JPS5860555A - Conveying device for wafer - Google Patents

Conveying device for wafer

Info

Publication number
JPS5860555A
JPS5860555A JP16062781A JP16062781A JPS5860555A JP S5860555 A JPS5860555 A JP S5860555A JP 16062781 A JP16062781 A JP 16062781A JP 16062781 A JP16062781 A JP 16062781A JP S5860555 A JPS5860555 A JP S5860555A
Authority
JP
Japan
Prior art keywords
case
shutter
pusher
wafer
conveyor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16062781A
Other languages
Japanese (ja)
Other versions
JPS618576B2 (en
Inventor
Kyohiko Kotani
小谷 教彦
Miyoshi Yoshida
吉田 美義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16062781A priority Critical patent/JPS5860555A/en
Publication of JPS5860555A publication Critical patent/JPS5860555A/en
Publication of JPS618576B2 publication Critical patent/JPS618576B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Reciprocating Conveyors (AREA)

Abstract

PURPOSE:To prevent dust from adhering to the surface of a water and thereby to improve the manufacturing yield of a device, by floating the wafer magnetically in vacuum for conveyance. CONSTITUTION:While a shutter 15 is opened, a case 7 holding wafers 6 and placed on a platform 14 is sent onto a conveyor 8 by a pusher 17, and the pusher 17 is returned, while the shutter 15 is closed. Under the condition, the case 7 holding the wafers 6 is conveyed, together with the conveyor 8, to a desired position by a normal or reverse operation of a motor or the like. The case 7 is taken out at the position in the following way. First the shutter 15 is opened for an entrance-exit member 13 exhausted to be under the pressure equal to that in a conveyance path 1, and the case 7 on the conveyor 8 is sent onto the platform 14 by a pusher 18. Then, the pusher 18 is once returned and the shutter 15 is closed. Thereafter, air is supplied into the entrance-exit member 13 to make the pressure inside the member 13 equal to the atmospheric pressure, and the case 7 holding the wafers 6 are taken outside through a door 19.

Description

【発明の詳細な説明】 この発明はウェハ搬送装置に関し、特にウェハへの1埃
などの付着を防止するようにしたウェハ搬送装置に係わ
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer transport device, and more particularly to a wafer transport device designed to prevent dust from adhering to the wafer.

半導体集積回路装置製造のために、ウェハな自動的に移
送する手段としてウェー・搬送装置が災用化されている
。この種の搬送装置にあっては、搬送中にウェー・に装
置自体が発生する騒埃とか、空気中の1埃が付着するこ
とがあ如、またウエノ1をケース中に収納するとしても
、ケースの開閉時に1埃が付着したりして装置の製造歩
留シ低下を避は得ないものであった。
Wafer transport devices are now being used as means for automatically transporting wafers in the production of semiconductor integrated circuit devices. With this type of conveyance device, there is a possibility that dust generated by the device itself or dust in the air may adhere to the wafer during conveyance, and even if the wafer 1 is stored in a case, When the case is opened and closed, dust may adhere to the case, which inevitably lowers the manufacturing yield of the device.

この発明は従来のこのような欠点を解消するため、ウェ
ー・を真空中で磁気的に浮上させて搬送するようにした
ものである。
In order to overcome these drawbacks of the conventional method, the present invention is designed to transport the wafer by magnetically levitating it in a vacuum.

以下、この発明装置の一実施例につき、添付図面を参照
して詳細に説明する。
Hereinafter, one embodiment of the inventive device will be described in detail with reference to the accompanying drawings.

第1図は装置全体のallを、l12図は搬送体を、第
31は送入出御の詳a’tそれぞれに示している。
Fig. 1 shows all of the entire apparatus, Fig. 12 shows the conveyor, and Fig. 31 shows details of the feed/output control.

