JPS589325A - Self-rotational wafer dryer - Google Patents

Self-rotational wafer dryer

Info

Publication number
JPS589325A
JPS589325A JP10650481A JP10650481A JPS589325A JP S589325 A JPS589325 A JP S589325A JP 10650481 A JP10650481 A JP 10650481A JP 10650481 A JP10650481 A JP 10650481A JP S589325 A JPS589325 A JP S589325A
Authority
JP
Japan
Prior art keywords
rotor
wafers
gas
rotating
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10650481A
Other languages
Japanese (ja)
Inventor
Katsuya Okumura
勝弥 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10650481A priority Critical patent/JPS589325A/en
Publication of JPS589325A publication Critical patent/JPS589325A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Abstract

PURPOSE:To dry up completely and protect a surface from dust, by tightening a wafer edge to a cut at an opposite position of rotational wing on a rotor having a side plate which is divided in two and free to open and close, containing in a hollow of outer tube, and flowing in and out gas for the wing. CONSTITUTION:A partitioner 7 of a rotor 3 is opened at a hinge 9. A designated number of wafers 10 are supported at a cut 8a of a rotational wing 3, and the partitioner 7 is closed. The rotor 3 is placed within a hollow 2 of outer tube 1 and sucked from a hole 5. Gas flows from a hole 4, comes to the rotational wing 3, rotates the rotor 3, and flows out 5. Therefore, the wafers are rapidly and completely dried up by the centrifugal force and gas flow. The rotor 3 and outer tube are easily cleaned up. The wafers are free from dust. A dummy wafer is made unnecessary. The wafers can be dried up efficiently.

Description

【発明の詳細な説明】 本実明祉、自己回転式ウェハ乾燥機に関する。[Detailed description of the invention] The present invention relates to a self-rotating wafer dryer.

一般に半導体装置の製造工程中には、つ、ハの乾燥工程
が非常に多くの頻度で設けられている。このウェハの乾
燥工程紘、半導体装置の微細化に伴って特に重要視され
ている。
Generally, during the manufacturing process of semiconductor devices, drying steps (3) and (3) are performed very frequently. This wafer drying process has become particularly important as semiconductor devices become smaller.

その理由は、乾燥工程でfiがつ、凸表面に付着した〕
、乾燥が不充分だったシすると乾燥徒に薄膜を形成させ
た時に、薄膜の膜質が劣化して歩*bを大きく低下させ
るしh−4=番4ことが判明したからである。
The reason for this is that during the drying process, fi particles adhered to the convex surface.]
This is because it was found that if the drying was insufficient, the quality of the thin film would deteriorate when the dryer was used to form a thin film, resulting in a significant decrease in the thickness (h-4).

しかしながら、従来01)、へ乾燥機は、多数枚のウェ
ハを収納し九カセ、トの複数個を回転容器内に回転軸に
対して放射状の位置に配置し、この回転容器を所定の速
度で回転させてウェハ型になりている。このため装置の
構造が複雑になシ、乾燥処理の際に破損したクエへの屑
を回転容器から容易にしかも完全に#去することができ
ない、また、回転容器の内壁面に付着した水分を完全に
除去できないため、内部の湿度が高くなる。その結果、
つ、ハが十分に乾燥しなかったシ、回転容器内から発生
したfiがつ。
However, the conventional dryer (01) stores a large number of wafers and arranges a plurality of nine wafers in a rotating container at radial positions with respect to the rotating shaft, and the rotating container is rotated at a predetermined speed. It is rotated into a wafer shape. For this reason, the structure of the device is complicated, and it is not possible to easily and completely remove the debris from the damaged cubes during the drying process from the rotating container. Since it cannot be completely removed, internal humidity increases. the result,
(c) The material was not dried sufficiently; and (c) the fi was generated from inside the rotating container.

凸表面に付着・固着してしまうという欠点があうた。t
た、カセットは偏心状態で回転するため、回転容器の収
容量Oカセットが準備できない場合には、回転のバラン
スを得るために〆建−の力竜、トを回転容器に収容しな
ければならず、極めて作業性が悪い欠点がありた。
The drawback is that it adheres and sticks to convex surfaces. t
In addition, since the cassette rotates eccentrically, if a cassette with a capacity of 0 for the rotating container cannot be prepared, the cassette must be stored in the rotating container in order to balance the rotation. However, it had the disadvantage of extremely poor workability.

