JPS588992U - Mounting structure of electronic equipment - Google Patents
Mounting structure of electronic equipmentInfo
- Publication number
- JPS588992U JPS588992U JP10256181U JP10256181U JPS588992U JP S588992 U JPS588992 U JP S588992U JP 10256181 U JP10256181 U JP 10256181U JP 10256181 U JP10256181 U JP 10256181U JP S588992 U JPS588992 U JP S588992U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- electronic equipment
- printed wiring
- packages
- wiring boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例におけるパターン密度を示す特性図、第
2図は本考案の実施例を示す斜視図、第3図は従来例に
おけるプリント配線板のプリント配線を示すパターン図
、第4図は従来例におけるプリント配線板のパターン密
度を示す特性図、第5図は本考案の実施例におけるプリ
ント配線を示すパターン図、第6図は本考案の実施例に
おけるプリント配線板のパターン密度を示す特性図であ
る。
10.20・・・・・・プリント配線板、101〜1O
N、201〜2ON・・・・・・パッケージ、30゜4
0・・・・・・ケーブル。Fig. 1 is a characteristic diagram showing the pattern density in the conventional example, Fig. 2 is a perspective view showing the embodiment of the present invention, Fig. 3 is a pattern diagram showing the printed wiring of the printed wiring board in the conventional example, and Fig. 4 is A characteristic diagram showing the pattern density of the printed wiring board in the conventional example, FIG. 5 is a pattern diagram showing the printed wiring in the embodiment of the present invention, and FIG. 6 is a characteristic diagram showing the pattern density of the printed wiring board in the embodiment of the present invention. It is a diagram. 10.20...Printed wiring board, 101-1O
N, 201~2ON・・・Package, 30゜4
0...Cable.
Claims (1)
を複数枚実装する2枚のプリント配線板と、該プリント
配線板両端を相互に接続する2組゛ のケーブルと
を有し、前記パッケージ間の信号線を前記プリント配線
板と前記ケーブルとにより接続することを特徴とする電
子機器の実装構造。It has a plurality of packages equipped with electronic circuits, two printed wiring boards on which the plurality of packages are mounted, and two sets of cables interconnecting both ends of the printed wiring boards, and a signal between the packages is provided. A mounting structure for an electronic device, characterized in that a wire is connected by the printed wiring board and the cable.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10256181U JPS588992U (en) | 1981-07-10 | 1981-07-10 | Mounting structure of electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10256181U JPS588992U (en) | 1981-07-10 | 1981-07-10 | Mounting structure of electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS588992U true JPS588992U (en) | 1983-01-20 |
Family
ID=29897205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10256181U Pending JPS588992U (en) | 1981-07-10 | 1981-07-10 | Mounting structure of electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS588992U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51104567A (en) * | 1975-03-11 | 1976-09-16 | Mitsubishi Electric Corp | Keisankiniokeru purintokaadotoritsukeho |
JPS5292361A (en) * | 1976-01-29 | 1977-08-03 | Tokyo Shibaura Electric Co | Method of mounting substrates |
JPS5467674A (en) * | 1977-11-09 | 1979-05-31 | Oki Electric Ind Co Ltd | Electronic device |
-
1981
- 1981-07-10 JP JP10256181U patent/JPS588992U/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51104567A (en) * | 1975-03-11 | 1976-09-16 | Mitsubishi Electric Corp | Keisankiniokeru purintokaadotoritsukeho |
JPS5292361A (en) * | 1976-01-29 | 1977-08-03 | Tokyo Shibaura Electric Co | Method of mounting substrates |
JPS5467674A (en) * | 1977-11-09 | 1979-05-31 | Oki Electric Ind Co Ltd | Electronic device |
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