JPS5876831A - Metallic image forming material - Google Patents

Abstract

PURPOSE:To permit sharp etching of thin metallic layers in a short time without using any powerful etching soln. by providing >=2 layers of vapor deposited metallic layers wherein the angles of vapor deposition with respect to a substrate increase gradually from the substrate side on said substrate. CONSTITUTION:Metals 3 are vapor deposited on a substrate 1 in order of theta1, theta2(theta1<theta2) angles of vapor deposition (the angles that the normal of the plane of the substrate and the incident direction of vapor depositing particles assume) with respect to the substrate 1, whereby at least 2 layers of vapor deposited metallic layers are formed. Here, the metals may be either of the same kind or of different kinds, for which Al is more paticularly suited. The initial angle theta1 of vapor deposition in initial setting is preferably set at theta1<45'' and the angle theta2 of the 2nd vapor deposition at theta2>=45 deg.. A photosensitive resin layer is provided on said vapor deposited metallic layers, and is patterned by pattern exposure and developing; thereafter the vapor deposited metallic layers are etched by an aq. NaOH soln., etc.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a material for forming a metal image, and more specifically, a novel metal image that has a high contrast image forming ability and is suitable for fine line images and halftone dots. Regarding forming materials.

In general, when using a metal image forming material consisting of a photosensitive resin image forming layer and a metal or other workpiece material layer, corrosion-resistant material with a certain image or design on the metal or non-metallic workpiece material is used. A technique in which a film is formed using a photographic technique, and then the exposed parts of the workpiece are dissolved chemically or electrochemically to obtain the desired metal image. There is a photoetching method (hereinafter referred to as photoetching method).

In conventional metal image-forming materials, in the photo-etching method using a thin metal layer, a coating layer (hereinafter referred to as resist) having corrosion-resistant properties in the image-formed photosensitive resin layer is immersed in an etching solution. There is a tendency to
If the etching solution is so weak that it will not be immersed, the thin metal layer will not be easily etched by the etching solution. Therefore, the etching time usually takes a long time. Therefore, in order to increase the efficiency, a strong etching solution must be used, which poses a danger to the environment during work, and the resist must be extremely resistant to wire and corrosion. Moreover, it is difficult to obtain sharp images with strong etching liquid or weak resist, and as etching progresses,
Since the etching line progresses in the direction perpendicular to the surface of the workpiece and also in the lateral direction, so-called side etching occurs, causing a problem in that the edges of the image are disturbed.

Furthermore, when printing a desired image onto the photosensitive resin layer using an ultraviolet lamp or the like, the light that has passed through the photosensitive resin layer is reflected on the underlying thin metal layer, causing radiation. The reproducibility of embedded images is a problem.

The object of the present invention is to provide a metal image forming method that can etch a thin metal layer in a short time without using a strong etching solution, and can obtain a sharp image. To provide the materials.

The above object of the present invention is to provide on a support at least two metal vapor deposited layers whose vapor deposition angles to the support gradually increase from the support side, This is achieved by a metal image forming material characterized in that it is provided with a resin layer.

According to a preferred embodiment of the present invention, the metal vapor deposited layer of the present invention has a two-layer structure, and the metal of the metal vapor deposited layer is an aluminum vapor deposited layer.

The present invention will be explained in detail below. In addition, in the following description, the case where the metal vapor deposition layer of this invention is made into two layer structure is mainly demonstrated, but it goes without saying that this invention is not limited to this.

The metal thin layer in the metal image forming material according to the present invention is a metal vapor deposition layer, and the metal used in the metal vapor deposition layer is, for example, mainly aluminum as described in detail in JP-A-50-139720. Metals that are
-65927, 48-65928, 50-29
Tellurium, soriptene, boronium, cobalt, zinc, copper, nickel, iron, tin, vanadium, germanium, silver and arsenic emulsions as described in each publication of No. 25 and No. 50-14161, and Examples include chromium, titanium, etc. and alloys.

A preferred thin metal layer in the present invention is an aluminum thin layer.

The metal thin layer has an evaporation angle of θ1.02 with respect to the support (an angle between the normal to the support surface and the direction of incidence of the evaporation particles).
It consists of a two-layer structure of metal vapor deposited layers formed by vapor depositing metal in the order of θ and θ.

In this case, the metals may be of the same type or of different types.

