JPS5878450A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5878450A
JPS5878450A JP17693581A JP17693581A JPS5878450A JP S5878450 A JPS5878450 A JP S5878450A JP 17693581 A JP17693581 A JP 17693581A JP 17693581 A JP17693581 A JP 17693581A JP S5878450 A JPS5878450 A JP S5878450A
Authority
JP
Japan
Prior art keywords
regions
wiring
element region
region
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17693581A
Other languages
Japanese (ja)
Inventor
Hiroshi Yoshimura
寛 吉村
Mitsuyoshi Nagatani
三義 永谷
Katsuji Horiguchi
勝治 堀口
Tsunetaka Sudo
須藤 常太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP17693581A priority Critical patent/JPS5878450A/en
Publication of JPS5878450A publication Critical patent/JPS5878450A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique

Abstract

PURPOSE:To improve the degree of integration by effectively utilizing excessive region sections formed at both ends of an element region row and reducing the width of a region between said row and an adjacent element region row only by a section corresponding to the excessive regions. CONSTITUTION:Wiring regions 22 with wiring 21, such a power supply wiring, ground wiring, etc., which have the first directional length required, are arranged so that a plurality of the element region rows 4 have the first mutually equal directional length among necessary adjacent element regions 3 in at least plural regions 3 in element region rows 4 required in a plurality of the element region rows 4. According to such constitution, the width of the regions 20 among the adjacent element regions 4 can remarkably be made smaller than the case of no formation of the wiring regions 22 when the positions of the wiring regions 22 are properly selected.

Description

【発明の詳細な説明】 本発明は、複数の素子領域が嬉1の方向に配列されてな
る素子領域列の複数が、第1の方向と直交するlElの
方向に配列されてなる構成を有する半導体集積−路装置
の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention has a configuration in which a plurality of element region rows each having a plurality of element regions arranged in a direction 1 are arranged in a direction 1El perpendicular to the first direction. This invention relates to improvements in semiconductor integrated circuit devices.

斯種半導体集積回路装置として、第1@#cfす如(半
導体基板1上に複数のプロッタ2が配列され、画してそ
の各プロッタ2が、第2図に′示す如く、複数の素子領
域5が嬉1の方向(図に於ては横方向)に配列されて′
なる面子領域列4の複数が、嬉1の方向と直交する第2
の方向(閣に於ては縦方向)に配^されてなる構成を有
し、素子領域列4の電源配線5及び接地配線6がブロッ
ク2の両側ICC最長る共通電源配線7及び纏地配@a
cII絖され、−の素子領域列4の複数の素子領域5の
入出力端9が第2の方向に嬌長せる配線10に連結され
、それ等配線10が配4110とは絶縁層を介して異な
る面上にfslの方向に延長せる配llAl1にコンタ
クトネール12を介して轟績され、又−の素子領域列4
の−の素子領域5の入出力端9!c連結せる配@11と
他の素子領域列4の−の素子領域Sの入出力端!に連結
せる配線11とが、配線10及び11とは絶縁層を介し
て異なる面上に第2の方向に延長せる配、@154こコ
ンタクトホールI S’を介して連結され、更に複数の
ブロック2の入出力端14がlElの方向に延長せる配
!115に連結され、それ等配線15が配置11%とは
給縁層を介して異なる―上#C嬉2の方向に延長せる複
数の配線14fc夫々コンタクトホーN17を介して連
結され、それ等配4914が配m15と同じ向上のIl
lの方向に嬌長せる配線tSにてツンタタトホーJ/1
9を介して連結されたりしてなる構成を有するものが提
案されている。
As such a semiconductor integrated circuit device, a first@#cf (a plurality of plotters 2 are arranged on a semiconductor substrate 1, and each plotter 2 has a plurality of element regions as shown in FIG. 5 is arranged in the direction of 1 (horizontal direction in the figure).
A plurality of face region rows 4 are arranged in the second direction perpendicular to the direction of the first direction.
It has a configuration in which the power supply wiring 5 and the ground wiring 6 of the element region row 4 are arranged in the direction of @a
The input/output ends 9 of the plurality of element regions 5 of the negative element region row 4 are connected to a wiring 10 extending in the second direction, and these wirings 10 are connected to the wiring 4110 through an insulating layer. The element region array 4 is connected to the arrangement 11A1 extending in the direction of fsl on a different surface via the contact nail 12, and the element region array 4 of -
The input/output terminal 9 of the - element region 5! c The input/output terminal of the - element area S of the connecting arrangement @11 and the other element area array 4! A wiring 11 connected to the wirings 10 and 11 is connected via a contact hole IS' extending in a second direction on a different surface through an insulating layer from the wirings 10 and 11, and is further connected to a plurality of blocks. The arrangement allows the input/output end 14 of No. 2 to extend in the direction of lEl! 115, and the wiring 15 is different from the arrangement 11% through the supply layer. 4914 has the same improvement as m15.
Tsuntatatoho J/1 with wiring tS that extends in the direction of l
9 has been proposed.

