JPS5881586A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS5881586A
JPS5881586A JP56179049A JP17904981A JPS5881586A JP S5881586 A JPS5881586 A JP S5881586A JP 56179049 A JP56179049 A JP 56179049A JP 17904981 A JP17904981 A JP 17904981A JP S5881586 A JPS5881586 A JP S5881586A
Authority
JP
Japan
Prior art keywords
laser
laser beam
welding
couple
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56179049A
Other languages
Japanese (ja)
Inventor
Atsuro Itagaki
板垣 孜郎
Kazuo Nakayama
和雄 中山
Masaaki Kikuchi
菊池 正晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56179049A priority Critical patent/JPS5881586A/en
Publication of JPS5881586A publication Critical patent/JPS5881586A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To apply sound welding despite the presance of minor gaps in the fayed surfaces of the work by oscillating a member provided over the optical path for laser light thereby moving the irradiating end of the laser light zigzag. CONSTITUTION:An electromagnet 18 is excited with an exciting coil 18a to generate magnetic lines phi of force indicated by broken lines between electrodes. When electric current I is conducted in an arrow direction to conductive springs 16a, 16b installed so as to cross the magnetic lines phi of force, the couple P acts upon the springs 16a, 16b respectively in the arrow direction. The couple is proportional to the current I and the angels phi of displacements of the springs 16a, 16b by the couple P are proportional to the couple P. Therefore the reflected light 2a of laser light 2 displaces accurately to the reflected light 2a shown by the broken lines in proportion to the current I. Thereupon, when the current I is changed periodically with an oscillator 20, the laser light 2 can be oscillated in follow up to said change.

Description

【発明の詳細な説明】 発明の技術分野 本発明はレーザ光を集光して被加工物に照射し溶接加工
をするレーザ加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a laser processing apparatus for welding a workpiece by condensing laser light and irradiating it onto a workpiece.

発明の技術的背景 周知のようにレーザ光は極めて指向性が良く、かつ大き
なエネルギー密度を有するために、レーザガス切断、溶
接等の加工熱源として用いられている。レーザ発振装置
から出たレーザ光は反射鏡や集光レンズ等を用いて被加
工物を照射する。第1図はかかるレーザ加工装置であっ
て、レーザ発振装w(1)から出たレーザ光(2)は反
射鏡(3)、上下方向に移動可能な反射鏡(4)、この
反射鏡(4)に対し水平方向に移動可能な反射鏡(5)
によって光路が変更され、集光レンズ(6)によシ集光
さ扛被加工物(7)に照射される。このとき反射鏡(3
)、(4)、(5)や集光レンズ(6)はレーザ光(2
)の通過するに必要な穴を設けた保護ケース(8)、(
9)、00)、α1)にそ扛ぞf収納されている。また
レーザ光路A−)B、C→D、E−+F。
TECHNICAL BACKGROUND OF THE INVENTION As is well known, laser light has extremely good directionality and high energy density, so it is used as a heat source for processing such as laser gas cutting and welding. Laser light emitted from a laser oscillation device irradiates a workpiece using a reflecting mirror, a condensing lens, or the like. FIG. 1 shows such a laser processing device, in which a laser beam (2) emitted from a laser oscillation device w (1) is transmitted to a reflecting mirror (3), a vertically movable reflecting mirror (4), and this reflecting mirror ( Reflector (5) movable horizontally relative to 4)
The optical path is changed by , and the light is focused by a condenser lens (6) and irradiated onto the workpiece (7). At this time, the reflecting mirror (3
), (4), (5) and the condenser lens (6) are laser beams (2
), a protective case (8) with holes necessary for the passage of (
9), 00), and α1). Also, the laser optical path A-)B, C→D, E-+F.

G−+Hにおいて軸方向に移動しない部分は金属製のパ
イプQ3、移動する部分は金属製のエラスチックコーン
やテレスコピックパイプ側、α(イ)、(15+で作業
者や周囲の物体を保護している。
In G-+H, the part that does not move in the axial direction is the metal pipe Q3, and the part that moves is the metal elastic cone or telescopic pipe side, α (A), (15+) to protect the worker and surrounding objects. .

