JPS5883145U - Sample heating mechanism - Google Patents

Sample heating mechanism

Info

Publication number
JPS5883145U
JPS5883145U JP17933281U JP17933281U JPS5883145U JP S5883145 U JPS5883145 U JP S5883145U JP 17933281 U JP17933281 U JP 17933281U JP 17933281 U JP17933281 U JP 17933281U JP S5883145 U JPS5883145 U JP S5883145U
Authority
JP
Japan
Prior art keywords
heating mechanism
sample heating
sample
abstract
cloner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17933281U
Other languages
Japanese (ja)
Inventor
渡辺　「巌」
Original Assignee
日本電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電子株式会社 filed Critical 日本電子株式会社
Priority to JP17933281U priority Critical patent/JPS5883145U/en
Publication of JPS5883145U publication Critical patent/JPS5883145U/en
Pending legal-status Critical Current

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Landscapes

  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示した試料の加熱機構、第
２図はその一部詳細図である。 １：基台、２：電熱線、３：絶縁性プレート、４：加熱
用電源、５：金属板、６：絶縁被膜、７：試料、８：高
電圧源。FIG. 1 is a sample heating mechanism showing an embodiment of the present invention, and FIG. 2 is a partially detailed view thereof. 1: Base, 2: Heating wire, 3: Insulating plate, 4: Heating power source, 5: Metal plate, 6: Insulating coating, 7: Sample, 8: High voltage source.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 試料の下に絶縁材を介して電熱材と、前記試料とクロー
ンカにより引き合う電極材とを配置した試料加熱機構。A sample heating mechanism in which an electric heating material is placed below the sample via an insulating material, and an electrode material that is attracted to the sample by a cloner.
JP17933281U 1981-12-01 1981-12-01 Sample heating mechanism Pending JPS5883145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17933281U JPS5883145U (en) 1981-12-01 1981-12-01 Sample heating mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17933281U JPS5883145U (en) 1981-12-01 1981-12-01 Sample heating mechanism

Publications (1)

Publication Number Publication Date
JPS5883145U true JPS5883145U (en) 1983-06-06

Family

ID=29974931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17933281U Pending JPS5883145U (en) 1981-12-01 1981-12-01 Sample heating mechanism

Country Status (1)

Country Link
JP (1) JPS5883145U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993509A (en) * 1973-11-07 1976-11-23 U.S. Philips Corporation Semiconductor device manufacture
JPS5483373A (en) * 1977-12-16 1979-07-03 Fujitsu Ltd Heating-up method of semiconductor substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993509A (en) * 1973-11-07 1976-11-23 U.S. Philips Corporation Semiconductor device manufacture
JPS5483373A (en) * 1977-12-16 1979-07-03 Fujitsu Ltd Heating-up method of semiconductor substrate

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