JPS586055A - Molded coil - Google Patents

Molded coil

Info

Publication number
JPS586055A
JPS586055A JP10337181A JP10337181A JPS586055A JP S586055 A JPS586055 A JP S586055A JP 10337181 A JP10337181 A JP 10337181A JP 10337181 A JP10337181 A JP 10337181A JP S586055 A JPS586055 A JP S586055A
Authority
JP
Japan
Prior art keywords
coil
shield layer
corona shield
molded
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10337181A
Other languages
Japanese (ja)
Inventor
Sadao Konishi
小西 貞男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10337181A priority Critical patent/JPS586055A/en
Publication of JPS586055A publication Critical patent/JPS586055A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/32Windings characterised by the shape, form or construction of the insulation
    • H02K3/40Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges

Abstract

PURPOSE:To obtain a coil having small dielectric tangent by grounding a low resistance corona shield layer of a coil at a position isolated for a lead wire, thereby sufficiently reducing the resistance value of the layer as compared with a main insulating layer. CONSTITUTION:A low resistance corona shield layer 4 is provided on the outer periphery of a main insulating layer 3, and a current flowing path 20 is formed between the layer 4 and the ground at the position isolated from a pair of lead wires 9a, 9b with a molded coil 1 molded integrally with a molding material as a whole, thereby grounding the shield layer. In this manner, the dielectric tangent of the coil 1 utilized for a linear motor ground installation coil for a vehicle can be reduced, thereby decreasing a dielectric loss.

Description

【発明の詳細な説明】 不発明はモールドコイルに係り、特に主として屋外で使
用さnる例えば車両用リニアモータ地上設合コイル等の
モールドコイルに関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molded coil, and particularly to a molded coil mainly used outdoors, such as a ground-mounted coil for a linear motor for a vehicle.

周知のように車両用リニアモータの地上コイルは、地上
に敷設さnた軌道に取り付けらnた車両を推進するコイ
ルである。このように軌道に取り付けらnて使用さnる
ので全天候に曝ざnるし、車載コイルによって生じる電
磁力の影響も受ける。
As is well known, the ground coil of a vehicle linear motor is a coil that propels a vehicle attached to a track laid on the ground. Since it is mounted on the track and used in this way, it is exposed to all weather conditions and is also affected by electromagnetic forces generated by on-vehicle coils.

このためこnらの苛酷な条件に耐えるよう一般に外装を
モールド材で堅牢にモールドしたモールドコイルが使用
さnる。
For this reason, a molded coil whose exterior is robustly molded with a molding material is generally used to withstand these harsh conditions.

このようなモールドコイルの従来例が第1図に示さnて
いる。モールドコイル1はコイル導体2を矩形状に複数
ターン巻回した周囲に、マイカを主体とした主絶縁層3
と、この主絶縁層3の外側に巻回さn*低抵抗コロナシ
ールド層4とで形成したコイル本体を、耐候性、耐水性
1機械的強度等の優扛たモールド材でモールドして製作
さ扛る。
A conventional example of such a molded coil is shown in FIG. The molded coil 1 includes a main insulating layer 3 mainly made of mica, which is formed by winding a coil conductor 2 into a rectangular shape with multiple turns.
A coil body formed by the n* low-resistance corona shield layer 4 wound around the outside of the main insulating layer 3 is molded with a molding material having excellent weather resistance, water resistance, 1 mechanical strength, etc. Explode.

モールド材トしてはシートモールディングコンパウンド
やレジンコンクリート等が用いらnl コイル本体の外
装5、リブ6および口出部の外装7等を同時に一体にモ
ールドして形成する。リプ6の部分には取付穴8が設け
らn、この取付穴8にボルトを通し、コンクリート軌道
に固定する。同図において93,9bは日出線である。
Sheet molding compound, resin concrete, etc. are used as the molding material, and the exterior 5, ribs 6, and exterior 7 of the outlet portion of the coil body are molded together at the same time. A mounting hole 8 is provided in the lip 6, and a bolt is passed through this mounting hole 8 to fix it to the concrete track. In the figure, 93 and 9b are the Hiji line.