このようなレーザ加工装置を用いてレーザ光の有する高
密度エネルギーによって金属を溶融し溶接加工を行なう
のがレーザ溶接でおる。レーザ溶接はレーザ光を直径0
.5動程度に集束して照射するので、エネルギー密度が
極めて高く、溶接部における熱影響範囲が小さく熱変形
は殆ど伴なわないため高精度で外観上もすぐれた溶接が
できることしかしながらレーザ光を極度に集中して照射
するため、被加工物(7)の接合面(7a)にギャップ
かある場合にはレーザ光の一部が加工面を通過してしま
い、融合不良等を生じて正常な接合が行なわれない場合
がある。したがって、レーザ溶接においか ては高精度A;縦継手得られるという利点を有する半面
に、被加工物に対して高精度の仕上を要求するという弱
点が同居しており、技術的にも価格的にも適用が妨げら
れることが少なくない欠点があった。
Laser welding is a process in which metal is melted and welded using the high-density energy of laser light using such a laser processing device. Laser welding uses a laser beam with a diameter of 0.
.. Since the irradiation is focused in about 5 motions, the energy density is extremely high, the area of heat influence in the welding area is small, and there is almost no thermal deformation, making it possible to weld with high precision and an excellent appearance. Since the irradiation is concentrated, if there is a gap in the joint surface (7a) of the workpiece (7), a part of the laser beam will pass through the work surface, causing poor fusion and preventing normal joining. It may not be done. Therefore, while laser welding has the advantage of being able to obtain high-precision vertical joints, it also has the disadvantage of requiring a high-precision finish on the workpiece, and is technically and cost-effective. However, there were many drawbacks that often hindered its application.

発明の目的 本発明は上記欠点に鑑みなされたもので、被加工物の接
合面に多少のギャップが存在しても融合不良等の欠陥を
生じることなく健全な溶接を行なえるようにしたレーザ
加工装置を提供することを目的とする。
Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks, and is a laser processing method that allows sound welding to be performed without causing defects such as poor fusion even if there are some gaps on the joint surfaces of workpieces. The purpose is to provide equipment.

発明の概要 すなわち、本発明はレーザ光路の中間にある反射*、!
、るいは集光レンズに微少な振動を与えてレーザ光の照
射端を溶接線の直角方向に振りながらジグザグに進める
ことによって、被加工物の接合面に存在するギアツブを
無視して溶接することができるようにしたものである。
SUMMARY OF THE INVENTION Namely, the present invention utilizes reflections in the middle of the laser optical path.
Or, by giving a slight vibration to the condensing lens and moving the irradiated end of the laser beam in a zigzag direction while swinging it in a direction perpendicular to the welding line, welding is performed while ignoring the gear lug that exists on the joint surface of the workpiece. It was made so that it could be done.

発明の実施例 以下本発明を図面に示す一実施例について説明する。第
2図および第3図はレーザ光の光路にある反射鏡(5)
を取付ける反射装置である。反射鏡(5)の上下端にそ
れぞれ導電ばね(16a) 、(16b)を係合し、導
電ばね(16a)、(16b)の両端を両側の固定台α
ηに固定し、導電ばね(16a)、(16b)を直角方
向にはさんで電極を対向する電磁石Qalが設置されて
いる。さらに導電ばね(16a)、(16b)の一端は
導電線(Inを介して発振器(2(lに接続し、他端は
導電線(19a)で接続している。電磁石(1印は励磁
コイル(18a)によって電極間に常に破線で示す磁力
線φを発生している。
Embodiment of the Invention An embodiment of the present invention will be described below as shown in the drawings. Figures 2 and 3 show the reflector (5) in the optical path of the laser beam.
It is a reflective device that attaches to the Conductive springs (16a) and (16b) are respectively engaged with the upper and lower ends of the reflector (5), and both ends of the conductive springs (16a) and (16b) are connected to the fixed bases α on both sides.
An electromagnet Qal is fixed at η and has electrodes facing each other with conductive springs (16a) and (16b) sandwiched therebetween at right angles. Furthermore, one end of the conductive springs (16a) and (16b) is connected to the oscillator (2 (l) via a conductive wire (In), and the other end is connected to the oscillator (2 (l) via a conductive wire (19a). (18a) always generates lines of magnetic force φ shown by broken lines between the electrodes.