There are various combinations of vapor deposition angles #, #2 for forming a two-layer metal vapor deposition layer on the support, but preferably the initial vapor deposition angle θ+<45.
The second-stage deposition angle is 02≧45″.Hereinafter, θ1 is the initial deposition angle, 02 is the second-stage deposition angle, and the layer formed by the initial vapor deposition is referred to as the first layer, and the layer formed by the second vapor deposition is referred to as the second layer.

In the present invention, if the initial deposition angle θ1 is larger than this range, side etching will easily occur during etching, resulting in poor image edges, and if the second stage deposition angle 02 is smaller than this range, the etching rate will be slower than the desired one. Become.

In the present invention, vapor deposition refers to 1. This includes electron beam heating, sputtering, ion blating, etc.

The thickness of each layer is also related to the optical density, but preferably the first layer with the initial deposition angle θ1 is oA~500. 1st
If the layer becomes thicker than this, the desired etch rate cannot be achieved. The thickness of the second layer is set to a desired value by measuring the optical density of the obtained vapor-deposited film.

The thickness of the metal vapor deposited layer of the present invention is determined by the optical density required for the resulting image, but the two are almost proportional; for example, if the image is a line drawing or halftone dot, a relatively high density is required. The optical density is at least 2.0 or more, and especially when used as a mask for printing on the P8 printing plate made of the material of the present invention, a slight optical density is required, and an optical density of at least 3.0 is required. Since it is necessary, the thickness is determined accordingly. The optical density at this time is a value measured using a Macbeth transmission densitometer for a film having two layers of metal vapor deposition.

The relationship between the overall thickness of the metal vapor deposited layer and the optical density is generally the same, although it may differ somewhat depending on the method of forming the metal vapor layer, for example, the conditions of vacuum vapor deposition. Although it is not particularly prohibited to increase the thickness of the metal vapor deposited layer more than necessary in order to obtain a desired optical density, it may lead to wastage of the material of the metal vapor deposition layer or excessive etching for image formation as described below. This is not desirable as it would take a considerable amount of time. Furthermore, considering that excessive etching time may deteriorate the resist,
It is better to avoid making the metal deposited layer thicker than necessary.

The support used in the present invention has a metal vapor deposited layer as an image forming layer provided directly or indirectly (via another layer) thereon, and is constructed using the support. The metal image forming material of the present invention can be made into various forms depending on the intended use. For many applications requiring this metal imaging material, which will normally occur to those skilled in the art from prior experience, the support is preferably in the form of a plate, sheet or film. , can be transparent, semi-transparent or opaque depending on its use. In addition, the support is not affected by the etching solution that corrodes the metal vapor deposited layer, and the adhesion to the layer that is easily peeled off due to etching is deteriorated. It must not be a thing.

Many conventionally known materials can be used as the material for the support, including ceramics, amorphous glass, crystalline glass, metals, alloys, plastics, and composite materials thereof. Some of these materials are opaque or transparent, but if necessary, colorants or opacifying agents can be added to the transparent materials to make them translucent or opaque. However, for many possible applications, the imaging material of the present invention is imaged by a metallized layer, allowing light to pass through non-image areas where there is no metallized layer and the support is exposed to the screen; The image area is a so-called light-transmitting application field in which light is blocked by a metal vapor deposited layer, and in the case of metal image forming materials used in such fields, the support must be transparent. . On the other hand, in applications where a formed image is recognized by reflected light, the substrate line does not need to be transparent. It is also effective to use surface treatment techniques such as corona discharge and plasma treatment to improve the adhesion between the support and the metallized layer.

The photosensitive resin layer in the present invention can be formed using a conventionally known photosensitive resin for resist formation. This photosensitive resin is irradiated with radiation (near ultraviolet rays or visible light). All compounds and compositions, such as monomers, prepolymers, and polymers, whose molecular structure changes chemically over a short period of time and whose physical properties, such as solubility or stickiness in solvents, change accordingly. It is common knowledge in the industry that the concept of "photosensitive resin" includes monomers and prepolymers such as those mentioned above. ), and are further classified into positive working type and negative working type.Furthermore, based on the content of chemical changes, when irradiated with radiation, metal ions When a photosensitive resin that undergoes a crosslinking reaction or a photosensitive resin that itself becomes two smokes is irradiated with radiation, the photodegradable substance present along with it decomposes and a crosslinking reaction occurs through the decomposed product. These photosensitive resins are classified into those that initiate polymerization when exposed to radiation, and those that initiate polymerization when irradiated with radiation, and both of these are used to prepare the metal imaging material of the present invention. However, any photosensitive resin that will be developed in the future that can form a photosensitive resist film, regardless of its classification, can be applied to the metal image forming material of the present invention in exactly the same way as the known ones.