本発明は、かかる点K1mみてなされたもので、つ、八
を完全に乾燥してかつf々O発生が壕りたくない自己回
転式つ、ハ乾燥機を提供するものである。
The present invention has been made in view of this point K1m, and provides a self-rotating dryer that completely dries the dryer and prevents the generation of oxygen.

以下、本発明の実施例について説明する。Examples of the present invention will be described below.

第1図は、本発明の一実施例の斜視図であゐ・図中1は
中央部に湾曲部を有して湾曲部Kllすれた中空部2内
に後述する回転ロータ1を収納し九外筒である。外筒1
の周側面の対向する領域は、その長手方向に沿って開口
されておル、開口縁部に長手方向に沿りてガスガイド板
Ja。
FIG. 1 is a perspective view of one embodiment of the present invention. In the figure, 1 has a curved part in the center, and a rotating rotor 1, which will be described later, is housed in a hollow part 2 that is just past the curved part. It is an outer cylinder. Outer cylinder 1
Opposing regions of the circumferential side surfaces of Ja are open along the longitudinal direction, and a gas guide plate Ja is formed along the longitudinal direction at the opening edge.

1kが立設されて、ガス流入口4及びガス流出口5が形
成されている。f2流出口ttas図示しない吸引機構
に接続されてお〉、ガス流入口4かも流入したガスを中
空部2を経て排気するようになりている。tた、外筒1
の相対向する側部には、回転p−夕1を回転自在に支持
する側壁板(図示せず)が設けられている。
1k is erected, and a gas inlet 4 and a gas outlet 5 are formed. The f2 outlet (ttas) is connected to a suction mechanism (not shown), and the gas inlet (4) also exhausts the gas that has flowed in through the hollow section (2). t, outer cylinder 1
Side wall plates (not shown) that rotatably support the rotary plate 1 are provided on opposing sides of the rotary plate 1.

外筒10周壁面には、中空部2内を所定温度に保つヒー
タ6が埋設されている。外筒1はステンレス等の金属で
形成されている。
A heater 6 is embedded in the peripheral wall of the outer cylinder 10 to maintain the inside of the hollow portion 2 at a predetermined temperature. The outer cylinder 1 is made of metal such as stainless steel.

外筒1の中空部2内に収納された回転p−タati、第
2図に示す如く、相対向して設けた二側側板1間に、二
側側板1の中心よυ放射状に配置するようにして複数本
の回転翼8を架設し、対向する回転翼8の所定位置に対
応してウニへ周縁部固定用の切欠きl&をその長手方向
に沿って複数個形成したものである。二側側板rは、略
半円形の2枚の分割板7a、Fitで形成されてsp 
如、分割板7a、7bの突合わせ部の1端部に設けられ
た蝶番9によって開閉可能に突合わされている6回転ロ
ータ1には、回転翼8に形成された切欠き81Lに周縁
部を嵌入するようにしてウェハ10が保持されている0
分割板1aの一方には、外筒1の側壁板に保持される回
転軸11が央出されている0回転ロータlのm質は、テ
フ四ン、ステンレス、アル建ニウム等の軽量で耐食性に
優れたものであれば如何なるものでも良い。
As shown in FIG. 2, the rotating parts 1 housed in the hollow part 2 of the outer cylinder 1 are arranged radially υ from the center of the two side plates 1 between the two opposite side plates 1. In this way, a plurality of rotary blades 8 are installed, and a plurality of notches l& for fixing the peripheral edge of the sea urchin are formed along the longitudinal direction of the sea urchin corresponding to predetermined positions of the opposing rotary blades 8. The second side plate r is formed by two approximately semicircular dividing plates 7a and Fit.
The six-rotation rotor 1, which is abutted openably and closably by a hinge 9 provided at one end of the abutting portion of the dividing plates 7a and 7b, has a peripheral edge in a notch 81L formed in the rotor blade 8. The wafer 10 is held in such a way that it fits in.
The rotating shaft 11 held by the side wall plate of the outer cylinder 1 is centrally protruded from one side of the dividing plate 1a.The material of the 0-rotation rotor l is made of lightweight and corrosion-resistant materials such as Teflon, stainless steel, and aluminum. Any material may be used as long as it has excellent properties.