次に作用を説明する。導電ばね(16a) 、(16b
)は磁力線φを横切るように設置しであるから、導電ば
ね(16a) 、(16b)に矢印の方向に電流Iが流
れると、導電ばね(16a) 、(16b)にはそれぞ
れ矢印の方向に偶力Pが作用する。この偶力Pは電流I
に比例し、偶力Pによる変位角θは導電ばね(16a)
、(x6b)のばね定数によって偶力Pに比例する。こ
のだめレーザ光(2)の反射光(2a)は電流工に比例
して破線で示す反射光(2b)へ正確に変位する。そこ
で発振器(2[)によって電流■を周期的に変位させれ
ばレーザ光(2)をそれに追従させて振動させることか
できる。なおレーザ光そのものは磁場の影響を受けない
のでレーザ光の進路が不安定となることはない。
Next, the effect will be explained. Conductive springs (16a), (16b
) are installed to cross the lines of magnetic force φ, so when the current I flows in the direction of the arrow in the conductive springs (16a) and (16b), the conductive springs (16a) and (16b) flow in the direction of the arrow, respectively. Couple P acts. This couple P is the current I
The displacement angle θ due to the force couple P is proportional to the conductive spring (16a)
, (x6b) is proportional to the force couple P. The reflected light (2a) of this useless laser light (2) is accurately displaced to reflected light (2b) shown by a broken line in proportion to the electric current. Therefore, if the current (2) is periodically varied by the oscillator (2[), the laser light (2) can be made to follow it and vibrate. Note that since the laser beam itself is not affected by the magnetic field, the path of the laser beam will not become unstable.

レーザ溶接におけるレーザ光の送り速度は溶接条件によ
って異なるが、例えば約3 mm厚の鉄板の場合は約1
〜3m/、である。実際にはレーザ光のln 位置を固定し被加工物を移動させるのが一般的な溶接方
法であシ、許容される被加工物の接合面のギャップは0
.3mm以下が必要である。これを本発明の反射装置を
用いれば許容ギャップをさらに緩和することができる。
The feeding speed of the laser beam in laser welding varies depending on the welding conditions, but for example, in the case of a steel plate about 3 mm thick, it is about 1
~3m/. In reality, the common welding method is to fix the ln position of the laser beam and move the workpiece, and the allowable gap between the joint surfaces of the workpiece is 0.
.. 3mm or less is required. If the reflection device of the present invention is used, the allowable gap can be further relaxed.

例えば許容隙間を05關に拡大した場合は、接合面(7
a)に存在するギャップの幅だけレーザ光(2)を振ら
せてやればよいから振幅は0.5+uとする。一方送り
速度はレーザ光が振動している分だけ遅らせる必要があ
るが、その分レーザ光(2)の振動周波数を速くしても
よい。
For example, if the allowable clearance is expanded to 0.5, the joint surface (7
Since it is sufficient to swing the laser beam (2) by the width of the gap existing in a), the amplitude is set to 0.5+u. On the other hand, although the feed speed needs to be delayed by the amount of vibration of the laser beam, the vibration frequency of the laser beam (2) may be increased accordingly.

例えば第4図に示すようにレーザ光(2)の照射端の振
動周波数をFとすれば、レーザ光(2)が同−溶接線上
に再び戻るまでの時間は2Fsecであり、この間にレ
ーザ光(2)の照射位置(2a)はSだけずれる。
For example, as shown in Figure 4, if the vibration frequency of the irradiation end of the laser beam (2) is F, the time it takes for the laser beam (2) to return to the same welding line again is 2Fsec, and during this time the laser beam The irradiation position (2a) in (2) is shifted by S.

レーザ光(2)の直径をDル−ザ光(2)と被加工物と
の相対的な移動速度を■とすると、移動量Sは■ S二升である。例えば適正溶接条件として1周期当υの
移動量Sをレーザ光直径の1以下におさえ0 るとするならば振動周波数Fは次のように決めればよい
If the diameter of the laser beam (2) is D, and the relative moving speed between the laser beam (2) and the workpiece is (■), then the amount of movement S is (2). For example, if the proper welding condition is to keep the movement amount S per period υ to less than 1 of the laser beam diameter, then the vibration frequency F can be determined as follows.

S≦0.1D 2F≦0.ID ■ F≧0.2− すなわち前例にあてはめると 16.7 F≧0.2冷面:6.7 (Hz )である。S≦0.1D 2F≦0. ID ■ F≧0.2− In other words, applying the precedent 16.7 F≧0.2 cold surface: 6.7 (Hz).

