JPS5851986Y2 - Painted electronic parts shaping equipment - Google Patents

Description

[Detailed description of the invention] Conventionally, a cylindrical electronic component P with lead wires 1 protruding from both ends.
(For example, small resistors, etc.) are coated with resin, and this coating process usually involves transporting the electronic components using a conveyor chain 3 with a specially shaped attachment 2. The paint is applied to the surface by a heating method or an electrostatic method, and the paint is passed through a heating furnace to heat and melt the paint and spread it over the entire outer periphery of the electronic component to form a paint layer 4, and then leave it as it is. The coating process is completed by continuous heating or by heating again in a heating furnace to thermally cure (the paint mainly uses an epoxy resin-based thermosetting resin).

However, the painted electronic components described above have the following drawbacks, and a solution to these problems has been strongly desired.

(1) Finished electronic components have a gourd or cocoon shape as shown in Figure 5, making them difficult to handle in the next process (e.g., stamping, taping, insert machine, etc.), especially in the stamping process, etc. It is difficult to stamp, and stamping errors and uneven stamping are likely to occur.

(2) The external dimensions are not uniform, the L dimension is not uniform, and it inevitably becomes long, making it difficult to achieve the manufacturing objective of making the dimensions as close as possible to those of electronic components.

(3) Since the paint adhering to electronic parts is simply melted and applied, pinholes may be formed due to air bubbles, and the painted surface cannot be finished neatly, and the adhesion to electronic parts is also poor.

The present invention was devised to solve the above-mentioned conventional drawbacks.
A cylindrical electronic component P with lead wires 1 protruding from both ends (
For example, in a conveyance line in which small resistors) are conveyed by the conveyance chain 3, paint is attached to the electronic components P,
This is passed through a heating furnace to melt the adhered paint and form a paste-like paint layer on the outer circumferential surface of the part P, and then the paste-like paint layer is heated artificially (e.g., by air cooling) or naturally (e.g., over time). When the electronic component P is made into a plastic state, the electronic component P having the irregularly shaped plastic paint layer formed on the outer circumferential surface is fed between the rotating bodies A and B arranged vertically inside the conveyor chain, and the Body A
Applying pressure and rotation between the outer peripheral surfaces of B, the part P is rolled and shaped into a cylindrical shape, and a painted finished electronic part P is formed into a perfect cylindrical shape, instead of the traditional cylindrical shape. This relates to a vertical device that can

A specific embodiment of the present invention will be described below.The present invention is carried out in a conveyance line of a conveyance chain 3 that holds and conveys the lead wire 1 of a cylindrical electronic component P having a lead wire 1 protruding from both ends with an attachment 2. In addition, a coating device 5 for the electronic component P, a heating furnace 6, 6' for heating and melting the paint deposited by the coating device and heat curing the molten paint, and a device 7 for stamping the painted electronic component P, etc. In the equipment installed in series, a rotation is applied to the inside of the conveyor chain 3 following the heating furnace 6 by elastically pressing a part of the outer peripheral surface of the electronic component P on the conveyor chain 3 from above to rotate the electronic component P. A rotating body A is installed, and a rotating body B that presses a part of the outer peripheral surface of the electronic component P from below and rotates in a direction opposite to the rotational direction of the electronic component P is installed opposite to the rotating body A. .

The rotating body A may be, for example, a relatively elastic disk 8 as shown in FIG. Rotates in the same direction with adjustable rotation speed.

Further, the rotating body A has an outer circumferential surface 11 having a width commensurate with the dimensions of the electronic component P, and a part of the outer circumferential surface 11 is connected to the electronic component P from above.
It shall be pressed elastically by any method.

Further, the rotating body B is a disk with a relatively large diameter, and like the rotating body A, it has an outer circumferential surface 12 with a width commensurate with the dimensions of the electronic component P. Depending on the shape, etc., it is formed into a cross-sectional shape such as 49 holes in FIG. 3, for example.

