JPS5897839U - ボンデイング装置におけるパツケ−ジ移送装置 - Google Patents

ボンデイング装置におけるパツケ−ジ移送装置

Info

Publication number
JPS5897839U
JPS5897839U JP1981191737U JP19173781U JPS5897839U JP S5897839 U JPS5897839 U JP S5897839U JP 1981191737 U JP1981191737 U JP 1981191737U JP 19173781 U JP19173781 U JP 19173781U JP S5897839 U JPS5897839 U JP S5897839U
Authority
JP
Japan
Prior art keywords
packages
package
mechanism section
transfer device
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981191737U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6339973Y2 (enrdf_load_stackoverflow
Inventor
秀明 三好
山崎　光格
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1981191737U priority Critical patent/JPS5897839U/ja
Publication of JPS5897839U publication Critical patent/JPS5897839U/ja
Application granted granted Critical
Publication of JPS6339973Y2 publication Critical patent/JPS6339973Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1981191737U 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置 Granted JPS5897839U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Publications (2)

Publication Number Publication Date
JPS5897839U true JPS5897839U (ja) 1983-07-02
JPS6339973Y2 JPS6339973Y2 (enrdf_load_stackoverflow) 1988-10-19

Family

ID=30105184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191737U Granted JPS5897839U (ja) 1981-12-24 1981-12-24 ボンデイング装置におけるパツケ−ジ移送装置

Country Status (1)

Country Link
JP (1) JPS5897839U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd ベ−ス付きリ−ドフレ−ムの搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd ベ−ス付きリ−ドフレ−ムの搬送方法

Also Published As

Publication number Publication date
JPS6339973Y2 (enrdf_load_stackoverflow) 1988-10-19

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