JPS587366A - Registering jig - Google Patents

Abstract

PURPOSE:To obtain the captioned jig capable of bonding a multitude of thin plates to each other simultaneously with a positional accuracy of some degree by a method wherein an upper plate and a base plate are set to a guide plate and a second plate respectively and a pressure is impressed to the upper plate and the base plate through a piece of Teflon. CONSTITUTION:A piezoelectric element 10 is set on the guide plate worked with a groove meeting with the outer diameter of the piezoelectric element 10 and an adhesive agent is coated on the bonding surface thereof. The second plate 2 worked with a hole meeting with the outer diamter of the vibrating plate 11 is attached to the guide plate 1 through a guide pin 12 and the vibrating plate 11 is set. The base plate 3 to which a pin 13 is attached is secured to the guide plate 1 by butterfly nuts 14 together with springs 4. A pressing plate 5 to which resilient pins 15 are attached is secured to the base plate and a bonding pressure is provided to the piezoelectric element 10 and the vibrating plate 11 through the Teflon pieces 6. When the butterfly nuts 14 are loosed, the plates 1, 2 are separated from the bonding surfaces thereof by the springs 4.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an alignment jig for bonding a piezoelectric element to a diaphragm used in the head section of an inkjet printer, for example.

11 in the positioning when pasting two boards together
If the plates are relatively thick, bonding will be easier if the plate is relatively thick.

However, the plate is thin and deforms under small external forces. In such cases, this adhesion cannot be carried out so easily.

Moreover, it is very difficult to glue a large number of pieces at once with a positional accuracy of 6 S*! It becomes difficult.

The present invention takes these problems into consideration and provides an alignment tool that can simultaneously bond a large number of thin plates that can be easily deformed into a round shape by a small external force, and with a certain degree of positioning accuracy. .

Hereinafter, one embodiment of the present invention will be explained with reference to the drawings.

The outer diameter of the piezoelectric element is φ8. The thickness is o, sm, the outer diameter of the diaphragm is φ10, the thickness is 0.1■, and the order of 7OII is 1st.
This will be explained with reference to the figures and FIG.

First, set the piezoelectric element (1110, which has been processed to match the outer diameter) and set the K piezoelectric element (1) to the outer diameter of the diaphragm. A 9 #I2 plate (2) with matching round holes is attached to the guide grating (1) by 4 tons, and a diaphragm aυ is set on the guide grating (1) using a guide bin (2). Next, the base plate (3) with a bottle (2) that matches the outer diameter of the diaphragm is attached to the guide grate using the guide bottle and fixed with a woven nut.At this time, the spring (4) is Attach and fix to the guide bin at the same time.

The entire assembly is reversed, and a springy bottle α9 is attached to fix the holding plate (5) to the base grate (3), applying adhesive pressure between the piezoelectric element aQ and the diaphragm aυ. At this time, the bin a9 and piezoelectric element tAQ attached to the presser plate (5) are
to prevent the piezoelectric element a from being damaged by direct contact with the piezoelectric element a.
Insert the thiamine piece (6) so that adhesive pressure is evenly applied to the adhesive surface.

Finally, loosen the woven nut I that fixes the guide plate (1) and base plate (3), and use the spring (4) to separate it from the adhesive surface of the guide plate (1) and the second plate (2). Prevent (1) and (2) from adhering to the piezoelectric element frame and vibration @a theory.

FIG. 3 shows a cross section WAt in this bonded state.

Guide play) The depth of the groove in (1) is set to be as deep as the thickness of the piezoelectric element a-. This is because when handling piezoelectric elements of various types and thicknesses *b, the round piece is simultaneously attached to the presser plate (
5) When applying adhesive pressure using Kl, be sure to use this presser plate (
5) Rounding to ensure complete adhesion by the pressure of a bottle with nine springs attached. In this way, by increasing the number of each grate, a certain number of simultaneous gluings can be made possible, and by increasing the center of the hole between each grate, positioning accuracy can also be obtained.

[Brief explanation of drawings]

Figures 1 and 2 are perspective views showing the operation of an embodiment of positioning using the jig of the present invention, and Figure 3 is a cross-sectional view during bonding. (1)...Guide grate, (2)...Second grate. (3)...Base play), (4)...Spring. (5)... pressed board, (6)... thiamin piece. (7)...stud, goose...piezoelectric element. αF: Vibration plate. Figure 1 Figure 2

Claims (1)

[Claims] (1) A guide grate for setting the upper plate; a second grate for setting the board attached to the guide plate and positioned by a round guide pin; and a second grate for setting the board to be bonded to the upper plate; The board and top are fixed with said guide plate by wing nuts, and the board is supported through a pace plate and a piece of Tehun,
A positioning jig comprising: a presser plate that applies pressure to the plate; and a spring that lifts the guide plate and the second gate when the substrate and the upper plate are bonded together while being guided by the guide pins.