一般にレーザ加工は溶接ギャップに対して敏感であるた
め全ての溶接線において、溶接ギャップを一定量以内に
保持する必要があるが本発明のレーザ加工装置によれば
溶接ギャップに鈍感であり、被加工物の仕上精度を粗く
しても支障ない。従って被加工物の仕上精度は技術的に
も価格的にも有利に加工できる。例えば従来のレーザ溶
接では第5図のように円板状の被加工物(7a)を被加
工物(7b)の円形孔に入れて円周上を溶接するときは
全周にわたってギャップGを一様にする必要があったが
、本発明によればギャップGに裕度をもたせることがで
きるので、被加工面の精度を粗くできるだけで々く、工
作時の段取作業も容易になり、工作時間も大幅に短縮で
きる。
Generally, laser processing is sensitive to welding gaps, so it is necessary to maintain the welding gap within a certain amount for all welding lines, but the laser processing device of the present invention is insensitive to welding gaps, and the workpiece There is no problem even if the finishing accuracy of the object is made rough. Therefore, the finishing accuracy of the workpiece can be improved technically and economically. For example, in conventional laser welding, when a disc-shaped workpiece (7a) is placed in a circular hole of a workpiece (7b) and welded on the circumference as shown in Fig. 5, the gap G is uniform throughout the circumference. However, according to the present invention, it is possible to provide a margin for the gap G, which not only makes it possible to roughen the accuracy of the machined surface, but also facilitates the setup work during machining. The time can also be significantly reduced.

またレーザ溶接においては一般に溶接棒を使用しないだ
め、接合部のギャップGがあまりにも大きいと第6図の
ように凹み(7c)を生じて欠陥となることがある。か
かる場合には第7図のようにあらかじめ溶接線上に溶接
棒(21)を横に置いて本発明のレーザ加工装置によっ
て溶融して凹み(7c)をなくすことができる。
Furthermore, in laser welding, a welding rod is generally not used, and if the gap G at the joint is too large, a dent (7c) may occur as shown in FIG. 6, resulting in a defect. In such a case, as shown in FIG. 7, a welding rod (21) is placed horizontally on the welding line in advance, and the welding rod (21) is melted by the laser processing apparatus of the present invention to eliminate the dent (7c).

なお上記一実施例では反射鏡(5)を振動させたが、他
の実施例として集光レンズ(6)を振動させるようにし
ても同じ作用を得ることができ、レーザ光の光路上にあ
る集光レンズ(6)を磁界を横切る導電ばね(16a 
)、(16b)で支持し、導電ばね(lf〕a)、(1
6b)を通る電流値を制御して集光レンズ(6)の光軸
方向を制御するようにしてもよい。また反射鏡(5)ま
たは集光レンズ(6)が軽い場合には電磁石0槌の代り
に永久磁石を用いてもよい。
In the above embodiment, the reflecting mirror (5) was vibrated, but the same effect can be obtained by vibrating the condenser lens (6) in another embodiment. A conductive spring (16a) crosses the magnetic field through the condensing lens (6).
), (16b), and conductive springs (lf]a), (1
The direction of the optical axis of the condenser lens (6) may be controlled by controlling the current value passing through the condenser lens (6b). Further, if the reflecting mirror (5) or the condensing lens (6) is light, a permanent magnet may be used instead of the electromagnet.