所で斯る従来の半導体集積−路装置の場合。However, in the case of such a conventional semiconductor integrated circuit device.

素子領域列4の複数の素子領域Sの111の方向の長さ
は基準長Iの螢数N倍の長さj−Nを有するものである
が、複数の素子領域列4はこれを互に等しい長さに形成
されて居らず%従って素子領域列4の両端に余分の領域
を有し、ζΦ為この分集積度が十分高いものであるとは
言い得ないものであった。
The length in the direction 111 of the plurality of element regions S of the element region row 4 has a length j-N which is the number N times the number of fireflies of the reference length I, but the plurality of element region rows 4 are They are not formed to have equal lengths, and therefore have extra regions at both ends of the element region row 4, and because of ζΦ, it cannot be said that the degree of integration is sufficiently high.

依って本Ii@は上述せる素子領域列40両端に有する
余分の領域分を増動に利用し、ζΦ分椙隣る素子領域列
4間の領域2Gの幅を小とし。
Therefore, in this Ii@, the extra regions at both ends of the element region rows 40 mentioned above are used for increasing the operation, and the width of the region 2G between the adjacent element region rows 4 is reduced by ζΦ.

依って集積度を向上せんとするものである。Therefore, the aim is to improve the degree of integration.

第511は本a明による半導体集積−路装置の一例を示
し、II2園との対応部分には同一符号を附して示すも
、嬉2■にて上述せる構成に於て、複数の素子領域列4
中の所要の素子領域列4に、少くともその*aの領域S
中の所要の相隣る素子領域5間に於て、複数の素子領域
列4が亙に等しい嬉1の方向の長さとなる様に、所要の
第1の方向の長さを有する電源配I11接地配線等の配
−21を有する配線領域22を配してなる構成を有する
No. 511 shows an example of a semiconductor integrated circuit device according to the present invention, in which parts corresponding to those in II2 are given the same reference numerals, but in the configuration described above in II2, a plurality of element regions Column 4
At least the area S of *a in the required element area column 4 in
A power supply wiring I11 having a required length in the first direction so that the plurality of element region rows 4 have the same length in the first direction between required adjacent element regions 5 in the middle. It has a configuration in which a wiring region 22 having a wiring 21 such as a ground wiring is arranged.

以上が本−―による半導体集積回路装置の一儒橋威であ
るが、斯る構成によれば、配置領域22の位置を適轟に
遥定すれば、相隣る素子領域4間の領域20の−を配置
領域22を拳成せざる場合に比し%格段的に小とし得る
ものである。その鳳幽は、配−領域2Qを設けることに
より、411隣る素子領域列4の素子領域暴の入出力端
9をII続する配l1111IIIが領域20に幅方向
M−配列寝れる象を領域20を設けない場合に比し小と
し得るからである。
The above is the basic idea of the semiconductor integrated circuit device according to the present invention. According to such a configuration, if the position of the arrangement area 22 is properly determined, the area 20 between the adjacent element areas 4 can be % can be made much smaller than in the case where the arrangement area 22 is not formed. By providing the arrangement region 2Q, the arrangement 1111III which connects the input/output end 9 of the element region row of the adjacent element region row 4 can be arranged in the width direction M-array in the region 20. This is because it can be made smaller than in the case where 20 is not provided.

依って本発明によれば従来の場合に比し集積度を格段的
に向上し得る大なる特徴を有するものである。
Therefore, the present invention has a great feature that allows the degree of integration to be significantly improved compared to the conventional case.

