JPS5857948A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS5857948A JPS5857948A JP56157056A JP15705681A JPS5857948A JP S5857948 A JPS5857948 A JP S5857948A JP 56157056 A JP56157056 A JP 56157056A JP 15705681 A JP15705681 A JP 15705681A JP S5857948 A JPS5857948 A JP S5857948A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- adhesive
- release film
- resin
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はアディティブ用積層板の製造方法に関する本の
で、積層板１の面部に接着剤塗布離ｍフィルム２の接着
剤側３を対向させて載置した積層体を鏡面板４に挾んで
から積層成形することを特徴とする積層板の製造方法に
係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a laminate for additive use, and the laminate is prepared by placing an adhesive-coated release film 2 on the surface of a laminate 1 with the adhesive side 3 facing the surface of the laminate 1. This relates to a method for manufacturing a laminate, which is characterized by sandwiching the plate between face plates 4 and then laminating the plate.
アディティブ法で積層板の表面に電路を形成してプリン
ト配線板を得るにあたって、アディティブ用の積層板と
して表面Ｋ１１着剤層を形成したものが用いられること
がある。かかる接着剤層を有する積層板を製造するにあ
たって、従来は積層成形で得られた積層板の表面に＋ｉ
［接接着剤を塗布、焼付けしたり、フィルムに予め接着
剤を塗布して。When forming electrical circuits on the surface of a laminate using an additive method to obtain a printed wiring board, a laminate with a K11 adhesive layer formed on the surface may be used as an additive laminate. In manufacturing a laminate having such an adhesive layer, conventionally, +i was added to the surface of the laminate obtained by lamination molding.
[Apply adhesive and bake, or apply adhesive to the film in advance.
おいてこれをプリプレグに重ね、積層成形する際に積層
板に接着剤層を転写したり、積層成形で得られた積層板
に接着剤付きのフィルムを熱ロールで圧着させて接着剤
層を積層板に転写したりする方法が採用されている。し
かしながらこれらの方法では接着剤層の厚みバラツキが
大であったり、鍍金鋼回路の引剥し強度の低下や手出耐
熱性の低下を発生させて−た。This is layered on prepreg, and the adhesive layer is transferred to the laminate during lamination molding, or the adhesive layer is laminated by pressing a film with adhesive onto the laminate obtained by lamination molding with a hot roll. A method of transferring the image onto a board is used. However, these methods have resulted in large variations in the thickness of the adhesive layer and a decrease in the peel strength and heat resistance of the plated steel circuit.
本発明は上記欠点を解決する本ので、積層板装造設備以
外の特別な設備を必要とすることなく接着剤層を形成す
ることができる積層板の製造方法を徒供することを目的
とする本のである。The present invention is a book that solves the above-mentioned drawbacks, and the purpose of the present invention is to provide a method for manufacturing a laminate that can form an adhesive layer without requiring special equipment other than laminate mounting equipment. It is.
以下本発明を実施例により鮮述する。積層板１は紙、布
、ガラス、合成繊維等の基材にフェノール樹脂、メラン
ン樹脂、不飽和ポリエステル樹脂、ジアリルフタレート
樹脂、エポキシ樹脂、ポリアミ′ド樹脂等の熱硬化性樹
脂やポリブタジェン、弗化樹脂、ポリエステル等の熱可
塑性樹脂のフェスを含浸させ熱圧成形によって得られる
ものである０蚊積層板１の片面又は両面に接着剤層をｍ
〜２００ミクロンの厚みで形成したアルミニウム、銅等
の金属フィルムやポリエステル、ポリプロピレン、弗化
樹脂、ポリイミド等のプラスチックフィルム等や離型紙
等の接着剤塗布離型フィルム２の接着剤側３を対向させ
て載置した積層体をステンレス鋼板、クロム鍍金鋼板、
真鍮板等の鋳面板４に挾んで積層成形するととによって
積層板を得るものである。この積層板は離型フィルムを
剥すことによってアディティブ用積層板とＬ７て使用さ
れる。この際、離型フィルムは平滑面で本よいが好筐し
くは粗面であることの方が接着剤と積層板との接着性及
び後工程の鍍金付着性がよく望ましい。又、積層成形条
件＃′ｉ特に限定す石本のでなく使用する積層板、接着
剤、離型フィルムの種類により自由に選択される本ので
あるが、成形圧力０〜１５０ＫＧ／ｄ−成型温度１００
〜２００℃、成形時間１０〜１００分が好ましい。更に
接着剤塗布離型フィルムの載置は積層板の片面又は両面
の各れでもよく自由に撰択できるものである。The present invention will be clearly described below with reference to Examples. The laminate 1 is made of a base material such as paper, cloth, glass, or synthetic fiber, and a thermosetting resin such as phenol resin, melane resin, unsaturated polyester resin, diallyl phthalate resin, epoxy resin, or polyamide resin, polybutadiene, or fluoride resin. An adhesive layer is applied on one or both sides of a mosquito laminate 1, which is obtained by impregnating a face of thermoplastic resin such as resin or polyester and hot-pressing it.