これらの各図において、外部に対して密閉された搬送路
(Vは、内部路面(2jの中央にガイド溝(3)を形成
させ、かつこのガイド溝(3)に沿わせ九両側に磁11
ii (4m)、(4h)を配すると共に、搬送路FE
3を真空排気する九めの排気管(5)を取シ出しである
。またケース(7)に納めたウェハ(6)を、そのケー
ス毎搬送する搬送体(旦)には、下面に前記ガイド溝(
3)に遊嵌するガイド片(9)と、劫配各磁極(4a)
、(4b)に対向するそれぞれ同極性の磁極(10m)
、(10りとが設けられてシシ、これらの各磁極間の反
撥性にニジこの搬送体咀)は、ガイド溝(3)内にガイ
ド片(9)を一部遊嵌させたま\で無接触の状態に浮上
され、前後に止着されて滑車Q21を介して無端帯状に
懸架された搬送ワイヤαDt、図示省略した電動機など
によ)捲き掛けて作動させることによって、同搬送体径
1を搬送路Ill内で往復移動し得るようになっている
。さらに前記搬送路(υの適所にあって各側方にdX前
記ウェー・(6)を納めたケース(7)を搬送体(シ、
ひいては透体(段と同一高さ位置にあるプラットホーム
α41を有し、かつシャッタa優によプ搬送路(D内と
区分されると共に、搬送路内とは別に送入出s0内を排
給気するための排給気管αeが設けられ、かつまたケー
ス(7)を送入、出するためのブツシャαη・(Ill
を配し、さらに開閉扉α埠を設けたものである。
In each of these figures, a conveyance path (V) that is sealed from the outside is defined by a guide groove (3) formed in the center of the internal road surface (2j), and magnets 11 on both sides along the guide groove (3).
ii (4m) and (4h), and transport path FE.
The ninth exhaust pipe (5) that evacuates the air pump 3 is removed. In addition, the carrier (dan) that transports the wafer (6) housed in the case (7) in each case has the guide groove (
3) and the guide piece (9) that fits loosely into each magnetic pole (4a).
, (4b) with magnetic poles of the same polarity (10 m)
, (10 holes are provided, and the repulsion between these magnetic poles is different from this carrier). The conveyor wire αDt is floated in a state of contact, fixed at the front and rear, and suspended in an endless band shape via a pulley Q21, and is wound around and operated by an electric motor (not shown), thereby increasing the conveyor diameter 1. It is designed to be able to reciprocate within the transport path Ill. Further, the case (7) containing the dX way (6) at the appropriate position of the transport path (υ) is placed on the transport body (sh).
Furthermore, it has a platform α41 located at the same height as the transparent body (stage), and is separated from the conveyance path (D) by the shutter a, and the inlet/outlet s0 is discharged separately from the conveyance path. An exhaust air pipe αe is provided for transporting the case (7), and a button αη・(Ill
It also has an opening/closing door.

従ってこの実施例構成の場合、ウェー・(6)を納めた
ケース(力の送入は、まず送入山部0内に給気して同部
内を大気圧に等しくさせた上で、開閉扉0よシブラント
ホームa4上にケース(7Jを装入させ、ついて再びこ
の送人出部υ内を排気して同部内を搬送路(1)内に等
圧とし、この状態でシャッタ(15を開いてブツシャα
ηにより、プラットホームa尋上のケース(力を搬送体
但)上に送入させ、かつ同ブツシャαηを復帰し、シャ
ッタ崗を閉じる。そしてこの状態で図示省略した電動機
などの正もしくは逆転作動によシ、ウェー・(6)t−
納めたケース(7)を搬送体(旦)と共に所望の位置ま
で搬送させ、同位置でのケース(力の送出、すなわち取
り出しは、まず搬送路(1)内と等圧に排気された送入
山部(13に対し、シャッタ(LSt開いてブツシャ(
18により、搬送体(抑止のケース(7)をプラットホ
ームa◆上に送シ出した上で、一旦同ブツシャ(1mを
復帰し、シャッタ(19を閉じたのち、この送入出sυ
内に給気して同部内を大気圧に等しくさせ、この状態で
開閉扉α傷からウニ・・(6)を納めたケース(7)を
外部に取り出すのである。
Therefore, in the case of this embodiment configuration, the case containing the wave (6) (force is supplied first by supplying air into the inlet peak part 0 to equalize the pressure inside the same part to atmospheric pressure, and then opening/closing the door) 0, load the case (7J) onto the shibrant platform a4, then exhaust the inside of this sending outlet part υ again to equalize the pressure inside the conveying path (1), and in this state, close the shutter (15). Open and smack α
η causes the force to be sent onto the case (but the carrier) on the platform a, and the shutter αη is returned to close the shutter. In this state, if the electric motor (not shown) operates in the forward or reverse direction, the wave (6) t-
The stored case (7) is transported together with the transport body (dan) to the desired position, and the case (force is sent, that is, taken out) at the same position. Yamabe (for 13, the shutter (LSt opens and shuts) (
18, the conveyor (resistance case (7)
Air is supplied inside the chamber to equalize the pressure inside the chamber to atmospheric pressure, and in this state, the case (7) containing the sea urchins (6) is taken out from the opening/closing door α.