【図面の簡単な説明】[Brief explanation of the drawing]

第1@は半導体集積回路装置を示す略■的平msi、第
211はそのブーツタを示す略1的平−図、嬉5図は本
発明による半導、体集積aim装置の一例を示す略1的
平−閣である。 出願人 日本電信電話公社 代理人  弁理士  1)中 正治
No. 1 @ is an approximately 1-dimensional diagram showing a semiconductor integrated circuit device, No. 211 is an approximately 1-dimensional diagram showing its boot switch, and Figure 5 is an approximately 1-dimensional diagram showing an example of a semiconductor integrated circuit device according to the present invention. It is a temple. Applicant Nippon Telegraph and Telephone Public Corporation Agent Patent Attorney 1) Masaharu Naka

Claims (1)

【特許請求の範囲】[Claims] 複数の素子領域が第1の方向に配列されてなる素子領域
列の複数が、上記第1の方向と直交する第2の方向に配
列されてなる構成を有する半導体集積−路装置に於て、
上記複数の素子領域列中の所要の素子領域列に、その複
数の素子領域中の所要の相隣る素子領域間に於て、上記
複数の素子領域列が互に轡しい第1の方向の長さとなる
様に、所要の第1の方向の長さを有する配線領域を配し
てなる事を畳黴とする半導体集積III値置装
In a semiconductor integrated circuit device having a configuration in which a plurality of element region rows each having a plurality of element regions arranged in a first direction are arranged in a second direction perpendicular to the first direction,
A first direction in which the plurality of element region rows are mutually inverse between required adjacent element regions in the plurality of element region rows. A semiconductor integrated III-value device that is formed by arranging a wiring region having a required length in a first direction so that the length is the same as that of the first direction.
JP17693581A 1981-11-04 1981-11-04 Semiconductor integrated circuit device Pending JPS5878450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17693581A JPS5878450A (en) 1981-11-04 1981-11-04 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17693581A JPS5878450A (en) 1981-11-04 1981-11-04 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5878450A true JPS5878450A (en) 1983-05-12

Family

ID=16022308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17693581A Pending JPS5878450A (en) 1981-11-04 1981-11-04 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5878450A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178868A (en) * 1984-09-27 1986-04-22 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS61110448A (en) * 1984-11-02 1986-05-28 Hitachi Ltd Wiring system of semiconductor integrated circuit
US4864381A (en) * 1986-06-23 1989-09-05 Harris Corporation Hierarchical variable die size gate array architecture
US4978633A (en) * 1989-08-22 1990-12-18 Harris Corporation Hierarchical variable die size gate array architecture
US5063430A (en) * 1989-04-27 1991-11-05 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device having standard cells including internal wiring region
US5111271A (en) * 1989-06-26 1992-05-05 Kabushiki Kaisha Toshiba Semiconductor device using standard cell system
US5124776A (en) * 1989-03-14 1992-06-23 Fujitsu Limited Bipolar integrated circuit having a unit block structure
WO1998040913A1 (en) * 1997-03-11 1998-09-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device with its layout designed by the cell base method
KR100333204B1 (en) * 1999-09-08 2002-04-18 다니구찌 이찌로오, 기타오카 다카시 Semiconductor integrated circuit device with its layout designed by the cell base method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178868A (en) * 1984-09-27 1986-04-22 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS61110448A (en) * 1984-11-02 1986-05-28 Hitachi Ltd Wiring system of semiconductor integrated circuit
US4864381A (en) * 1986-06-23 1989-09-05 Harris Corporation Hierarchical variable die size gate array architecture
US5124776A (en) * 1989-03-14 1992-06-23 Fujitsu Limited Bipolar integrated circuit having a unit block structure
US5063430A (en) * 1989-04-27 1991-11-05 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device having standard cells including internal wiring region
US5111271A (en) * 1989-06-26 1992-05-05 Kabushiki Kaisha Toshiba Semiconductor device using standard cell system
US4978633A (en) * 1989-08-22 1990-12-18 Harris Corporation Hierarchical variable die size gate array architecture
WO1998040913A1 (en) * 1997-03-11 1998-09-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device with its layout designed by the cell base method
US6335640B1 (en) 1997-03-11 2002-01-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device with its layout designed by the cell base method
KR100333204B1 (en) * 1999-09-08 2002-04-18 다니구찌 이찌로오, 기타오카 다카시 Semiconductor integrated circuit device with its layout designed by the cell base method

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