JPS5878478A - 超伝導素子実装用ボ−ドの製作方法 - Google Patents

超伝導素子実装用ボ−ドの製作方法

Info

Publication number
JPS5878478A
JPS5878478A JP56176944A JP17694481A JPS5878478A JP S5878478 A JPS5878478 A JP S5878478A JP 56176944 A JP56176944 A JP 56176944A JP 17694481 A JP17694481 A JP 17694481A JP S5878478 A JPS5878478 A JP S5878478A
Authority
JP
Japan
Prior art keywords
mercury
tip
injection needle
board
syringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56176944A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257278B2 (https=
Inventor
Junpei Suzuki
淳平 鈴木
Fumikazu Ohira
文和 大平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP56176944A priority Critical patent/JPS5878478A/ja
Publication of JPS5878478A publication Critical patent/JPS5878478A/ja
Publication of JPS6257278B2 publication Critical patent/JPS6257278B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R3/00—Electrically-conductive connections not otherwise provided for
    • H01R3/08—Electrically-conductive connections not otherwise provided for for making connection to a liquid

Landscapes

  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
JP56176944A 1981-11-04 1981-11-04 超伝導素子実装用ボ−ドの製作方法 Granted JPS5878478A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56176944A JPS5878478A (ja) 1981-11-04 1981-11-04 超伝導素子実装用ボ−ドの製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56176944A JPS5878478A (ja) 1981-11-04 1981-11-04 超伝導素子実装用ボ−ドの製作方法

Publications (2)

Publication Number Publication Date
JPS5878478A true JPS5878478A (ja) 1983-05-12
JPS6257278B2 JPS6257278B2 (https=) 1987-11-30

Family

ID=16022462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56176944A Granted JPS5878478A (ja) 1981-11-04 1981-11-04 超伝導素子実装用ボ−ドの製作方法

Country Status (1)

Country Link
JP (1) JPS5878478A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063452A (en) * 1987-01-27 1991-11-05 Victor Company Of Japan Ltd. Magnetic recording and/or reproducing apparatus having means for preventing audio-to-video crosstalk and noise generation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063452A (en) * 1987-01-27 1991-11-05 Victor Company Of Japan Ltd. Magnetic recording and/or reproducing apparatus having means for preventing audio-to-video crosstalk and noise generation

Also Published As

Publication number Publication date
JPS6257278B2 (https=) 1987-11-30

Similar Documents

Publication Publication Date Title
US6559666B2 (en) Method and device for semiconductor testing using electrically conductive adhesives
US7547850B2 (en) Semiconductor device assemblies with compliant spring contact structures
US7163830B2 (en) Method for temporarily engaging electronic component for test
JP2001144137A (ja) 半導体デバイスアセンブリ
US5012969A (en) Method of connecting electrodes
JP2003007761A (ja) ボールグリッドアレイパッケージ及びその製造方法
KR100241206B1 (ko) 반도체장치의 제조방법 및 제조장치
JPS5878478A (ja) 超伝導素子実装用ボ−ドの製作方法
JP2940475B2 (ja) Ｉｃのパッケージ、ｉｃのプローバ及びそれらの製造方法
JP2004031686A (ja) ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
AU743640B2 (en) Integrated circuit connection using an electrically conductive adhesive
US6917745B2 (en) Platform and optical module, manufacturing method of the same, and optical transmission device
CN107982637B (zh) 植入式医疗器件的制造方法、植入式医疗器件及对准装置
JP2687856B2 (ja) バンプの製造方法及び製造装置
JPS59177957A (ja) チツプ実装方法
JP3014577B2 (ja) 半導体装置の製造方法
CN114420582A (zh) 一种铜柱凸块晶圆的测试方法
JPH02232946A (ja) ハンダバンプとパッドとの接合構造
US20020040923A1 (en) Contact structure for connecting two substrates and also process for producing such a contact structure
JPS58223383A (ja) 超伝導素子実装用マイクロコネクタ
JPS61176086A (ja) 電気的接続装置の接点ピン溶着方法
JPH0469943A (ja) キヤピラリチツプ
JPH02270327A (ja) バンプ電極の形成方法
JPS6257277B2 (https=)
JP2000150703A (ja) 半導体装置及びその組立方法