From the viewpoint of actual use of photosensitive resins, it is desirable to give an overview of the photosensitive resins used, focusing on the classification based on the development mode rather than the content of chemical changes.
Let's focus on and explain them.

In the case of photosensitive resins that form solvent-soluble layers, positive-working resins are decomposed by light irradiation to produce five-membered ring compounds with carboxyl groups, such as those seen in O-quinone diazides, which are soluble in alkaline solutions. The resin layer in the exposed areas is removed by development with an alkaline solution, and the photosensitive resin layer in the unexposed areas forms the desired image area and remains.69 On the other hand, negative working The mold can be made insolubilized by enlarging the molecule or forming a network structure by light irradiation, as seen in photocrosslinking represented by cinnamoyl groups and diazonium groups, and photopolymerization represented by acrylamide and acrylic esters. It is a type that works by using an appropriate developer to remove the unexposed areas of the photosensitive resin layer and leave the insolubilized exposed areas forming the desired image areas. .

These solvent-soluble photosensitive resins are widely used as photosensitive solutions for 28 plates, wipe-on plates, photo-etching resists, and the like.

As a positive working type photosensitive resin, L2-
Naphthoquinone shea-cyto compounds are used, such as 4a4-trioxybenzophenone-bis [natutoquino/-1,2-diazide-55-sulfonic acid ester] described in Japanese Patent Publication No. 37-18015, Japanese Patent Publication No. 37-3627
2-[naphthoquinone-1,2-diazide-5 described in No.
-Sul 7-onyl ox 7) -7-Hydroxynaphthalene, naphthoquinone-L2 described in Japanese Patent Publication No. 37-1954
-Diazide-5-sulfanilide, Japanese Patent Publication No. 45-961
Examples include 7-toquinone-L2-diazide-sulfonic acid novolac ester described in No. 0. Commercially available products include KPR (type 3) (Eastman Kodak, USA); AZ-340%AZ
-1350, AZ-111, AZ-119 (Azopl
ate-5hipley) ; Kalle Ak
tingesell-schaft OCoping
Lacquer-P; 7 #Tosol, 7 Otosol B1 Photosol E (Tokyo Ohka Kogyo ■; FPPR-3
00%FPPR-7oo, EPPR-1000 (Fuji Pharmaceutical Co., Ltd.); and the like.

Among negative working type photosensitive resins, water-soluble photosensitive liquids are commercially available from companies such as Kaihon Kagaku Kogyo, Fuji Yakuhin Kogyo, and Shiwa Sangyo, but PVA-ammonium dichromate-based ones are This is almost the majority, and there are also glue weights based on ammonium romate and casein-ammonium dichromate. Many other photosensitive substances such as diazonium salts, azide compounds, and compounds having a cinnamoyl group are known as other useful photosensitive resins, but diazonium salts used as negative working type photosensitive resins include P- Paraformaldehyde condensate of diazodiphenylamine, US Patent L762.0
1-diazo-4-dimethylaminobenzene-hydrofluoroborate, l-diazo-3-methyl- as described in No. 33
4-dimethylaniso/11f sulfate, l-diazo-
Examples include 3-monoethylnaphthylamine. Examples of azide compounds include p-phenylenebistane, 44'-diazitos tilbene-44'-diazidochalcone s 26-cy (, and it-azidobenzal) described in US Pat. ) cyclohexanone, 46-di(4'-azidobenzal)
-4-methylcyclohexanone and the like.

These azide compounds are usually mixed into a rubber solution and used as a "rubber photosensitive liquid," but the rubber used at this time can be natural rubber or synthetic rubber. Polyisoprene described in No. 22084 is often used.

