JPS5893568A - Spot welding method for contact - Google Patents
Spot welding method for contactInfo
- Publication number
- JPS5893568A JPS5893568A JP19315381A JP19315381A JPS5893568A JP S5893568 A JPS5893568 A JP S5893568A JP 19315381 A JP19315381 A JP 19315381A JP 19315381 A JP19315381 A JP 19315381A JP S5893568 A JPS5893568 A JP S5893568A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- head
- terminal plate
- spot welding
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/10—Spot welding; Stitch welding
- B23K11/11—Spot welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
【発明の詳細な説明】
(利用分野)
本発明は接点材料として白金、金、銀等の貴金属材を使
用しこれをスポット溶接した接点のスポット溶接方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Application) The present invention relates to a method of spot welding contacts using precious metals such as platinum, gold, silver, etc. as contact materials and spot welding them.
(従来技術の問題点)
一般的に、接点の表面を傷付けずしてスポット溶接する
ことが望ましい。(Problems with the Prior Art) Generally, it is desirable to perform spot welding without damaging the surface of the contact.
そこで接点を小さいチップ状の貴金属部と、広い面積の
通電部とに二分して接合し、広い通電部の両肩部にスポ
ット用の電極を当て′て溶接するものが開発された。Therefore, a method was developed in which the contact is divided into two parts: a small chip-shaped precious metal part and a large current-carrying part, and the two parts are joined together, and spot electrodes are applied to both shoulders of the wide current-carrying part for welding.
ところで、この上記のものであると、電極が両肩部を押
すため周辺のみが溶接され、中心部の接触が不充分とな
って、接点からの熱が端子板に速やかに伝わらず、熱放
散が悪いのである。By the way, in the above case, the electrode presses on both shoulders, so only the periphery is welded, and the contact at the center is insufficient, and the heat from the contact is not quickly transferred to the terminal plate, resulting in poor heat dissipation. That's the fault.
(目 的)
本発明は上記の点に鑑みてなシたものであって、即ちス
ポット溶接の電極が貴金属チップに当らず、且つこのチ
ップの合板となる金属板の下面が全面に亘って端子板に
溶融合金を介して溶着するようにしたものであって、こ
れによりその貴金属部は傷付す、而も熱放散も良好とな
ることを目的としたものである。(Objective) The present invention has been made in view of the above points, namely, the spot welding electrode does not touch the noble metal chip, and the lower surface of the metal plate that is the plywood of this chip is entirely covered with terminals. It is designed to be welded to a plate via a molten alloy, so that the noble metal part will not be damaged, and the purpose is to improve heat dissipation.
(実施例)
以下本発明を一実施例として掲げた図面に基ずいて説明
すると、第1図は電気的抵抗値J小さく、且つ融点が低
い例えば白金、金、銀等の材料にて作られた貴金属製チ
ップ1と、このチップ1より電気的抵抗値が大きく、且
つ融点が高い例えば綱、鋼ニッケル合金等にて作られ、
而もこのチップ1より広い面積となっているヘッド2と
を成型する過程を示している。即ち、帯状の貴金属製チ
ップ素材Xを帯状ヘッド素材Yの中央上面に冷間接合し
、これを適当な長さに切断してなす、従って、この切断
によって形成されたチップlの左右となるヘッド2の両
肩部2aは露見することとなる。また上記過程において
一ヘッド素材Yの下面に形成されている凹部3には銀ろ
う、錫等の溶融合金素材2が同様に冷間接合して嵌合さ
れている。(Example) The present invention will be explained based on the drawings as an example. Fig. 1 shows a material made of a material having a small electric resistance value J and a low melting point, such as platinum, gold, silver, etc. A chip 1 made of noble metal and a material having a higher electrical resistance than the chip 1 and a higher melting point, such as steel, nickel alloy, etc.,
Moreover, the process of molding the head 2, which has a wider area than the chip 1, is shown. That is, a band-shaped noble metal chip material Both shoulder portions 2a of No. 2 will be exposed. Further, in the above process, a molten alloy material 2 such as silver solder or tin is similarly cold-bonded and fitted into the recess 3 formed on the lower surface of one head material Y.
この第1図より切断された後、第2図(イ)に示す如く
端子板5の上面に溶融合金4を載せる。この時金属製へ
ラド2の下面と端子板5の上面との間には空間Tが介在
している。After cutting as shown in FIG. 1, the molten alloy 4 is placed on the upper surface of the terminal plate 5 as shown in FIG. 2(A). At this time, a space T exists between the lower surface of the metal spatula 2 and the upper surface of the terminal plate 5.
従って、次の露見している両肩部2aにスポット溶接の
電極Sを当てると、矢印の如く電流が流れる。即ち、金
属製ヘッド2の両肩部2aから溶融合金4を経て端子板
5にと至り、両肩部2aから直接に端子板5にとは至ら
ないのであり、且つ溶融合金4が金属製ヘッド2より電
気的抵抗値が小さく、且つ融点が低いのでこの溶融合金
4が溶融する。これが(ロ)に示す。Therefore, when the spot welding electrode S is applied to the exposed shoulders 2a, a current flows as shown by the arrow. That is, the molten alloy 4 reaches the terminal plate 5 from both shoulders 2a of the metal head 2, and does not directly reach the terminal plate 5 from the shoulders 2a. This molten alloy 4 is melted because it has a lower electrical resistance value and a lower melting point than 2. This is shown in (b).