The rotating body A connects a part of the outer circumferential surface 12 with the electronic component P from below.
The electronic component P is pressed into contact with the electronic component P using an arbitrary method, and rotates in the opposite direction to the rotation direction of the electronic component P, that is, in the opposite direction to the rotating body A, so that the rotation speed can be adjusted as well.

Therefore, for example, when the rotational speed of this rotating body A is increased, the rotational speed of the electronic component P is also increased.

The rotating body A and the rotating body B are arranged in a direction in which one axis is in a fixed position and the other is pressed against the electronic component P by any method (for example, by suspending the axis of the rotating body on an arm and tensioning the arm with a spring). It is possible to have the rotating body act on the rotary body, or to make it act on both sides mutually, and it is also possible to change the installation position up and down (rotating body A at the bottom and B at the top).

In addition, 13 in the drawing is a guide plate.

In the present invention, in the above structure, the paint adhered to the electronic component P is heated and melted in the heating furnace 6 to become a soft paste-like paint layer, and then this paint layer is artificially or naturally put into a plastic state. At this point, the electronic component P with the irregularly shaped plastic paint layer formed on the outer peripheral surface is transferred to the rotating body A using the conveyor chain 3.
, B.

The electronic component P sandwiched between the outer circumferential surfaces 11 and 12 of the rotating bodies A and B, which rotate at increasing speeds in opposite directions, rotates while being pressurized from above and below, thereby forming the paint layer 4 into a perfect cylindrical shape. The rotating bodies A and B are then rolled and shaped, conveyed to the conveyor chain 3, and released from the sandwiched state between the rotating bodies A and B, and then entered into the heating furnace 6' for thermosetting to complete the painting and shaping process. Proceed to the stamping process, etc.

As described above, in the present invention, the paint layer 4 of the electronic component P in a plastic state is pressurized and rotated between the outer circumferential surfaces of the rotating bodies A and B, and shaped into a perfect cylindrical shape. Therefore, as a device, it is sufficient to install the rotating bodies A and B with the above configuration in the conveyance line, and the electronic component P shaped by this device may have the following extremely simple features: (1) A true cylindrical shape. Therefore, the next process such as stamping becomes easier and the performance of the product can be improved.

(2) Since rolling circular shaping is performed, the external dimensions are uniform, and the L dimension can also be finished uniformly as desired.

(3) Rolling and pressure shaping eliminates pinholes caused by air bubbles in the paint layer and on the surface, resulting in a clean appearance, and the paint adheres tightly to electronic components, creating a strong paint layer that is difficult to peel off. Therefore, the performance of electronic components can be improved.

[Brief explanation of the drawing]

Fig. 1 is a front view of the proposed device, Fig. 2 is a sectional view taken along the line A-A, Fig. 3 is a partial sectional view of the rotating body B, and Fig. 4 is a front view of an embodiment of the proposed device. , 5A and 5B are views showing the shaped electronic component according to the present invention, 2 and E are diagrams showing the shaping order, G is a conventional electronic component, and FIG. 6 is an explanatory diagram of the arrangement of various devices in the conveyance line. Attachment amount, A, B...Rotating body, P...Electronic component, 1...Lead wire, 2...Attachment for conveyor chain 3, 4. ...Paint layer, 5
...Painting equipment, 6,6'...Heating furnace,
7... Stamping device, 8, 9, 9'... Disc, 10... Belt, 11.12...
Each outer peripheral surface of rotating bodies A and B, 13... guide plate.

Claims (1)

[Scope of utility model registration request] A conveyor chain that holds and conveys the lead wire of the electronic component P with an attachment, and a conveyor chain that is inside the conveyor chain,
A rotating body A press-contacts a part of the outer peripheral surface of the electronic component P on the chain from above to rotate the electronic component P, and the electronic component P.
A part of the outer circumferential surface of the electronic component P is pressed against the rotating body B which rotates in the opposite direction to the rotational direction of the electronic component P, forming an irregularly shaped plastic paint layer on the outer circumferential surface of the electronic component P. A device for shaping a coated electronic component, characterized in that the component P is rolled and shaped into a cylindrical shape by applying pressure and rotation between the outer peripheral surfaces of the rotating bodies A and B.