JPS5854180B2 - High strength and conductive copper alloy - Google Patents

High strength and conductive copper alloy

Info

Publication number
JPS5854180B2
JPS5854180B2 JP56053541A JP5354181A JPS5854180B2 JP S5854180 B2 JPS5854180 B2 JP S5854180B2 JP 56053541 A JP56053541 A JP 56053541A JP 5354181 A JP5354181 A JP 5354181A JP S5854180 B2 JPS5854180 B2 JP S5854180B2
Authority
JP
Japan
Prior art keywords
yttrium
tin
weight
copper
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56053541A
Other languages
Japanese (ja)
Other versions
JPS57169048A (en
Inventor
秀房 高原
秀年 小林
薫 佐藤
龍男 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP56053541A priority Critical patent/JPS5854180B2/en
Publication of JPS57169048A publication Critical patent/JPS57169048A/en
Publication of JPS5854180B2 publication Critical patent/JPS5854180B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は、銅−スズ合金の耐食性、耐摩耗性、耐熱性を
保持しつつ、導電性を著しく向上せしめた銅−スズ−イ
ツトリウム合金に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper-tin-yttrium alloy that has significantly improved electrical conductivity while maintaining the corrosion resistance, wear resistance, and heat resistance of the copper-tin alloy.

銅合金の有する種々の特性の中でも、優れた耐食性、耐
摩耗性が、近年大いに注目されている。
Among the various properties of copper alloys, their excellent corrosion resistance and wear resistance have attracted much attention in recent years.

この要請に答えるものとしては、従来から、銅スズ合金
が知られており、とくに、0.5重量%以上のスズを含
む銅−スズ合金は優れた耐食性、耐摩耗性を示す。
Copper-tin alloys have been known to meet this demand, and in particular, copper-tin alloys containing 0.5% by weight or more of tin exhibit excellent corrosion resistance and wear resistance.

しかしながら、銅にスズを添加すると導電性が大きく低
下するという欠点があった。
However, when tin is added to copper, the electrical conductivity is significantly reduced.

本発明者等は、先に、固溶したスズを含む銅に、さらに
イツトリウムを添加することにより、耐熱性を保持しつ
つ導電性を向上せしめうろことを見出し出願した(特願
昭55−109970)。
The inventors of the present invention previously discovered that by adding yttrium to copper containing solid solution tin, it was possible to improve conductivity while maintaining heat resistance and filed an application (Japanese Patent Application No. 55-109970). ).

そこでは、特に高導電性を必要とする電子材料としての
銅合金を考えたが、本発明は、むしろ耐食・耐摩耗材料
としての銅合金を対象とし、耐食性、耐摩耗性を保持し
た範囲内で導電性を改善すべく系統的な研究を行なった
結果なされたものである。
In that case, copper alloys were considered as electronic materials that particularly require high conductivity, but the present invention is more concerned with copper alloys as corrosion-resistant and wear-resistant materials, within the range that maintains corrosion resistance and wear resistance. This was the result of systematic research aimed at improving conductivity.

本発明者等は、スズを0.5重量%を越え1.0重量係
以下含む銅合金に対するイツl−IJウムの添加効果に
ついて鋭意検討した結果、酸素含有量を抑え、かつ、所
定量のイツトリウムを添か口することにより、耐食性、
耐摩耗性および耐熱性を保持しつつ、導電性を著しく改
善できることを見出した。
The present inventors have conducted intensive studies on the effect of adding I-IJ to copper alloys containing more than 0.5% by weight and less than 1.0% by weight of tin. Corrosion resistance is achieved by applying yttrium.
It has been found that electrical conductivity can be significantly improved while maintaining wear resistance and heat resistance.

イツトリウムの添加により高導電性銅合金が得られるの
は、イツトリウムがスズと金属間化合物を形成するため
と考える。
The reason why a highly conductive copper alloy can be obtained by adding yttrium is thought to be because yttrium forms an intermetallic compound with tin.

従来、スズーイツl−IJウム合金状態図は報告されて
おらず、スズとイツトリウムが金属間化合物を形成する
かどうかは未知であったが、本発明等がX線マイクロア
ナライザーにより検討したところ、スズとイツトリウム
とは金属間化合物を形成するものと認められた。
Up until now, the phase diagram of the tin-IJium alloy has not been reported, and it was unknown whether tin and yttrium form an intermetallic compound. However, when the present invention and others investigated using an and ythtrium were recognized to form intermetallic compounds.