Examples of polymers having an azide group in the molecule include vinyl polyazidobenzoate, vinyl polyazidophthalate, and polyvinylazidobenzalacetal described in Japanese Patent Publication Nos. 40-28499 and 45-22085. As a photosensitive resin having a cinnamoyl group as a photosensitive group, there is polyvinyl cinnamate. Cinnamylidene acetate derivatives of PVA are also used6, such as polyvinylcinnamylidene acetate, polyvinylcinnamate, cinnamylidene acetate, polyvinylethoxycarbonylmethyl carbamate cinnamylidene acetate, polyvinyl acetate cinnamylidene acetate, and the like. Many other types are known, including those using acryloyl groups, those using acrylamides, and those using acrylates. Current commercially available negative working photosensitive resins include KPR, KTFR%KME.
R (manufactured by Eastman Kodak, USA); Western Litho Pl
ate); Wipe-〇-Sensitizer (U.S. Li
(manufactured by tho Chemical &upply); In addition to Hiroko, Dynachem Corpora
t ton of DCR (Dynachamphot
oRe5ist).

Phillip A, Hunt Chemical
Corporation (WPR(Wayc
oatphoto Re5ist), Kalle
Aktingeiellschaft (D Cop
ingLacquer-N, etc. Domestic products include EPP) L.

OMR, TPR (manufactured by Tokyo Ohka Kogyo ■); negative coat Fuji Super Resist (manufactured by Fuji Pharmaceutical Co., Ltd.); Wipe Doll Regis) 8 (manufactured by Okamoto Chemical Co., Ltd.), and KY resist (manufactured by Okamoto Chemical Industry ■);
Yamatoya Shoten), etc.

On the other hand, in the case of a photosensitive resin that forms a peelable layer, for example, Japanese Patent Publication No. 38-9'661, Japanese Patent Publication No. 41-15932, Japanese Patent Publication No. 43-22901, Japanese Patent Publication No. 48-43126;
No. 7-7728, No. 47-33623, No. 48-58
As described in No. 909 and No. 48-101117, a photosensitive polymer, that is, a portion that has been irradiated with light or a portion that has not been irradiated with light, is a metal vapor deposited layer or an intermediate layer that is adjacent to the lower layer, that is, the support side. Polymers that have the property of decreasing or losing their adhesion to the underlying layer, or photosensitive monomers that polymerize and harden when exposed to light, increasing, decreasing or eliminating their adhesion to the underlying layer. Specifically, there are a wide variety of substances or compositions, and they can be appropriately selected in consideration of the degree of their properties.

In order to prepare the metal image-forming material according to the present invention, at least two desired metal vapor deposition layers are first formed on the surface of a specified support by a method such as a vacuum evaporation method, a sputtering method, or an ion blasting method. An example of this method is as follows. FIGS. 1 and 0 are schematic diagrams of an apparatus showing an example of an embodiment of the present invention in which a metal vapor deposited layer is provided on a support by a vacuum vapor deposition method.

In the figure, the support l facing the evaporation source 2 is set at an angle of θ1 451' by the substrate holder 5 with an initial evaporation angle of 01. Next, when a predetermined film thickness is reached, the shutter 4 is closed, the attached substrate tilting device (not shown in the figure) is used to set a tilt angle, and the second stage deposition angle θ2≧45°.
Alternatively, take the substrate out of the direct line and reinstall it so that the second stage deposition angle is 02≧45'', and then continue the deposition. If the types of metals are different in the first layer and the second layer, evaporation I
The FI 2 is for making the evaporated sample 3 fly toward the support 1 by heating means such as resistance heating or electron beam heating. The duration of vapor deposition on the support l can be determined by opening and closing a shutter 4 provided in the middle of the flight path. The deposition time is determined as appropriate by measuring the film thickness using a monitor, the transmission density of the deposited film, etc.

Next, a photosensitive resin layer is formed thereon. In this case, the coating solution for forming the photosensitive resin layer is one or more resins selected from the various photosensitive resins mentioned above, dissolved in a solvent to form a solution or dispersion, and a necessary sensitizer. and various additives to form a coating solution.

The coating solution prepared in this manner can be applied, for example, to a roller coating method, an air knife Ik cloth method, a dipping method, a curtain coating method,
A photosensitive resin layer is formed by coating the metal layer using a known coating method such as a spray coating method and drying it.