なおシートチールディングコンパウンドとは樹脂例えば
不飽和ポリエステル樹脂に、ガラス短繊維や粉末フィシ
、触媒、内部雛形剤、顔料および増粘剤などを混入して
半硬化状に保持したシートであり、レジンコンク+7−
1とは、熱硬化性樹脂例えば不飽和ポリエステル樹脂に
砂利および砂を混入し几ものである。
A sheet chilling compound is a sheet made by mixing short glass fibers, powder fibres, catalysts, internal molding agents, pigments, thickeners, etc. into a resin such as unsaturated polyester resin and holding it in a semi-cured state. −
No. 1 is a method in which gravel and sand are mixed into a thermosetting resin such as an unsaturated polyester resin.

このようなモールドコイル1は一般の回転電機のコイル
寸法に比較して大きいため、第2図および第3図に示さ
nているように低抵抗コロナシールド層4の抵抗Rsが
主絶縁層3の等価並列抵抗Rpに比較して大きくて無視
できず、主絶縁層3の等価並列抵抗Rpの電流と同相の
電流が加算さn1誘電正接の値が大きくなる欠点があっ
た。誘電正接の値が大きくなると誘電体損が大きくなシ
モールドコイル1の劣化を早めるようになる。特に高電
圧になnばなる程誘電正接によって受ける影響は大きく
なるので問題である。なお第3図は第2図の主絶縁層3
および低抵抗コロナシールド層4の部分の等何回路であ
り、CPは主絶縁層3の等価並列静電容量である。
Since such a molded coil 1 is larger than the coil size of a general rotating electrical machine, the resistance Rs of the low resistance corona shield layer 4 is larger than that of the main insulating layer 3, as shown in FIGS. 2 and 3. It is too large to be ignored compared to the equivalent parallel resistance Rp, and has the drawback that the value of the dielectric loss tangent becomes large when the current in phase with the current of the equivalent parallel resistance Rp of the main insulating layer 3 is added. As the value of the dielectric loss tangent increases, the deterioration of the Simold coil 1, which has a large dielectric loss, accelerates. This is particularly problematic because the higher the voltage, the greater the influence of the dielectric loss tangent. Note that FIG. 3 shows the main insulating layer 3 of FIG.
and the equivalent circuit of the low-resistance corona shield layer 4, and CP is the equivalent parallel capacitance of the main insulating layer 3.

本発明は以上の点に鑑みなさ、f′したものであり、そ
の目的とするところは、誘電正接の小さなモールドコイ
ルを提供するにある。
In view of the above points, the present invention has been developed f', and its object is to provide a molded coil with a small dielectric loss tangent.

すなわち本発明は、口出線から離nfc、位置の低抵抗
コロナシールド層と地面の間に通電路を設け、低抵抗コ
ロナシールド層を接地するようにしたことを特徴とする
ものである。
That is, the present invention is characterized in that a current-carrying path is provided between the low-resistance corona shield layer located NFC away from the lead wire and the ground, and the low-resistance corona shield layer is grounded.

以下、図示した実施例に基づいて本発明を説明する。第
4図には本発明の一実施例が示さnている。なお従来と
同じ部品には同じ符号を付したので説明は省略する。本
実施例では日出線9a。
The present invention will be explained below based on the illustrated embodiments. FIG. 4 shows an embodiment of the present invention. Note that parts that are the same as those in the conventional model are given the same reference numerals, and therefore their explanations will be omitted. In this embodiment, it is the Hiji Line 9a.

9bからできるだけ遠い位置にある低抵抗コロナシール
ド層4の表面、すなわち日出線9a、9bが設けらnて
いる矩形状モールドコイル1の長辺と対向する位置の長
辺の中央部イ点に、導電塗料の上に裸銅線を数回巻回し
て接地端子1oとする。
At the surface of the low-resistance corona shield layer 4 at a position as far away from 9b as possible, that is, at a point A in the center of the long side of the rectangular molded coil 1 opposite to the long side where the sunrise lines 9a and 9b are provided. A bare copper wire is wound several times on top of the conductive paint to form a ground terminal 1o.