このように構成された自己回転式ウェハ乾燥機によれば
、回転ロータ30分割板F a s r kを蝶番9を
中心に開き、回転翼Iの切欠1ira部で所定枚数のク
エA1#を保持するように分割板Fa、Ft+を閉じ丸
後、とのウェハ1#を収納した回転闘−タIを外筒Jの
中空部2内に設置する0次いで、外筒1のガス流出口I
K接続された吸引機構によ〉、中空部2′内を減圧状態
にすゐ、中空部2内が減圧状態に1にるとダメ流入口4
から中空部オを経てガス流出口5にガスが流れ込む、こ
のガスは、回転ロータIの回転翼8に衝突してガス流出
口IK流出するOで、中空部2内の回転ロータ1を回転
させると共に、回転ロータ1を貫通してガス流出口lか
ら流出する。
According to the self-rotating wafer dryer configured in this way, the rotating rotor 30-divided plate Fas r k is opened around the hinge 9, and a predetermined number of wafers A1# is held in the notch 1ira of the rotor I. After closing the dividing plates Fa and Ft+ as shown in FIG.
The suction mechanism connected to K causes the inside of the hollow part 2' to be in a reduced pressure state.If the inside of the hollow part 2 reaches a reduced pressure state, the inlet 4
Gas flows into the gas outlet 5 through the hollow part O. This gas collides with the rotor blades 8 of the rotating rotor I and flows out of the gas outlet IK, causing the rotating rotor 1 in the hollow part 2 to rotate. At the same time, the gas passes through the rotating rotor 1 and flows out from the gas outlet l.

その結果、回転ロー11に保持されたウェハ1#は、回
転目−−Jの遠心力と、回転關−メ1内を貫通するガス
によりて極めて連中かに、かつ完全に乾燥されゐ。
As a result, the wafer 1# held on the rotary row 11 is dried extremely smoothly and completely by the centrifugal force of the rotary row J and the gas penetrating the rotary mechanism 1.

また、長期間O使用によりて乾燥処理の際にウェハ10
が破損しても、回転曹−タJは、ガスが貫通す為構造K
fiりてお)、シかも、回転ロータ1を収納する外筒1
0構造も極めて簡単表構造Kl&うているので、ウェハ
10の破損屑が回転ロータJ中外筒1内に付着するのを
防止することができる。を九、ウェハ1#は、回転ロー
タIK収納される量を一単位にして回転ロータ1どとに
乾燥処理を施すことができるので、〆電−のウェハ等を
準備すみ必要が表<、極めて効率的にウェハ100乾燥
処理を施すことがでVllゐ。
In addition, due to long-term use of O, the wafer 10
Even if it is damaged, the structure K will remain intact because the gas will pass through the rotating solutor J.
outer cylinder 1 that houses the rotating rotor 1
Since the 0 structure also has an extremely simple front structure Kl&, it is possible to prevent damaged debris from the wafer 10 from adhering to the inside of the inner and outer cylinder 1 of the rotating rotor J. 9. Wafer 1 # can be dried by treating the amount stored in the rotor IK as one unit, so it is extremely necessary to prepare the wafers etc. It is possible to efficiently dry 100 wafers.

以上説明した如く、本実1IIK係る自己回転式ウェハ
乾燥機によれに、高い作業性0下にウェハを完全に乾燥
してそ01111iKftを付着させることも1にい等
顕著な効果を有するものである。
As explained above, using the self-rotating wafer dryer according to the present invention, the ability to completely dry the wafer and adhere the 01111iKft to the wafer with high workability has a remarkable effect. be.