発明の効果 以上のように本発明によれば、レーザ加工装置において
レーザ発振装置から出たレーザ光の光路にある反射鏡ま
たは集光レンズなどの部材を振らして、レーザ光の照射
端をジグザグに移動するようにしたので、被加工物の接
合面に多少のギャップが存在しても融合不良等を起すこ
となく健全な溶接を行うことができ、接合面の精度は粗
くでき、工作時の段取作業も容易となり、工作時間も大
幅に短縮できるなどのすぐれた効果がある。
Effects of the Invention As described above, according to the present invention, a member such as a reflecting mirror or a condensing lens in the optical path of the laser beam emitted from the laser oscillation device in a laser processing device is swung to zigzag the irradiation end of the laser beam. As a result, even if there is a slight gap on the joint surface of the workpiece, sound welding can be performed without causing poor fusion, etc., and the accuracy of the joint surface can be made coarser, making it easier to weld during machining. It has excellent effects such as making setup work easier and significantly reducing work time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のレーザ加工装置を示す縦断面図、第2図
は本発明のレーザ加工装置の一実施例の要部を示す正面
図、第3図は右側面図、第4図はレーザ光の照射端の移
動状態を示す平面図、第5図は溶接ギャップを示す平面
図、第6図は被加工物の溶接状態を示す縦断面図、第7
図は他の実施例を示す要部の縦断面図である。 (1)・・・レーザ発振装置 (2)・・レーザ光(3
)、(4)、(5)・・・反射鏡  (6)・・・集光
レンズ(力・・・被加工物     (16a)、(1
6b)・・・導電ばね(17)・・・固定台     
(18・・・電磁石噛・・・発振器 代理人 弁理士  井 上 −男 第  1  図 第2図 第  3 図 /d 第  4 図 第5図
Fig. 1 is a vertical cross-sectional view showing a conventional laser processing device, Fig. 2 is a front view showing main parts of an embodiment of the laser processing device of the present invention, Fig. 3 is a right side view, and Fig. 4 is a laser processing device. FIG. 5 is a plan view showing the moving state of the light irradiation end; FIG. 5 is a plan view showing the welding gap; FIG. 6 is a longitudinal sectional view showing the welding state of the workpiece; FIG.
The figure is a vertical cross-sectional view of main parts showing another embodiment. (1)... Laser oscillation device (2)... Laser light (3
), (4), (5)...Reflector (6)...Condensing lens (force...Workpiece (16a), (1
6b)...Conductive spring (17)...Fixing base
(18... Electromagnet bite... Oscillator agent Patent attorney Inoue - Male Figure 1 Figure 2 Figure 3/d Figure 4 Figure 5

Claims (1)

【特許請求の範囲】 1 レーザ発振装置から出たレーザ光を光路を介して被
加工物に照射し加工するレーザ加工装置において、前記
光路上におる部材を振らして前記レーザ光の照射端をジ
グザグに移動するようにしたことを特徴とするレーザ加
工装置。 2 レーザ光の光路上にある反射鏡を磁界を横切る導電
はねて支持し、前記導電ばねを通る電流値を制御して前
記反射鏡に振動または角度変化を与えることを特徴とす
る特許請求の範囲第1項記載のレーザ加工装置。 3 レーザ光の光路上にある集光レンズを磁界を横切る
導電ばねで支持し、前記導電ばねを通る電流値を制御し
て前記集光レンズの光軸方向を制御することを特徴とす
る特許請求の範囲第1項記載のレーザ加工装置。 4 被加工物の溶接線上に溶接棒を供給して溶接するこ
とを特徴とする特許請求の範囲第1項記載のレーザ加工
装置。
[Scope of Claims] 1. In a laser processing device that processes a workpiece by irradiating it with a laser beam emitted from a laser oscillation device through an optical path, a member on the optical path is swung to direct the irradiation end of the laser beam. A laser processing device characterized by moving in a zigzag pattern. 2. A reflecting mirror on the optical path of the laser beam is supported by a conductive spring that crosses a magnetic field, and a current value passing through the conductive spring is controlled to give vibration or angle change to the reflecting mirror. A laser processing device according to scope 1. 3. A patent claim characterized in that a condensing lens on the optical path of the laser beam is supported by a conductive spring that crosses the magnetic field, and the direction of the optical axis of the condensing lens is controlled by controlling the current value passing through the conductive spring. The laser processing device according to the range 1 above. 4. The laser processing apparatus according to claim 1, wherein the welding rod is supplied onto the welding line of the workpiece to perform welding.
JP56179049A 1981-11-10 1981-11-10 Laser working device Pending JPS5881586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56179049A JPS5881586A (en) 1981-11-10 1981-11-10 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56179049A JPS5881586A (en) 1981-11-10 1981-11-10 Laser working device

Publications (1)

Publication Number Publication Date
JPS5881586A true JPS5881586A (en) 1983-05-16

Family

ID=16059224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56179049A Pending JPS5881586A (en) 1981-11-10 1981-11-10 Laser working device

Country Status (1)

Country Link
JP (1) JPS5881586A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015178130A (en) * 2014-03-20 2015-10-08 日立造船株式会社 Welding device and welding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015178130A (en) * 2014-03-20 2015-10-08 日立造船株式会社 Welding device and welding method

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