JPS589593B2 - Method for manufacturing printed circuit boards using fast-curing paint - Google Patents
Method for manufacturing printed circuit boards using fast-curing paintInfo
- Publication number
- JPS589593B2 JPS589593B2 JP54147376A JP14737679A JPS589593B2 JP S589593 B2 JPS589593 B2 JP S589593B2 JP 54147376 A JP54147376 A JP 54147376A JP 14737679 A JP14737679 A JP 14737679A JP S589593 B2 JPS589593 B2 JP S589593B2
- Authority
- JP
- Japan
- Prior art keywords
- curing
- fast
- printed circuit
- printed
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は、速硬化性塗料によるプリント回路板の製造方
法に係り、導電性または電気絶縁性粉体を配合した光硬
化性と熱硬化性を併せもつ合成樹脂塗料組成物を用いて
光と熱によりプリント回路板を低温、迅速に製造するも
のに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed circuit board using a fast-curing paint, and the present invention relates to a method of manufacturing a printed circuit board using a fast-curing paint. It relates to the rapid production of printed circuit boards at low temperatures using light and heat.
従来、プリント回路板は、導電体、抵抗体、絶縁体のそ
れぞれの粉末を含む塗料を基板に印刷し150°C〜2
00℃の高温で、5分〜30分間加熱し、塗膜を硬化し
固定させている。Conventionally, printed circuit boards are manufactured by printing paint containing powders of conductors, resistors, and insulators on the board at 150°C to 200°C.
The coating film is cured and fixed by heating at a high temperature of 00°C for 5 to 30 minutes.
しかしながら、この加熱により樹脂を硬化させる方法は
、比較的長時間を要して作業性が悪いとともに、導電体
として銅箔を用いるとこの銅箔はは高温に曝されるため
酸化し易く、また、基板の熱収縮による寸法精度の低下
、基板のそり、ねじれなどが生じ性能的にもいろいろの
問題点を有している。However, this method of curing the resin by heating requires a relatively long time and has poor workability, and when copper foil is used as a conductor, the copper foil is easily oxidized because it is exposed to high temperatures. There are various problems in terms of performance, such as a decrease in dimensional accuracy due to heat shrinkage of the substrate, and warping and twisting of the substrate.
一方、紫外線硬化樹脂は紫外線により数抄のうちに硬化
し、速硬化性を有し、作業性が良いとともに常温硬化す
るため性能の点でも良いが、銀、金、パラジウム、白釜
、銅粉、カーボンブラック、グラフアイトなどの導電体
あるいは抵抗体、絶縁体の電気素子用粉体を内含すると
、紫外線の透過性が著しく低下し、塗膜の深層部分では
末硬化のまま残って導電体、抵抗体などのそれぞれの素
子の所定の特性が出ないのみならず基板への密着性が不
充分である。On the other hand, UV-curable resins are cured within a few sheets by ultraviolet rays, have fast curing properties, are easy to work with, and have good performance as they cure at room temperature. , carbon black, graphite, or other conductive materials, resistive materials, or insulating powders for electrical elements, the transmittance of ultraviolet rays will be significantly reduced, and the deep portions of the coating will remain uncured and become conductive. Not only do the predetermined characteristics of each element such as a resistor or the like not appear, but also the adhesion to the substrate is insufficient.
このことは、多層配線回路を形成する際各層間に絶縁層
を形成するが、この絶縁層には着色のためあるいは塗料
の塗布特性を向上するため無機質顔料が添加されこの顔
料により紫外線の透過度が減少する場合にもおこること
である。This means that when forming a multilayer wiring circuit, an insulating layer is formed between each layer, but an inorganic pigment is added to this insulating layer for coloring or to improve the coating properties of the paint. This also happens when there is a decrease in
本発明はこのような点に鑑みなされたもので、絶縁基板
上に導電性または電気絶縁性粉体を配合した紫外線硬化
性かつ熱硬化性塗料組成物をもって導電体、抵抗体、絶
縁体回路を印刷形成することにより紫外線による速硬化
性の特色を維持するとともに塗膜の深層部分や粉体の配
合によって透光が邪魔された光硬化性の不足分を熱硬化
性で補い、全体として速硬化性、高性能のプリント回路
板を製造しようとするものである。The present invention was made in view of the above points, and it is possible to form conductors, resistors, and insulator circuits using an ultraviolet curable and thermosetting coating composition containing conductive or electrically insulating powder on an insulating substrate. Printing maintains the characteristic of fast curing by ultraviolet rays, and compensates for the lack of light curing caused by the deep layer of the coating film and powder formulation, which hinders light transmission, with thermosetting properties, resulting in a fast curing process as a whole. The aim is to manufacture printed circuit boards with high quality and high performance.
本発明に用いる塗料はラジカル架橋性プレポリマー、ビ
ニルモノマー、光重合性触媒、熱重合性触媒を有する組
成物に金、銀、パラジウム、白金等の貴金属粉、又は銅
粉、カーボンブラック、グラファイト粉等の導電体粉末
を加えて混練し、導電性塗料、抵抗体用塗料を形成し、
あるいは上記組成物に無機質粉体を加えて混練し、絶縁
体用塗料にする。The paint used in the present invention has a composition containing a radically crosslinkable prepolymer, a vinyl monomer, a photopolymerizable catalyst, a thermally polymerizable catalyst, and noble metal powder such as gold, silver, palladium, or platinum, or copper powder, carbon black, or graphite powder. and other conductive powders are added and kneaded to form conductive paints and resistor paints.
Alternatively, an inorganic powder is added to the above composition and kneaded to form a coating for insulators.
゛このようにして形成した塗料をフェノール樹
脂エポキシ樹脂、ポリエステル樹脂などの積層基板にシ
ルクスクリーン印刷により所望の電気回路に沿って印刷
し、紫外線を照射するとともに赤外線あるいは遠赤外線
などの熱線を照射する。゛The paint thus formed is printed along the desired electric circuit by silk screen printing on a laminated substrate made of phenolic resin epoxy resin, polyester resin, etc., and is irradiated with ultraviolet rays and heat rays such as infrared rays or far infrared rays. .
なお塗布とは印刷も含む。Note that coating also includes printing.
このようにすると、紫外線の照射により、光重合性触媒
によりプレポリマー、ビニルモノマーがラジカル反応し
て架橋するとともに、熱線により熱重合触媒が励起され
て向しくプレポリマー、とニルモノマーを架橋、硬化さ
せる。In this way, when irradiated with ultraviolet rays, the photopolymerizable catalyst causes a radical reaction between the prepolymer and the vinyl monomer to cause crosslinking, and the thermal polymerization catalyst is excited by the heat rays, thereby crosslinking and curing the prepolymer and the vinyl monomer. .
この際1塗膜の表面層では紫外線硬化が主に熱硬化が従
的に連行するが、塗膜の深層部の紫外線の透過しないと
ころは、熱硬化のみが進行する。At this time, in the surface layer of one coating film, ultraviolet curing is mainly accompanied by thermal curing, but in the deeper parts of the coating film, where ultraviolet rays do not pass, only thermal curing proceeds.
次に、本発明の実施例を説明する。Next, examples of the present invention will be described.
実施例 1
エポキシアクリレート感光性樹脂90重量%及びリン片
状銀粉65重量%からなる導電性塗料を紙フェノール基
板(日立化成MCL−437F)上に225メシシュの
テトロンスクリーンを用G・テスクリーン印刷し、入力
が120ワット/cIfLの高圧水銀ランプの3燈式紫
外線硬化装置により、コンベアスピード3.5m/分の
条件で2回通し60秒で硬化した。Example 1 A conductive paint consisting of 90% by weight of an epoxy acrylate photosensitive resin and 65% by weight of flaky silver powder was printed with a 225 mesh Tetron screen on a paper phenol substrate (Hitachi Chemical MCL-437F). It was cured in 60 seconds by passing twice at a conveyor speed of 3.5 m/min using a three-lamp ultraviolet curing device using a high-pressure mercury lamp with an input of 120 watts/cIfL.
その後さらに遠赤外線硬化炉を用いて1分間硬化した後
,この導電体の保護肱として絶縁性塗料を導体パターン
上にスクリーン印刷し、上記紫外線硬化装置によりコン
ベアスピード6m/分で硬化した。After further curing for 1 minute using a far-infrared curing oven, an insulating paint was screen printed on the conductor pattern as a protective layer for the conductor, and was cured using the above-mentioned ultraviolet curing device at a conveyor speed of 6 m/min.
この間3秒であった。この導電体の抵抗値はシート抵抗
(Rs)としてRs=74mΩ/口であった。This time was 3 seconds. The resistance value of this conductor was 74 mΩ/mouth in terms of sheet resistance (Rs).
又、この導電体を260℃の熔融はんだ中に10秒間浸
漬する耐熱試験において抵抗値の変化率は13.8%の
減少であった。Further, in a heat resistance test in which this conductor was immersed in molten solder at 260° C. for 10 seconds, the rate of change in resistance value decreased by 13.8%.