【図面の簡単な説明】[Brief explanation of the drawing]

籐1図は、本実−の一実施例の斜視図、菖2図は、同実
施例にて使用されている回転−一タの斜視図である。 1−・外筒、ト・中空部、J・一回転ロータ、4−・ガ
ス流入口、5−fメ流出口、6−にニー/、1−二割儒
板、ト・・回転翼、1a−切欠き、−出願人代理人  
弁理士 鈴 江 武 彦第1図
Fig. 1 is a perspective view of one embodiment of the present invention, and Fig. 2 is a perspective view of a rotary unit used in the same embodiment. 1-・Outer tube, G・Hollow part, J・One-rotation rotor, 4-・Gas inlet, 5-F outlet, 6-Knee/, 1-20% Confucian plate, G・Rotor blade, 1a - notch, - applicant's agent
Patent Attorney Takehiko Suzue Figure 1

Claims (1)

【特許請求の範囲】[Claims] 開閉自在に衝合された二側側板を所定間隔を設妙て対設
し、該二側側板間に各々の二側側板の中心から放射状の
配置で架設された複数本の回転翼と、相対向する回転翼
の対向する位置に形成されたクエへ周縁部固定用の切欠
きとからなる回転ロータと゛、該回転ロータを収納する
中空部を有し、かつ、前記回転翼に対向してガス流入口
及びガス流出口を有する外筒とを^偏することを特徴と
する自己回転式ウェハ乾燥機。
Two side plates facing each other so as to be openable and closable are arranged opposite each other at a predetermined interval, and a plurality of rotor blades are installed between the two side plates in a radial arrangement from the center of each of the two side plates. A rotating rotor consisting of a notch for fixing the peripheral edge of the rotary blade formed at an opposing position of the rotary blade, and a hollow portion for accommodating the rotating rotor, and a gas A self-rotating wafer dryer characterized by an outer cylinder having an inlet and a gas outlet.
JP10650481A 1981-07-08 1981-07-08 Self-rotational wafer dryer Pending JPS589325A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10650481A JPS589325A (en) 1981-07-08 1981-07-08 Self-rotational wafer dryer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10650481A JPS589325A (en) 1981-07-08 1981-07-08 Self-rotational wafer dryer

Publications (1)

Publication Number Publication Date
JPS589325A true JPS589325A (en) 1983-01-19

Family

ID=14435254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10650481A Pending JPS589325A (en) 1981-07-08 1981-07-08 Self-rotational wafer dryer

Country Status (1)

Country Link
JP (1) JPS589325A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064436A (en) * 1983-09-19 1985-04-13 Fujitsu Ltd Spin drier
JPH0196327A (en) * 1987-10-08 1989-04-14 Daido Steel Co Ltd Fluidized bed furnace for metal heat-treatment
JPH01255227A (en) * 1988-04-04 1989-10-12 Dainippon Screen Mfg Co Ltd Rotary surface-treating apparatus for wafer
JPH06112186A (en) * 1992-09-25 1994-04-22 Dainippon Screen Mfg Co Ltd Horizontal shaft rotating type substrate dryer
US5339539A (en) * 1992-04-16 1994-08-23 Tokyo Electron Limited Spindrier
US5435075A (en) * 1992-04-07 1995-07-25 Tokyo Electron Limited Spindrier
US7226514B2 (en) * 1999-04-08 2007-06-05 Applied Materials, Inc. Spin-rinse-dryer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064436A (en) * 1983-09-19 1985-04-13 Fujitsu Ltd Spin drier
JPH0196327A (en) * 1987-10-08 1989-04-14 Daido Steel Co Ltd Fluidized bed furnace for metal heat-treatment
JPH01255227A (en) * 1988-04-04 1989-10-12 Dainippon Screen Mfg Co Ltd Rotary surface-treating apparatus for wafer
US5435075A (en) * 1992-04-07 1995-07-25 Tokyo Electron Limited Spindrier
US5339539A (en) * 1992-04-16 1994-08-23 Tokyo Electron Limited Spindrier
JPH06112186A (en) * 1992-09-25 1994-04-22 Dainippon Screen Mfg Co Ltd Horizontal shaft rotating type substrate dryer
US7226514B2 (en) * 1999-04-08 2007-06-05 Applied Materials, Inc. Spin-rinse-dryer

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