The adhesive side 3 of a release film 2 coated with an adhesive such as a metal film made of aluminum or copper or a plastic film made of polyester, polypropylene, fluorinated resin, polyimide, etc. or release paper formed with a thickness of ~200 microns is placed opposite to each other. The laminated body placed on a stainless steel plate, a chrome-plated steel plate,
A laminated plate is obtained by sandwiching the cast plate 4 such as a brass plate and laminating it. This laminate can be used as an additive laminate L7 by peeling off the release film. At this time, it is preferable that the release film has a smooth surface, but it is preferable that the release film has a rough surface to improve the adhesion between the adhesive and the laminate and the adhesion of plating in the subsequent process. In addition, lamination molding conditions #'i are not particularly limited by Ishimoto, but can be freely selected depending on the type of laminate, adhesive, and release film used, molding pressure 0 to 150 KG/d - molding temperature 100
~200°C and molding time of 10 to 100 minutes are preferred. Further, the adhesive-coated release film can be placed on either one side or both sides of the laminate, and can be freely selected.
上述のように本発明は積層板の面部に、接着剤塗布離型
フィルムの接着剤側を対向させて載置した積層体を、鏡
面板圧挟んでから積層成形する本ので積層板製造設備以
外の特別な設備を必要とせずに接着剤層を有する積層板
を得ることが出きる本のであり、従来のように接着剤層
の厚みバラツキが大きくなく、鍍金銅回路の引剥し強度
の低下や半田耐熱性の低下を発生することがかい本ので
ある。As mentioned above, the present invention involves placing a laminate on the surface of the laminate with the adhesive side of an adhesive-coated release film facing the opposite side, and pressing the mirrored plates together before forming the laminate. This book allows you to obtain a laminate with an adhesive layer without the need for special equipment, and there is no large variation in the thickness of the adhesive layer unlike in the past, and there is no reduction in the peel strength of plated copper circuits. This may cause a decrease in solder heat resistance.
図面は本発明の一実施例を示す分解断面図である。
１は積層板、２は接着剤塗布離型フィルム、３は接着剤
、４は鏡面板である。The drawing is an exploded sectional view showing an embodiment of the present invention. 1 is a laminate, 2 is an adhesive coated release film, 3 is an adhesive, and 4 is a mirror plate.
Claims (2)
側を対向させて載置した積層体を、鏡面板に挾んでから
積層成形することを特徴とする積層板の胸遣方法。(1) A method for mounting a laminate, which comprises placing a laminate with the adhesive side of an adhesive-coated release film facing the surface of the laminate, sandwiching the laminate between mirrored plates, and then forming the laminate.
請求の範囲８１項記載の積層板の製造方法。(2) The method for manufacturing a laminate according to claim 81, wherein the release film has a rough surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56157056A JPS5857948A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56157056A JPS5857948A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5857948A true JPS5857948A (en) | 1983-04-06 |
Family
ID=15641239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56157056A Pending JPS5857948A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857948A (en) |
-
1981
- 1981-10-01 JP JP56157056A patent/JPS5857948A/en active Pending
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