スズとイツトリウムが金属間化合物を形成することによ
る分散強化効果により、銅−入袷金の優れた特性を損な
わず、固溶スズ量を低減させて導電性が向上するものと
考えられている。
It is believed that the dispersion strengthening effect caused by the formation of an intermetallic compound between tin and yttrium reduces the amount of solid solution tin and improves conductivity without impairing the excellent properties of the copper-filled metal.

イツl−IJウムがスズと金属間化合物を形成するため
には、イツトリウムが酸化状態であってはならず、その
ため酸素含有量を低くする必要がある。
In order for yttrium to form an intermetallic compound with tin, yttrium must not be in an oxidized state, so the oxygen content must be low.

本発明の高力高導電性銅合金は、以上の知見に基いてな
されたものであり、0.5重量幅を越え1.0重量%以
下のスズ(0,5<Snく1重量%)、0.1〜1.5
重量%のイツトリウム(0,1<Y<、 1.5重量%
)、0.01515重量%以下素および残部銅からなる
The high-strength, high-conductivity copper alloy of the present invention was created based on the above findings, and contains tin exceeding 0.5 weight range and 1.0 weight % or less (0.5<Sn 1 weight %). ,0.1~1.5
Yttrium (0,1<Y<, 1.5% by weight)
), consisting of 0.01515% by weight or less of elemental copper and the balance copper.

本発明の合金は、スズを0.5重量%を越え、ID重量
係以下含む。
The alloys of the present invention contain tin in excess of 0.5% by weight and below the ID weight percent.

スズが0.5重量%以下では、耐食性および耐摩耗性を
併せ良好ならしめるには十分でなく、また、to%を越
えると、導電率レベルが50 % I A CSを下回
り、これをイツトリウムの添加によって、レベル回復さ
せるには、多量のイツトリウムを必要としコスト面で実
用的でないためである。
If tin is less than 0.5% by weight, it is not sufficient to provide a good combination of corrosion and wear resistance, and if it exceeds to%, the conductivity level will drop below 50% IACS, which is lower than that of yttrium. This is because adding yttrium to restore the level requires a large amount of yttrium, which is impractical in terms of cost.

本発明の合金はイツトリウムを0.1〜1.5重量係合
む。
The alloys of the present invention contain 0.1 to 1.5 yttrium by weight.

所要インl−IJウム量は固溶スズ量に依存するもので
あり、0.1重料係未満では、残存固溶スズ量が多いた
め導電性が十分に改善されず、また、1.5重量%を越
えると、固溶スズの全部を金属間化合物に変換してもな
お余剰のイツトリウムが存在し、これが鋼中に固溶する
ため逆に導電率が低下する傾向を示すと共にコスト的に
も不利になる。
The required amount of Inl-IJ depends on the amount of solid solution tin, and if the weight ratio is less than 0.1, the conductivity will not be sufficiently improved due to the large amount of residual solid solution tin, and if it is less than 0.1 If it exceeds the weight percentage, even if all of the solid solute tin is converted into an intermetallic compound, there will still be surplus yttrium, which will become solid solution in the steel, which will tend to reduce the electrical conductivity and reduce the cost. will also be disadvantageous.

酸素を0.015重量重量子に限定しているのは、0.
015重量重量%えると、添加したインl−IJウムが
¥203の形の酸化物として失なわれ損失となる割合が
無視できなくなるからである。
The reason why oxygen is limited to 0.015 gravitons is 0.015.
This is because if the amount is increased by 0.15% by weight, the added Inl-IJium is lost as an oxide in the form of ¥203, and the loss rate becomes non-negligible.

因みに、0、O]、5重量%の酸素は原子数にして9.
4.X]−0−6N個(N:アボガドロ数)に相当する
が、この酸素原子がすべてイツトリウムと結合し¥20
3の形をとったとすると、失なわれるイツトリウム量は
、である。
Incidentally, 0, O], 5% by weight of oxygen has an atomic number of 9.
4. X]-0-6N (N: Avogadro's number), but all of these oxygen atoms combine with yttrium and
3, the amount of yttrium lost is .

この値は、存在する酸素がすべてイツトリウムと結合し
た場合を仮定しているが、実際には酸素の一部はCu
20の形で存在するはずであり、それだけ酸化物として
失なわれるイツトリウム量は低下する。
This value assumes that all the existing oxygen is combined with yttrium, but in reality some of the oxygen is combined with Cu.
The amount of yttrium that is lost as oxides decreases accordingly.