The dry thickness of the photosensitive resin layer may be about 0.1 to 10 μm. If the resist layer is too thin, the resist layer will be weak, and if it is too thick, etching will take an excessive amount of time, and a resist image that accurately corresponds to the exposed image may not be formed. The multi-photosensitive resin layer is exposed to light using a known technique, and the photosensitive resin layer is developed using an etching solution that serves as both a developing solution and an etching solution. Then, at the same time (one-bath method or then two-bath method), the metal vapor deposited layer is etched, or the photosensitive resin layer is developed with a developing processing solution, and the metal vapor deposited layer is etched with an etching solution, followed by the desired etching. By removing the resist formed by the photosensitive resin layer, a desired metal image can be obtained.

The etching solution used for etching the metal image forming material of the present invention may be either an acid or an alkali, and is appropriately selected depending on the nature of the metal vapor deposited layer.

In the present invention, if necessary, the photosensitive resin layer may be divided into two or more, or an intermediate layer, a protective layer, an antihalation layer, and/or a subbing layer (for example, a resin that is soluble or has an affinity for an aqueous processing liquid) may be used. It is possible to provide 6 individual or multiple use). Furthermore, in the present invention, it is also possible to provide three or more metal deposited layers. In this case, the uppermost metal deposited layer has the maximum deposition angle, and is also deposited first, that is, the metal deposited layer is deposited downward. The two or more metal vapor deposited layers have an evaporation angle that gradually decreases toward the bottom. Furthermore, it may be a layer in which one material is mixed.

Furthermore, when looking at the entire metal evaporation layer in the present invention, the evaporation angle gradually increases as the distance from the support side increases (for example, if the metal evaporation layer has a three-layer structure, the bottom layer When the deposition angle of the deposited layer is θ°, that of the middle layer is 30°, and that of the top layer is 80°, etc. ψ
. However, the individual metal deposited layers need not have a fixed deposition angle. For example, in the case of a two-layer metal vapor deposition layer, the first layer and/or the second layer may have a vapor deposition angle that continuously increases (1981
Patent Jli (Q, title of invention; see specification of metal image forming material) filed on January 2nd, in this case, vapor deposition is carried out by continuously increasing the vapor deposition angle, and the vapor deposition angle at the end of this vapor deposition is and the above-mentioned θl and/or 02.

According to the present invention, in the at least two-layer metal vapor deposited layer provided on the support, the vapor deposition angle of the upper layer is gradually larger than that of the lower layer, so that the film surface of the metal vapor deposited layer is The fine irregularities improve the adhesion retention ability of the photosensitive resin layer provided on top of this in the subsequent step, and the etching solution quickly penetrates into the exposed areas of the metal deposited layer after image formation, making it extremely Etching speed becomes faster. Therefore, etching can be performed even with a not very strong etching solution. Furthermore, the short etching time is related to the good processability of the image development process, as the resist is not immersed and there is little side etching, resulting in images with good edge sharpness in corroded areas. obtained,
Even fine line images and halftone dot images can be processed with good reproducibility and high precision. Furthermore, since the vapor deposition angle is different between the upper layer and the lower layer of the at least two-layer metal vapor-deposited layer deposited on the support, the surface reflectance is different on the front and back sides of the film.
Even if the surface of the support has metallic luster, the surface of the upper layer becomes black or brown, so it is effective for distinguishing between the front and back of a film-shaped metal image forming material. Furthermore, it is also effective in preventing nolage discharge during exposure of the photosensitive resin layer.

The present invention will be illustrated below with reference to Examples, but the embodiments of the present invention are not limited thereto.

Example 1 A roll of polyethylene terephthalate film support in the form of a long strip and having a thickness of 100 μm was placed in a semi-continuous vapor deposition apparatus at a vapor deposition angle θ, an initial vapor deposition angle of 01=Q′, and a second-stage vapor deposition angle #2.
= 80°, with two evaporation sources, and by heating aluminum placed in two carbon crucibles under a vacuum of 5 x 10-' Torr to form a vapor deposited layer. Deposit.

The film support is semi-continuously deposited, transported at a speed of 40 m/m. Aluminum is vacuum-deposited on the film support described above, and the film thickness when the initial deposition angle θ1 is 00 is determined by the monitor so that the transmission density of the film measured with a Macbeth transmission densitometer is 3.5 for the entire deposited film. 501, and then a second stage of vapor deposition was performed to obtain an aluminum vapor deposited layer, and the film was wound up into a roll.

Next, the following photosensitive resin composition was applied on the film surface of this aluminum vapor-deposited layer until the film thickness after drying was 2. It was coated with a whirler to a thickness of Os and dried in a 100° C. dryer for 5 minutes.

