JPS5890000U - electronic equipment - Google Patents
electronic equipmentInfo
- Publication number
- JPS5890000U JPS5890000U JP18448281U JP18448281U JPS5890000U JP S5890000 U JPS5890000 U JP S5890000U JP 18448281 U JP18448281 U JP 18448281U JP 18448281 U JP18448281 U JP 18448281U JP S5890000 U JPS5890000 U JP S5890000U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- housing
- pipe
- heat
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の電子装置の構成を示す斜視図、第2図は
この考案の一実施例の構成を示す斜視図である。
図において、1は電子部品、2は熱放出面、3は筐体、
5は冷却管である。なお、各図中同一符号は同一または
相当部分を示すものとする。FIG. 1 is a perspective view showing the structure of a conventional electronic device, and FIG. 2 is a perspective view showing the structure of an embodiment of this invention. In the figure, 1 is an electronic component, 2 is a heat release surface, 3 is a housing,
5 is a cooling pipe. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
り外部に放出する電子部品、この電子部品を収容し、上
記電子部品の外周を包囲する筐体、この筐体の内部を貫
通して設けられ、その管内に冷媒の流通路が形成され、
その管の外面の一部が上記電子部品の熱放出面と接触す
るように取付けられ冷却管を備え、上記電子部品が発生
した熱を上記冷却管の中を流れる冷媒に伝導して上記筐
体の外部に放出する電子装置。An electronic component that emits heat generated inside the electronic component to the outside from its heat-emitting surface when an electric current is passed through it, a housing that houses this electronic component and surrounds the outer periphery of the electronic component, and a housing that penetrates the inside of this housing. A refrigerant flow path is formed in the pipe,
A cooling pipe is installed so that a part of the outer surface of the pipe comes into contact with the heat emitting surface of the electronic component, and the heat generated by the electronic component is transferred to the refrigerant flowing in the cooling pipe to cool the casing. electronic devices that emit to the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18448281U JPS5890000U (en) | 1981-12-10 | 1981-12-10 | electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18448281U JPS5890000U (en) | 1981-12-10 | 1981-12-10 | electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5890000U true JPS5890000U (en) | 1983-06-17 |
Family
ID=29984676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18448281U Pending JPS5890000U (en) | 1981-12-10 | 1981-12-10 | electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5890000U (en) |
-
1981
- 1981-12-10 JP JP18448281U patent/JPS5890000U/en active Pending
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