こ\でwJ記搬送路(1)内てO真空度はせいぜい1O
−2丁orr程度で充分であ)、従って搬送ワイヤ0υ
およびブツシャQη、aa部ての真空もれは問題でなく
、路内での1埃は迅速に排出されてウェハ(6)に付着
されることはなく、排気管(5)を適度の間隔で配設す
ることによって、仮令搬送路(11が長くても一様な真
9!W!を得られる。そして前記搬送体(塁)は配設磁
極相互の反撥力によル路面(2J土に浮上しているため
に摩擦が少なく、従って1埃の発生がなく、しかも駆動
力も小さくてすみ、また搬送体(シはそのガイド片(9
)を路面(23上のガイド溝(3)に遊嵌させているた
めに、常に搬送方向が規制されること\なシ、他物に突
き当る惧れもない。
Here, the degree of vacuum in the transport path (1) is at most 1O.
-2 orr is sufficient), therefore, the conveyor wire is 0υ
Vacuum leakage at the Qη, aa section is not a problem, and any dust in the path is quickly exhausted and does not adhere to the wafer (6), and the exhaust pipe (5) is connected at appropriate intervals. By arranging it, even if the temporary conveyance path (11) is long, a uniform true 9!W! can be obtained.Then, the conveyance body (base) is Because it is floating, there is less friction, so no dust is generated, and the driving force is small.
) is loosely fitted into the guide groove (3) on the road surface (23), so the conveying direction is always restricted and there is no risk of bumping into other objects.

なお前記5!施例では、ウェー・(6[を納めたケース
(7)の送出入動作を手動的に行なうようにしているが
、これらをすべて自動化することも可能である。
In addition, the above 5! In the embodiment, the loading/unloading operation of the case (7) containing the wire (6) is performed manually, but it is also possible to automate all of these operations.

以上詳述したようにこの発明によれば、牛導体集積回路
装置製逸の際Oウェー・の搬送を、真空とされた搬送路
内で行なわせるようにしたから、搬送中にウェハ面に願
埃が付滑せず、従って装置の製造歩留りを向上てき、し
かも限られた搬送路内とその送入山部の排気だけである
ので、クリーンルームを不要とし空気浄化の九めの電力
を大巾に節減でき、また搬送路内ては搬送体tl111
1s@互の反撥力によシ路面から浮上させた状態て搬送
させるようにしたから、搬送途中ての謳埃の発生を皆無
にし、併せて搬送動力が少なくてすむなどの特長がある
As described in detail above, according to the present invention, the O-wafer is transported in a vacuum transport path when fabricating a conductor integrated circuit device. Dust does not slip, which improves the manufacturing yield of the device.Moreover, since only the limited conveyance path and its inlet area are exhausted, a clean room is not required, and air purification requires a large amount of electricity. In addition, in the conveyance path, the conveyor tl111
Since it is conveyed while floating above the road surface due to mutual repulsion, there is no generation of dust during conveyance, and the conveyance power can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明に係わる搬送装置の一実施例による概
要構成図、第2図(a) 、 (1,)は同上搬送体の
端面および底面図、第3wJは同上送入山部の評細図で
ある。 (13・・拳e搬送路、(2)・・・−路面、(3)・
・・・ガイド溝、(4す、(4b)および(lOl)、
(lOb)・・・・磁極、(5)・−・・排気孔、(6
)・e・・ウェハ、(7)・・・・ケース、(8)・・
−・搬送体、(9)・・・・ガイド片、aI)・・・・
搬送ワイ−?、QJ−−−−送人出部、α4・・・・プ
ラットホーム、崗・・・・シャッタ、OQ・・・・給排
気孔、aη、(lid・・・・ブツシャ、01・・・・
開閉扉。
Fig. 1 is a schematic configuration diagram of one embodiment of the conveying device according to the present invention, Fig. 2 (a) and (1,) are end and bottom views of the same conveying body, and No. 3 wJ is an evaluation of the above-mentioned feeding mountain part. This is a detailed diagram. (13... fist e conveyance path, (2)... - road surface, (3)...
...Guide groove, (4s, (4b) and (lOl),
(lOb)...Magnetic pole, (5)...Exhaust hole, (6
)・e...Wafer, (7)...Case, (8)...
-・Carrier, (9)...Guide piece, aI)...
Transport? , QJ----Sender outlet, α4...Platform, Gate...Shutter, OQ...Intake/exhaust hole, aη, (lid...Butsusha, 01...
Opening/closing door.