いずれにしろ、本発明の合金は0.1〜15重量係のイ
ツトリウムを含むので、0.015重量重量子の酸素の
存在によるイツトリウムの損失があっても、なお金属間
化合物を形成するに十分なイツトリウムが存在すること
になる。
In any event, since the alloys of the present invention contain between 0.1 and 15 gravitons of yttrium, the loss of yttrium due to the presence of 0.015 gravitons of oxygen is still sufficient to form intermetallic compounds. Therefore, there is a large amount of yztrium.

以下に、本発明の実施例を示す。Examples of the present invention are shown below.

実施例 市販の電気銅地金と電解スズを、木炭被覆を十分に行な
って1150〜12500Cで溶解し、これにイツトリ
ウムをCu−10%Y母合金の形で所要量になるように
添加した。
Example Commercially available electrolytic copper ingots and electrolytic tin were sufficiently coated with charcoal and melted at 1150 to 12500 C, and yttrium was added thereto in the form of a Cu-10% Y master alloy in the required amount.

ついで、0.01重重量%リンを加えて脱酸した後、金
型に鋳造し、厚さ30mmの鋳塊を得た。
Then, after deoxidizing by adding 0.01 wt % phosphorus, the ingot was cast into a mold to obtain an ingot with a thickness of 30 mm.

この鋳塊を、面削(両面2〜3關)後、800℃で1時
間加熱して熱間圧延し、厚さ107n7ILの板を得た
This ingot was face-milled (2 to 3 times on both sides), heated at 800° C. for 1 hour, and hot-rolled to obtain a plate having a thickness of 107n7IL.

その後550〜600℃で30分間焼鈍し、酸洗し、つ
いで冷間圧延により2mm厚の板を得た。
Thereafter, it was annealed at 550 to 600°C for 30 minutes, pickled, and then cold rolled to obtain a 2 mm thick plate.

ついで、450’Cで1時間最終焼鈍後、酸洗し、仕上
げ圧延を施し、所望の加工率の条を得、これらについて
、導電率、耐熱性、耐摩耗性および耐食性の測定を行な
う試料とした。
Then, after final annealing at 450'C for 1 hour, pickling and finish rolling were performed to obtain strips with a desired working rate. did.

なお各試料の組成を表−1に示す。The composition of each sample is shown in Table 1.

(1)導電率の測定 JISで規定する重量法にて、ダブルブリッジ法を用い
て行なった。
(1) Measurement of electrical conductivity The conductivity was measured using the double bridge method according to the gravimetric method specified in JIS.

(2)耐熱性の測定 JI85号試験片にてインストロン試験機を用い、加工
率50係の材料について後記の表=1に示す各温吠に1
時間保持後の抗張力で示した。
(2) Measurement of heat resistance Using a JI No. 85 test piece using an Instron testing machine, 1 for each temperature shown in Table 1 below for materials with a processing rate of 50.
It is expressed as the tensile strength after holding for a certain period of time.

(1)および(2)の試験結果を表−1に示す。The test results of (1) and (2) are shown in Table-1.

(3)耐摩耗性 試料A4およびA5について、アムスラー型金属摩耗試
験機を用い、時間の関数として摩耗量を測定した。
(3) Wear resistance For samples A4 and A5, the amount of wear was measured as a function of time using an Amsler metal wear tester.

(3)の測定結果を第1図に示す。The measurement results of (3) are shown in FIG.

第1図において○印は試料A4、・印は試料A5の測定
結果である。
In FIG. 1, the ○ mark is the measurement result of sample A4, and the * mark is the measurement result of sample A5.

(4)耐食性の測定(応力腐食試験) マトソン氏液(0,2mail硫酸銅、 1.0mo
7硫酸アンモン、1.omolアンモニア)中に静的曲
げ応力(応力値=耐力)を付加したまま24Hr浸漬し
た、試料のサイズは100 X11.5 Xl、
0 ”mm、試料保持方法は第2図に示す。
(4) Measurement of corrosion resistance (stress corrosion test) Matson's solution (0.2mail copper sulfate, 1.0mo
7 ammonium sulfate, 1. The sample size was 100 x 11.5
0”mm, the sample holding method is shown in Figure 2.

図中1は試料、2は治具を示す。In the figure, 1 indicates a sample and 2 indicates a jig.

浸漬前後の重量減量率と引張強度から応力腐食性を評価
した。
Stress corrosion resistance was evaluated from the weight loss rate and tensile strength before and after immersion.

試料結果を表−2に示す。The sample results are shown in Table-2.

表 2から明らかな如く、減量率はY含有合金の方が小さく
耐食性に優れていることがわかる。
As is clear from Table 2, the Y-containing alloy has a smaller weight loss rate and is superior in corrosion resistance.