A sample of the photosensitive material obtained in this way was pattern-exposed for 20 seconds through a halftone dot using a bright room printer LIP-6 (3KW metal halide lamp, Ueno Kagakuten), and then placed in an O,IN sodium hydroxide water bath. immersed in. At this time, at a liquid temperature of 25°C and an immersion time of 30 seconds, the aluminum evaporation layer in the unexposed areas is completely removed, while the aluminum evaporation layer in the exposed areas is formed by an aluminum evaporation layer whose brightness is almost completely reversed from that of the original. An image with black color on the photosensitive layer side, which is free from the effects of halation, and metallic luster on the support side was obtained, and the sharpness of the halftone dot edges was also good, resulting in a sharp image with good reproducibility.

On the other hand, a sample having an aluminum vapor deposited layer with a transmission density of 3.5 was created by a single vapor deposition operation with a vapor deposition angle 01 of θ°, a photosensitive resin layer was similarly provided, and exposure, development,
When etching was carried out, a long development time of 4 minutes was required, the sharpness of the halftone dot edges was poor, and the aluminum vapor deposited layer had a metallic luster, and this halation caused the halftone dots to thicken.

Example 2 In the same manner as in Example 1, the film thickness was set to 50 at the initial deposition angle θ1 = 40', and the aluminum evaporation layer with a transmission density of 3.5 was formed with the deposition layer at the second stage deposition angle θz = 80''. A deposited film having the following properties was obtained.

Next, AZ-1350 (positive type photosensitive liquid; photosensitive liquid manufactured by 8hipley) was coated on the surface of this vapor-deposited film to a dry film thickness of 1.5 μm.
Dry for 5 minutes in a dryer at °C.

A sample of the photosensitive material thus obtained was pattern-exposed for 45 seconds through a dot original using a bright room film fi-UP-6, and then developed with a developer for AZ-1350. One side of resist corresponding to the original was formed on the transparent resin layer.

This sample was then heated to 0. When immersed in an IN aqueous sodium hydroxide solution, the resist was removed at a temperature of 25°C and an immersion time of 30 seconds, and the exposed portion of the aluminum vapor deposited layer was completely removed, while the remaining aluminum vapor layer of the resist was removed. It was confirmed that the brightness and darkness correspond almost completely to the original.

Example 3 A roll of polyethylene terephthalate film support in the form of a long strip and having a thickness of 100 μm was deposited in a semi-continuous deposition apparatus at a deposition angle of O.
is arranged so that the initial evaporation angle is θ5z40' (evaporation material aluminum L, second stage evaporation angle θxx80@ (evaporation material iron), the evaporation source is at two places, and the degree of vacuum is 5X.
A carbon crucible under a vacuum of 10-8 Torr? The aluminum and iron placed in the chamber are deposited by heating the deposited layer.

The film support is transported at a speed of 4 (1 m/-) for semi-continuous deposition. Aluminum and iron are vacuum deposited on the film support described above, and the transmission density of the film measured with a Macbeth transmission densitometer is the same as that of the deposited film. When the initial deposition angle θ1 is 40 @, the film thickness is 500 on the monitor so that the total film thickness is 3.5, and then the second stage of iron deposition is performed to obtain the deposited film. The film was wound up into a roll.

Next, in the same manner as in Example 1, a photosensitive resin layer was coated on the film surface of the vapor deposited layer, exposed and developed, and the remaining vapor deposited layer of resist was mixed with the original #υ! It was confirmed that the light and dark were completely reversed.

[Brief explanation of drawings]

FIGS. 1 and 2 are schematic diagrams showing an example of a vacuum evaporation apparatus used to obtain a metal evaporation layer in the present invention. 11 is the initial deposition angle, θ2 is the second stage deposition angle, l is the support, 2 is the evaporation source, 3 is the deposition sample, 4 is the shutter, 5 is the substrate holder, and 6 is the vacuum deposition container. Patent applicant Konishiroku Photo Industry Co., Ltd.

Claims (1)

[Claims] At least two metal vapor deposited layers are provided on the support, and the vapor deposition angle with respect to the skeleton support gradually increases from the support side, and a photosensitive resin layer is provided on the metal vapor deposition layer. A metal image-forming material characterized by: