JPS5855198B1 - - Google Patents

Info

Publication number
JPS5855198B1
JPS5855198B1 JP46050407A JP5040771A JPS5855198B1 JP S5855198 B1 JPS5855198 B1 JP S5855198B1 JP 46050407 A JP46050407 A JP 46050407A JP 5040771 A JP5040771 A JP 5040771A JP S5855198 B1 JPS5855198 B1 JP S5855198B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP46050407A
Other languages
Japanese (ja)
Inventor
David D Peterson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NYUUKUREHOORU CORP
Original Assignee
NYUUKUREHOORU CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NYUUKUREHOORU CORP filed Critical NYUUKUREHOORU CORP
Publication of JPS5855198B1 publication Critical patent/JPS5855198B1/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP46050407A 1970-07-09 1971-07-09 Granted JPS5855198B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5349570A 1970-07-09 1970-07-09

Publications (1)

Publication Number Publication Date
JPS5855198B1 true JPS5855198B1 (enrdf_load_stackoverflow) 1983-12-08

Family

ID=21984672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46050407A Granted JPS5855198B1 (enrdf_load_stackoverflow) 1970-07-09 1971-07-09

Country Status (2)

Country Link
US (1) US3673017A (enrdf_load_stackoverflow)
JP (1) JPS5855198B1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61120899U (enrdf_load_stackoverflow) * 1985-01-16 1986-07-30

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4114983A (en) * 1977-02-18 1978-09-19 Minnesota Mining And Manufacturing Company Polymeric optical element having antireflecting surface
JPS5811101B2 (ja) * 1977-11-25 1983-03-01 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 半導体の表面処理方法
DE3064964D1 (en) * 1979-11-05 1983-10-27 Ibm Method of decreasing the optical reflectiveness of surfaces
DE3642897A1 (de) * 1986-12-16 1988-06-30 K O Prof Dr Thielheim Doppelbrechendes optisches material und verfahren zu seiner herstellung
US5904846A (en) * 1996-01-16 1999-05-18 Corning Costar Corporation Filter cartridge having track etched membranes and methods of making same
KR100477245B1 (ko) * 2002-07-05 2005-03-17 현대모비스 주식회사 에어백 모듈 일체형 혼 스위치
RU2220762C1 (ru) * 2002-09-24 2004-01-10 Объединенный Институт Ядерных Исследований Способ получения асимметричной трековой мембраны
US6967828B2 (en) * 2003-05-30 2005-11-22 Medtronic, Inc. Capacitors including metalized separators
US6995971B2 (en) * 2003-05-30 2006-02-07 Medtronic, Inc. Capacitors including interacting separators and surfactants
US6985352B2 (en) * 2003-05-30 2006-01-10 Medtronic, Inc. Capacitors including track-etched separator materials
US20050186404A1 (en) * 2004-02-23 2005-08-25 Guoping Mao Etched polycarbonate films
US7867290B2 (en) 2009-01-12 2011-01-11 Medtronic, Inc. Separator filled with electrolyte
CN109082084B (zh) * 2018-07-04 2021-06-29 温州大学 一种具有纳米孔道的高分子膜及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61120899U (enrdf_load_stackoverflow) * 1985-01-16 1986-07-30

Also Published As

Publication number Publication date
US3673017A (en) 1972-06-27

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