最終的には第3図となり、空間Tが狭くなってその間に
溶融した溶融合金4が充満するのである。Finally, as shown in FIG. 3, the space T becomes narrower and is filled with the molten alloy 4.
従って、貴金属製チップ1にはスポット溶接の電極Sが
当らず、傷付くことはない。Therefore, the spot welding electrode S does not hit the noble metal tip 1, so that it will not be damaged.
(効 果)
本発明は上記の如く金属製ヘッドの上面に電気的抵抗値
が小さく、且つ融点が低い貴金属製チップ1を固着し、
この金属製ヘッド2の下面に溶融合金4を突出して嵌合
装着し、端子板5にこの溶融合金4を載せて金属製ヘッ
ド2の両肩部2aにスポット溶接の電極Sを当てたから
、スポット溶接の電極Sにて貴金属製チップ1が傷付か
ず、且つ貴金属製チップlの中央に電極Sが当らないこ
とにようで生じる中央部の浮き上がりはその溶融合金4
の溶融によって阻止出来゛、もって熱放散への支障tな
い等の効果がある。(Effects) As described above, the present invention fixes the noble metal chip 1 having a small electrical resistance value and a low melting point on the top surface of a metal head,
The molten alloy 4 was fitted and protruded from the lower surface of the metal head 2, and the molten alloy 4 was placed on the terminal plate 5, and spot welding electrodes S were applied to both shoulders 2a of the metal head 2. The lifting of the center part due to the fact that the noble metal tip 1 is not damaged by the welding electrode S and the electrode S does not hit the center of the noble metal tip L is due to the molten alloy 4.
This can be prevented by the melting of the metal, which has the effect that there is no hindrance to heat dissipation.
図面は本発明の一実施例を示し、第1Illは各素材の
成型過程図、第2図(イ)、(ロ)は溶接過程の図、第
3図は完成品の図である。
l・・・貴金属製チップ、2・・・金属製ヘッド、2a
・・・両肩部、3・・・凹部、4・・・溶融合金、5・
・・端子板。
特許出願人
松下電工株式会社
代理人弁理士
竹元敏九゛(ほか2名)
5−
第1!II
X
(イ)
第3図
5The drawings show one embodiment of the present invention, and FIG. 1I is a diagram of the molding process of each material, FIGS. 2A and 2B are diagrams of the welding process, and FIG. 3 is a diagram of the finished product. l...Precious metal chip, 2...Metal head, 2a
... both shoulders, 3 ... recess, 4 ... molten alloy, 5.
・Terminal board. Patent applicant Matsushita Electric Works Co., Ltd. Patent attorney Toshikuro Takemoto (and 2 others) 5- 1st! II X (a) Figure 3 5
Claims (1)
を該チップより電気的抵抗値が大きく、且つ融点が高く
、而も広い面積の金属製ヘッドの中央上面に固着し、こ
の金属製ヘッドの下面に形成された凹部に銀ろう、錫等
の溶融合金をその下面より突出させて装着し、端子板の
面にこの突出した溶融合金を載せると共に、前記金属製
ヘッドを該端子板と空間をおいて対画し、この状態にて
チップの左右となやヘッドの両肩部にスポット溶接の電
極を当てて、電流を両肩部からヘッド及び溶融合金を経
て端子板にと至らせると共に、溶融合金の溶融にてその
ヘッドと端子板との空間が狭ままって更に両肩部から直
接に端子板にと分流し、ヘッドと端子板との間にその溶
融した溶融合金が充満することを特徴とした接点のスポ
ット溶接方法。A noble metal chip with a low electrical resistance value and a low melting point is fixed to the central upper surface of a metal head with a larger electrical resistance value and a higher melting point than the chip, and which has a wider area. A molten alloy such as silver solder or tin is installed in a recess formed on the lower surface so as to protrude from the lower surface, and the protruding molten alloy is placed on the surface of the terminal plate, and the metal head is placed between the terminal plate and the space. In this state, spot welding electrodes are applied to the left and right sides of the chip and both shoulders of the head and the current is applied from both shoulders through the head and molten alloy to the terminal plate. Due to the melting of the molten alloy, the space between the head and the terminal plate is narrowed, and the molten alloy flows directly from both shoulders to the terminal plate, filling the space between the head and the terminal plate. A contact spot welding method featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19315381A JPS5893568A (en) | 1981-11-30 | 1981-11-30 | Spot welding method for contact |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19315381A JPS5893568A (en) | 1981-11-30 | 1981-11-30 | Spot welding method for contact |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5893568A true JPS5893568A (en) | 1983-06-03 |
Family
ID=16303158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19315381A Pending JPS5893568A (en) | 1981-11-30 | 1981-11-30 | Spot welding method for contact |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5893568A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60250518A (en) * | 1984-05-12 | 1985-12-11 | ヴエー・ツエー・ヘレウス・ゲゼルシヤフト・ミツト・ベシユレンクター・ハフツング | Method of automatically resistance welding electric contact plate piece on carrier band and semiproduct for contact |
-
1981
- 1981-11-30 JP JP19315381A patent/JPS5893568A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60250518A (en) * | 1984-05-12 | 1985-12-11 | ヴエー・ツエー・ヘレウス・ゲゼルシヤフト・ミツト・ベシユレンクター・ハフツング | Method of automatically resistance welding electric contact plate piece on carrier band and semiproduct for contact |
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