized in that the wire is positioned under sequence control, and after the bonding work is completed, a cutter makes a cut in the cut portion of the wire, and the wire is pulled apart in a horizontal direction. .
JP1981191746U 1981-12-24 1981-12-24 bonding equipment Pending JPS5897840U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191746U JPS5897840U (en) 1981-12-24 1981-12-24 bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191746U JPS5897840U (en) 1981-12-24 1981-12-24 bonding equipment

Publications (1)

Publication Number Publication Date
JPS5897840U true JPS5897840U (en) 1983-07-02

Family

ID=30105193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191746U Pending JPS5897840U (en) 1981-12-24 1981-12-24 bonding equipment

Country Status (1)

Country Link
JP (1) JPS5897840U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100256A (en) * 1978-01-24 1979-08-07 Cho Onpa Kogyo Co Device for cutting wire
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100256A (en) * 1978-01-24 1979-08-07 Cho Onpa Kogyo Co Device for cutting wire
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method

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