以上の試験結果から明らかなように、従来の銅−スズ合
金(試料AI、4.6)に比較して、本発明の合金(試
料$2 p 3+ 5* 7 )は、耐熱性、耐摩耗性
、耐食性を保持しつつ、著しく大きな導電率の向上を示
す。
As is clear from the above test results, compared to the conventional copper-tin alloy (sample AI, 4.6), the alloy of the present invention (sample $2p3+5*7) has better heat resistance and wear resistance. It shows a significant improvement in electrical conductivity while maintaining properties and corrosion resistance.

因みに、試料層3についてみてみると、0.64%の固
溶スズを全部S n Y2の形の金属間化合物(その存
在については、さらに学問的見地からの研究を必要とす
ら)に転換させたと仮定したとき必要とするイツトリウ
ム量は、 0.64 (Xl0−”N)X2 19 Nx89x 102=0.96 (w t 、%) (但し、Nはアボガドロ数を表わす。
By the way, looking at sample layer 3, all of the 0.64% solid solution tin was converted into an intermetallic compound in the form of Sn Y2 (its existence even requires further research from an academic standpoint). Assuming that, the amount of yttrium required is 0.64 (Xl0-''N)X2 19 Nx89x 102 = 0.96 (wt, %) (However, N represents Avogadro's number.

)であり、試料A3中のイツトリウムの値に近いと言え
る。
), which can be said to be close to the value of yttrium in sample A3.

以上のように、本発明によれば、イツトリウムを添加す
ることにより、高導電性を有する耐摩耗耐食材料を得る
ことができるので、例えばトロリー線など、広範な用途
が期待できる。
As described above, according to the present invention, by adding yttrium, it is possible to obtain a wear-resistant and corrosion-resistant material having high conductivity, so that a wide range of applications such as trolley wires can be expected.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は摩耗時間と摩耗量の関係について示すグラフで
ある。 第2図は応力腐食試験の試料の保持方法について示す側
面図である。
FIG. 1 is a graph showing the relationship between wear time and wear amount. FIG. 2 is a side view showing a method of holding a sample for a stress corrosion test.

Claims (1)

【特許請求の範囲】[Claims] 10,5重量%を越え1.0重量%以下のスズ、0.1
〜1.5重量%のイツトリウム、0.01515重量%
以下素および残部鋼からなる高力高導電性鋼合金。
More than 10.5% by weight and less than 1.0% by weight of tin, 0.1
~1.5% yttrium, 0.01515% by weight
A high-strength, high-conductivity steel alloy consisting of the following elements:
JP56053541A 1981-04-09 1981-04-09 High strength and conductive copper alloy Expired JPS5854180B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56053541A JPS5854180B2 (en) 1981-04-09 1981-04-09 High strength and conductive copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56053541A JPS5854180B2 (en) 1981-04-09 1981-04-09 High strength and conductive copper alloy

Publications (2)

Publication Number Publication Date
JPS57169048A JPS57169048A (en) 1982-10-18
JPS5854180B2 true JPS5854180B2 (en) 1983-12-03

Family

ID=12945657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56053541A Expired JPS5854180B2 (en) 1981-04-09 1981-04-09 High strength and conductive copper alloy

Country Status (1)

Country Link
JP (1) JPS5854180B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134766A (en) * 1984-07-26 1986-02-19 Matsushita Electric Ind Co Ltd Drop-out compensating circuit
WO1994010352A1 (en) * 1992-10-27 1994-05-11 Mitsubishi Materials Corporation Pitting-resistant copper alloy pipe for water and hot-water supply
WO1994014989A1 (en) * 1992-12-22 1994-07-07 Mitsubishi Materials Corporation Cold- and hot-water piping made of pitting-resistant copper alloy

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347287A (en) * 1976-10-13 1978-04-27 Oki Electric Ind Co Ltd Independent gate structure photo switch

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347287A (en) * 1976-10-13 1978-04-27 Oki Electric Ind Co Ltd Independent gate structure photo switch

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134766A (en) * 1984-07-26 1986-02-19 Matsushita Electric Ind Co Ltd Drop-out compensating circuit
WO1994010352A1 (en) * 1992-10-27 1994-05-11 Mitsubishi Materials Corporation Pitting-resistant copper alloy pipe for water and hot-water supply
WO1994014989A1 (en) * 1992-12-22 1994-07-07 Mitsubishi Materials Corporation Cold- and hot-water piping made of pitting-resistant copper alloy

Also Published As

Publication number Publication date
JPS57169048A (en) 1982-10-18

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