JPS5877046U - 半導体樹脂封入成形用の樹脂材料 - Google Patents

半導体樹脂封入成形用の樹脂材料

Info

Publication number
JPS5877046U
JPS5877046U JP17258781U JP17258781U JPS5877046U JP S5877046 U JPS5877046 U JP S5877046U JP 17258781 U JP17258781 U JP 17258781U JP 17258781 U JP17258781 U JP 17258781U JP S5877046 U JPS5877046 U JP S5877046U
Authority
JP
Japan
Prior art keywords
resin material
resin
encapsulation molding
utility
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17258781U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130279Y2 (enrdf_load_stackoverflow
Inventor
道男 長田
坂東　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP17258781U priority Critical patent/JPS5877046U/ja
Publication of JPS5877046U publication Critical patent/JPS5877046U/ja
Application granted granted Critical
Publication of JPS6130279Y2 publication Critical patent/JPS6130279Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP17258781U 1981-11-18 1981-11-18 半導体樹脂封入成形用の樹脂材料 Granted JPS5877046U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17258781U JPS5877046U (ja) 1981-11-18 1981-11-18 半導体樹脂封入成形用の樹脂材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17258781U JPS5877046U (ja) 1981-11-18 1981-11-18 半導体樹脂封入成形用の樹脂材料

Publications (2)

Publication Number Publication Date
JPS5877046U true JPS5877046U (ja) 1983-05-24
JPS6130279Y2 JPS6130279Y2 (enrdf_load_stackoverflow) 1986-09-05

Family

ID=29964482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17258781U Granted JPS5877046U (ja) 1981-11-18 1981-11-18 半導体樹脂封入成形用の樹脂材料

Country Status (1)

Country Link
JP (1) JPS5877046U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6130279Y2 (enrdf_load_stackoverflow) 1986-09-05

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