この接地端子10と接地さnたリード線11を接続して
、低抵抗コロナシールド層4と地面の間の通電路20を
形成し、低抵抗4コロナシールド層4を接地するように
した。そして接地端子1oを形成したのち低抵抗コロナ
シールド層4の外周をモールド材でモールドする。この
ように日出線9a。
This ground terminal 10 and a grounded lead wire 11 were connected to form a current conducting path 20 between the low resistance corona shield layer 4 and the ground, so that the low resistance corona shield layer 4 was grounded. After forming the ground terminal 1o, the outer periphery of the low resistance corona shield layer 4 is molded with a molding material. In this way, the Hiji Line 9a.

9bからできるだけ遠い位置の低抵抗コロナシールド層
4の表面に接地端子10を設けて接地するようにしたこ
とにより、低抵抗コロナシールド層4の抵抗値が、主絶
縁層3の等価並列抵抗に比較して無視、できるように小
さくなり、誘電正接の値が小さくなる。
By providing a grounding terminal 10 on the surface of the low resistance corona shield layer 4 at a position as far away from 9b as possible for grounding, the resistance value of the low resistance corona shield layer 4 is compared to the equivalent parallel resistance of the main insulating layer 3. If ignored, the value of the dielectric loss tangent will become smaller.

以上の実施例に関し、その誘電圧接の電圧特性を検討し
た結果を第5図に示した。同図において、実施例Aは日
出線が設けらnている矩形状モールドコイルの長辺と対
向する位置の長辺の中央部の低抵抗コロナシールド層の
表面イ部に接地端子を設けて接地したもの(第4図参照
)、実施例Bは矩形状モールドコイルの両短辺の中央部
の低抵抗コロナシールド層4の表面口、ハ部の2ケ所に
接地端子を設けて接地したもの(第4図参照)、実施例
Cはイ1ロ、ハ部の3ケ所に接地端子を設けて接地した
ものである。比較例D(d巻回した低抵抗コロナシール
ド層の全面にア、ルミ箔を巻回して電極としたもの、比
較例Eは従来の低抵抗コロナシールド層を巻回形成した
だけのものである。実施例A、B、Cはいずrも比較例
Eに比べ誘電正接の値(が1/3程度に小さくなってお
り、低抵抗コロナシールド層全面にアルミ箔電極を巻回
した比較例りの値に近い。接地端子を設ける作業工数で
は実施例Aが有利であり、特性上も十分満尼できるもの
でらる。
FIG. 5 shows the results of examining the voltage characteristics of the dielectric voltage contact in the above embodiments. In the figure, in Example A, a ground terminal is provided on the surface of the low-resistance corona shield layer at the center of the long side of the rectangular molded coil on which the sunrise wire is provided. Example B is a rectangular molded coil that is grounded by providing grounding terminals at two locations: the surface opening of the low-resistance corona shield layer 4 in the center of both short sides, and the C part. (See FIG. 4) In Example C, grounding terminals are provided at three locations, A, B, and C, for grounding. Comparative Example D (A) Aluminum foil was wound around the entire surface of the wound low-resistance corona shield layer to serve as an electrode. Comparative Example E was simply formed by winding a conventional low-resistance corona shield layer. .In Examples A, B, and C, the dielectric loss tangent value is about 1/3 smaller than that of Comparative Example E, and is a comparative example in which an aluminum foil electrode is wound over the entire surface of the low-resistance corona shield layer. Embodiment A is advantageous in terms of the number of man-hours required for providing the grounding terminal, and is sufficiently satisfactory in terms of characteristics.