尚比較のために紫外線硬化装置のみによる硬化で遠赤外
線硬化を行なわなかったもののシート低抗(Rs)はR
s二8377LΩ/口と高く、又先の紫外線および遠赤
外線を照射したものと同様の耐熱試験における抵抗変化
率は21.7%の減少で先の本発明の場合より大きい変
化率を示した。For comparison, the sheet resistance (Rs) of a sheet cured using only an ultraviolet curing device without far infrared curing is R
The resistance change rate was as high as 28,377 LΩ/mouth, and the rate of change in resistance in the heat resistance test similar to the previous one in which ultraviolet rays and far infrared rays were irradiated was reduced by 21.7%, which was a larger rate of change than in the case of the present invention.
実施例 2
エポキシアクリレート感光性樹脂90重量%及びアセチ
レンブラック10重量%からなる抵抗体用塗料を紙フェ
ノール基板(日立化成製、MCL−437F)上に22
5メッシュのテトロンスクリーンを用いてスクリーン印
刷し、入力が120ワット/crrLの高圧水銀ランプ
の3燈式紫外線硬化装置により、コンベアスピード3m
/分の条件で2回通し、50秒で硬化した。Example 2 A resistor paint consisting of 90% by weight of epoxy acrylate photosensitive resin and 10% by weight of acetylene black was coated on a paper phenol substrate (MCL-437F, manufactured by Hitachi Chemical) for 22 hours.
Screen printing is performed using a 5-mesh Tetron screen, and the conveyor speed is 3 m using a 3-lamp ultraviolet curing device using a high-pressure mercury lamp with an input of 120 watts/crrL.
It was passed twice under the condition of /min and cured in 50 seconds.
その後さらに遠赤外線硬化炉を用いて1分間硬化した後
、この抵抗体の保護膜として紫外線硬化性絶縁性塗料を
抵抗パターン上にスクリーン印刷し、上記紫外線硬化装
置によりコンベアスピード6m/分で硬化した。After that, it was further cured for 1 minute using a far-infrared curing oven, and then an ultraviolet-curable insulating paint was screen printed on the resistor pattern as a protective film for the resistor, and cured using the above-mentioned ultraviolet curing device at a conveyor speed of 6 m/min. .
この硬化時間は3秒であった。The curing time was 3 seconds.
この時の抵抗体の抵抗値は、シート抵抗(Rs)は、R
s=4.3KΩ/口であった。The resistance value of the resistor at this time is the sheet resistance (Rs), which is R
s=4.3KΩ/mouth.
又、この抵抗体を260℃の熔融はんだ中に10秒間浸
漬する耐熱試験において抵抗変化率は4.3%の減少で
あった。Further, in a heat resistance test in which this resistor was immersed in molten solder at 260° C. for 10 seconds, the resistance change rate was reduced by 4.3%.
尚比較のために遠赤外線硬化を行なわなかったものの抵
抗(Rs)はRs=4.2KΩ/口であり、又、耐熱試
験における抵抗変化率は7.4%の減少で変化率は大き
いものであった。For comparison, the resistance (Rs) of the product that was not cured by far infrared rays was Rs = 4.2KΩ/mouth, and the rate of change in resistance in the heat resistance test was a decrease of 7.4%, which is a large rate of change. there were.
実施例 3
エポキシアクリレート感光性樹脂で構成された絶縁性塗
料を紙フェノール基板(日立化成製、MCL−437F
)上に下部電極用に銅箔を用い、この銅箔を150メッ
シュのテトロンスクリーンを介してスクリーン印刷し、
入力80ワット/crfLの高圧水銀ランプを用い、ラ
ンプと基板間の距離10cIfLに設定して3秒間紫外
線照射を行なった。Example 3 An insulating paint composed of an epoxy acrylate photosensitive resin was applied to a paper phenol substrate (manufactured by Hitachi Chemical, MCL-437F).
) A copper foil is used for the lower electrode on top, and this copper foil is screen printed through a 150 mesh Tetron screen,
Using a high-pressure mercury lamp with an input of 80 watts/crfL, the distance between the lamp and the substrate was set to 10 cIfL, and ultraviolet irradiation was performed for 3 seconds.
その後さらに赤外線硬化を6秒間行なう。Thereafter, infrared curing is further performed for 6 seconds.
そしてこの形成された絶縁硬化膜上に水銀粒を載せ、こ
の水銀を上部電極とし、高絶縁計を用いてこの絶縁膜の
絶縁抵抗を測定した。Then, mercury particles were placed on the formed cured insulating film, and the mercury was used as an upper electrode to measure the insulation resistance of the insulating film using a high-insulation meter.
この場合の絶縁抵抗値は3X1013Ωと極めて高い絶
縁性を示した。In this case, the insulation resistance value was 3×10 13 Ω, indicating extremely high insulation properties.
1 一方比較のために赤外線硬化を行なわない場合につ
いては5 X 10”Ωを示し、赤外線硬化により絶縁
膜特性が著しく向上していることが判った。1. On the other hand, for comparison, the case where infrared curing was not performed showed 5 x 10''Ω, indicating that the insulating film properties were significantly improved by infrared curing.
本発明によれば、導電性または電気絶縁性粉体を配合し
た紫外線硬化性かつ熱硬化性合成樹脂塗ν料組成物をも
って絶縁基板上に電気回路を印刷形成し、この基板上に
印刷された塗料組成物に紫外線を照射し、更に催少時間
熱を加えてこの塗料組成物を硬化させ電気回路を定着さ
せるため、塗料組成物は紫外線照射によって常温で迅速
に硬化され作業性が良好であるとともに、加熱による硬
化は補助的なもので僅少時間であるため、硬化のために
高温零囲気に長時間保持されることがないから、銅箔な
どの酸化や絶縁基板が熱収縮により渡形するなどのおそ
れがなく、製品の性能を向上させることが出来る。According to the present invention, an electric circuit is printed on an insulating substrate using an ultraviolet curable and thermosetting synthetic resin coating composition containing conductive or electrically insulating powder, and an electric circuit is printed on the substrate. The coating composition is irradiated with ultraviolet rays and then heat is applied for a short period of time to cure the coating composition and fix the electric circuit, so the coating composition is quickly cured at room temperature by ultraviolet irradiation and has good workability. At the same time, since curing by heating is an auxiliary process and takes only a short time, it is not held in a high-temperature, zero atmosphere for a long time for curing, so oxidation of copper foil and insulating substrates may occur due to heat shrinkage. There is no risk of such problems, and the performance of the product can be improved.
また、導電性または電気絶縁性粉体の配合によって紫外
線の照射のかげになる部分や塗膜の厚い部分で紫外線の
照射による硬化作用が不足する部分は、僅少時間の加熱
によって確実に硬化され、硬化が不充分な部分が残るこ
とがないから、配合された導電性または電気絶縁性粉体
よりなるプリント回路の導電体、抵抗体、絶縁体として
の電気的特性を充分に発揮させることが出来、また、基
板への密着性も確実となりプリント回路板を熔融ハンダ
に浸したときの耐熱性を向上させることも出来る。In addition, areas that are shaded by ultraviolet rays due to the combination of conductive or electrically insulating powders or areas where the hardening effect of ultraviolet rays is insufficient due to thick coatings can be reliably cured by heating for a short time. Since no parts are left with insufficient powder, the electrical properties of the printed circuit as a conductor, resistor, or insulator made of the blended conductive or electrically insulating powder can be fully demonstrated. In addition, adhesion to the board is ensured, and heat resistance when the printed circuit board is immersed in molten solder can be improved.
Claims (1)
性かつ熱硬化性合成樹脂塗料組成物をもって絶縁基板上
に電気回路を印刷形成し、この基板上に印刷された塗料
組成物に紫外線を照射し更に僅少時間熱を加えてこの塗
料組成物を硬化させ電気回路を定着させることを特徴と
する速硬化性塗料によるプリント回路板の製造方法。1. An electric circuit is printed on an insulating substrate using an ultraviolet curable and thermosetting synthetic resin coating composition containing conductive or electrically insulating powder, and the coating composition printed on this substrate is irradiated with ultraviolet rays. A method for producing a printed circuit board using a fast-curing paint, which further comprises applying heat for a short period of time to cure the paint composition and fix an electric circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54147376A JPS589593B2 (en) | 1979-11-14 | 1979-11-14 | Method for manufacturing printed circuit boards using fast-curing paint |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54147376A JPS589593B2 (en) | 1979-11-14 | 1979-11-14 | Method for manufacturing printed circuit boards using fast-curing paint |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5670689A JPS5670689A (en) | 1981-06-12 |
JPS589593B2 true JPS589593B2 (en) | 1983-02-22 |
Family
ID=15428828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54147376A Expired JPS589593B2 (en) | 1979-11-14 | 1979-11-14 | Method for manufacturing printed circuit boards using fast-curing paint |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS589593B2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54770A (en) * | 1977-06-03 | 1979-01-06 | Asahi Chemical Ind | Method of making print circuit board |
-
1979
- 1979-11-14 JP JP54147376A patent/JPS589593B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54770A (en) * | 1977-06-03 | 1979-01-06 | Asahi Chemical Ind | Method of making print circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS5670689A (en) | 1981-06-12 |
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