Claims (1)

【特許請求の範囲】[Claims] 路1iiKガイド溝、シよびこのガイド溝に沿わせた磁
極を有して、内部を排気可能にした搬送路と、前記ガイ
ド溝に遊嵌されるガイド片、および前記am対向に同極
性の磁極を設けて浮上保持され、搬送ワイヤにより前記
搬送路内を往復移動する搬送体と、前記搬送路の適所に
配置さnて、前記搬送体面にはソ等しいプラットホーム
面を有し、また搬送路に対しシャッタを介して連通され
、かつ給排気可能にされてウェハを納めたケースをプラ
ットホーム面上に出し入れし得るようにすると共に、プ
ラットホーム面と搬送体面との間で、前記ケースを送人
出するブツシャを設けた送入出御とを備えたことを%黴
とするウェハ搬送装置。
Path 1ii A conveyance path having a K guide groove, a shi, and a magnetic pole along the guide groove so that the inside can be evacuated, a guide piece loosely fitted in the guide groove, and a magnetic pole of the same polarity opposite to the am. a conveyor body which is floated and held and reciprocated within the conveyance path by means of a conveyance wire; The case is communicated via a shutter and is configured to be able to be supplied with air and air, so that the case containing the wafer can be taken in and out of the platform surface, and the case is transported between the platform surface and the carrier surface. A wafer transfer device that is equipped with an inlet/output control equipped with a pusher.
JP16062781A 1981-10-06 1981-10-06 Conveying device for wafer Granted JPS5860555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16062781A JPS5860555A (en) 1981-10-06 1981-10-06 Conveying device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16062781A JPS5860555A (en) 1981-10-06 1981-10-06 Conveying device for wafer

Publications (2)

Publication Number Publication Date
JPS5860555A true JPS5860555A (en) 1983-04-11
JPS618576B2 JPS618576B2 (en) 1986-03-15

Family

ID=15719014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16062781A Granted JPS5860555A (en) 1981-10-06 1981-10-06 Conveying device for wafer

Country Status (1)

Country Link
JP (1) JPS5860555A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2697003A1 (en) * 1992-10-16 1994-04-22 Commissariat Energie Atomique System for handling and confining flat objects in individual boxes.
JP2011105446A (en) * 2009-11-17 2011-06-02 Miura:Kk Conveying apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2697003A1 (en) * 1992-10-16 1994-04-22 Commissariat Energie Atomique System for handling and confining flat objects in individual boxes.
EP0598633A1 (en) * 1992-10-16 1994-05-25 Commissariat A L'energie Atomique Handling and processing system for workpieces in individual boxes
JP2011105446A (en) * 2009-11-17 2011-06-02 Miura:Kk Conveying apparatus

Also Published As

Publication number Publication date
JPS618576B2 (en) 1986-03-15

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