上述のように本発明は、口出線から離fl−た位置の低
抵抗コロナシールド層と地面との間に通電路を設け、前
記低抵抗コロナシールド層を接地するようにしたので、
低抵抗コロナシールド層の抵抗値が主絶縁層の等価並列
抵抗と比較して無視できるように小さくなって、誘電正
接が小さくなり、誘電正接の小さいモールドコイルを得
ることができる。
As described above, in the present invention, a current-carrying path is provided between the low-resistance corona shield layer located at a distance from the lead wire and the ground, and the low-resistance corona shield layer is grounded.
The resistance value of the low-resistance corona shield layer becomes negligibly small compared to the equivalent parallel resistance of the main insulating layer, and the dielectric loss tangent becomes small, making it possible to obtain a molded coil with a small dielectric loss tangent.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のモールドコイルを示す一部破断斜視図、
第2図は第1図の横断平面図、第3図は第2図の主絶縁
層および低抵抗コロナシールド層の等節回路、第4図は
本発明のモールドコイルの一実施例の横断平面図、第5
図は本実施例および比較例のモールドコイルの誘電正接
と印加電圧の関係を示す比較特性図である。 1°゛°モールドコイル、3°°°主絶縁層、4・・・
低抵抗コロナシールド層、9a、9b・・・口出線、1
o・・・接地端子、11・・・接地さnたリード線、2
o・・・通電路。 第1 (B 72 図 第 3 図 第4L 図 第5I21
Fig. 1 is a partially cutaway perspective view showing a conventional molded coil;
2 is a cross-sectional plan view of FIG. 1, FIG. 3 is an equinodal circuit of the main insulating layer and low-resistance corona shield layer of FIG. 2, and FIG. 4 is a cross-sectional plane of an embodiment of the molded coil of the present invention. Figure, 5th
The figure is a comparative characteristic diagram showing the relationship between the dielectric loss tangent and the applied voltage of the molded coils of the present example and the comparative example. 1°° molded coil, 3°° main insulation layer, 4...
Low resistance corona shield layer, 9a, 9b... Lead wire, 1
o...Grounding terminal, 11...Grounding lead wire, 2
o... energized path. 1st (B 72 Figure 3 Figure 4L Figure 5I21

Claims (1)

【特許請求の範囲】 1、矩形状に巻回さnたコイル導体上に施さlrした主
絶縁層と、この主絶縁層に巻回さnた低抵抗コロナシー
ルド層と、前記巻回さ2″したコイル導体の巻始めと巻
終りから夫々引出さf′L、た日出線とを有し、こnら
全体をモールド材でモールドしてなるモールドコイルに
おいて、前記日出線かう離t′した位置の前記低抵抗コ
ロナシールド層と地面の間に通電路を設け、前記低抵抗
コロナシールド層を接地するようにしたことを特徴とす
るモールドコイル。 2、前記通電路は、前記低抵抗コロナシールド層の少な
くとも1ケ所に設けた接地端子と、接地はnたリード線
とで形成したものである特許請求の範囲第1項記載のモ
ールドコイル。
[Claims] 1. A main insulating layer provided on a coil conductor wound in a rectangular shape, a low resistance corona shield layer wound around this main insulating layer, and a low resistance corona shield layer wound around the main insulating layer; In a molded coil having a Hiji wire f'L and a Hiji wire drawn out from the winding start and end of a coil conductor, respectively, and the whole of these wires being molded with a molding material, the distance between the Hiji wire and the winding wire is t. A molded coil characterized in that a conductive path is provided between the low-resistance corona shield layer and the ground at a position such that the low-resistance corona shield layer is grounded.2. The molded coil according to claim 1, wherein the molded coil is formed by a grounding terminal provided at at least one location on the corona shield layer and a grounding lead wire.
JP10337181A 1981-07-03 1981-07-03 Molded coil Pending JPS586055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10337181A JPS586055A (en) 1981-07-03 1981-07-03 Molded coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337181A JPS586055A (en) 1981-07-03 1981-07-03 Molded coil

Publications (1)

Publication Number Publication Date
JPS586055A true JPS586055A (en) 1983-01-13

Family

ID=14352243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10337181A Pending JPS586055A (en) 1981-07-03 1981-07-03 Molded coil

Country Status (1)

Country Link
JP (1) JPS586055A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021092123A1 (en) * 2019-11-07 2021-05-14 Hyperloop Technologies, Inc. Electrical windings for a low pressure environment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021092123A1 (en) * 2019-11-07 2021-05-14 Hyperloop Technologies, Inc. Electrical windings for a low pressure environment
US11848595B2 (en) 2019-11-07 2023-12-19 Hyperloop Technologies, Inc. Channel segment for a track of a mover device
US11936271B2 (en) 2019-11-07 2024-03-19 Hyperloop Technologies, Inc. Replaceable windings for an electromagnetic machine
US11962212B2 (en) 2019-11-07 2024-04-16 Hyperloop Technologies, Inc. Electrical windings for a low pressure environment

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