JPS5885494U - solder material - Google Patents
solder materialInfo
- Publication number
- JPS5885494U JPS5885494U JP17818881U JP17818881U JPS5885494U JP S5885494 U JPS5885494 U JP S5885494U JP 17818881 U JP17818881 U JP 17818881U JP 17818881 U JP17818881 U JP 17818881U JP S5885494 U JPS5885494 U JP S5885494U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder material
- metal surfaces
- width
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来技術による半田付された半導体素子を示す
断面図、第２図ａ並びに第２図すは本考案の半田材の実
施例の側面図並びに平面図、第３図は本考案の半田材を
用いた半導体素子の実施例の断面図である。
尚、図に於て、１・・・・・・半導体基体、２・・・・
・・従来の半田溶着、３・・・・・・ステム、４・・・
・・・半田材、５・・・・・・半田材より高融点で半田
厚さより薄い素材、である。FIG. 1 is a sectional view showing a soldered semiconductor element according to the prior art, FIGS. 1 is a cross-sectional view of an example of a semiconductor element using solder material. In the figure, 1...semiconductor substrate, 2...
・・・Conventional solder welding, 3...Stem, 4...
...Solder material, 5...A material that has a higher melting point than the solder material and is thinner than the solder thickness.
Claims (1)
る半田材に於て、前記両金属面に溶着した前記半田材が
所定の厚さとなる−よう、前記半田材に略該厚さを有し
、所定の半田幅並びに半田長さにほぼ等しい帯状の素材
が設けられていることを特徴とする半田材。In a solder material that is inserted between two metal surfaces facing each other to fix the two metal surfaces, the solder material is placed at approximately the same thickness so that the solder material welded to both metal surfaces has a predetermined thickness. 1. A soldering material characterized by being provided with a band-shaped material having a solder width and approximately equal to a predetermined solder width and solder length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17818881U JPS5885494U (en) | 1981-11-30 | 1981-11-30 | solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17818881U JPS5885494U (en) | 1981-11-30 | 1981-11-30 | solder material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5885494U true JPS5885494U (en) | 1983-06-09 |
Family
ID=29972757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17818881U Pending JPS5885494U (en) | 1981-11-30 | 1981-11-30 | solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885494U (en) |
-
1981
- 1981-11-30 JP JP17818881U patent/JPS5885494U/en active Pending
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