JPS5850748A - Unit for processing semiconductor - Google Patents

Abstract

PURPOSE:To improve the yield by effecting uniform treatment by a method wherein wafers are carried into one after another and then carried out of each of several wafer holders automatically. CONSTITUTION:A wafer 2 is carried to a stopper 15 through a guide 11, and then a transfer intermediate guide 12 is roated 90 deg. and the stopper 15 is released. The wafer 2 is then passed to a wafer holder 3 by means of a pusher 13, and is placed in a processing liquid 7, for a desired treatment. The wafer 2 thus transported is rotated by a rotating motor 4 and, with the next wafer holder 3 positioned in alignment with an exit 9, is placed back in the wafer holder 3. After treatment in the processing liquid 7, the wafer 2 is sent to a water tank 17, and is transported in a procedure reverse to the carrying-in procedure, by the pusher 13, stopper 15, and the transfer intermediate guide 12, and then transported by a guide 16. After rinsing, the wafer 2 is taken out of a cleaning tank 1 into the next stage processing.

Description

[Detailed description of the invention] The present invention relates to semiconductor processing equipment.

Generally, when processing a semiconductor in the process of manufacturing semiconductor products, the resist is removed by heating the processing liquid to a high temperature of 80G to 100G, for example, in a resist removal device, or by etching. There is Zuiko duck. In this case, the wafer is housed in a cartridge, and the cartridge is lifted by a handle and carried into the processing tank. In a mechanism that automatically performs this operation, it is necessary to automatically transport the handle.

This has the disadvantage that the processing equipment becomes larger.

In conventional equipment, wafers are processed in cartridges, so if UNINO 1 comes into contact with processing liquids that have different temperatures and concentrations depending on the storage location, processing may fail. It becomes uniform. Furthermore, since the cartridge itself is brought into the processing liquid, the temperature around the cartridge is subject to large changes, and the temperature of the processing liquid becomes unstable.

SUMMARY OF THE INVENTION An object of the present invention is to provide a compact semiconductor processing apparatus which can eliminate the drawbacks of the prior art, uniformly process sea urchins, and which is compact.

In order to achieve this object, the present invention is configured to automatically carry in and take out Unino one by one into a plurality of Unino 1 holders provided in a processing tank.

The present invention will be further explained below with reference to embodiments shown in the drawings.

FIG. 1 is a perspective view showing one embodiment of a semiconductor processing apparatus according to the present invention, and FIG. 2 is a cross-sectional view of an 11-piece thereof.

In this embodiment, reference numeral 1 denotes a cleaning tank, and in this cleaning tank 1, there are a plurality of wafer holders 3 in the circumferential direction, each of which can accommodate one wafer 2 in the vertical direction, for example, 1 f.
There are about 30 of them. First, the holder 3 can be rotated by a rotary motor 4. As is clear from FIG. 2, the wafer holder 3 has a heating section 5 made of quartz material and insulation lB6 and t on the outside thereof, and the processing liquid 7 or the wafer 2 is sufficiently applied inside the heating section 50. It is housed in such a way that it can be accommodated.

The heating unit 5 has a built-in heater that heats the processing liquid to a predetermined high temperature of 7%.

The entire cleaning tank can be covered with a lid 8 containing a heat insulating material, which acts as a trap to prevent the heat of the processing liquid 7 from dissipating to the outside. A part of the lid 8 has an entrance 9 for loading and unloading the wafer 2 into and out of the wafer holder 3.
is pickpocketed in the radial direction.

It is shaped like a toe.

On the other hand, in this embodiment, the wafer 2 is held in the wafer holder 3.
A guide 11 that guides the wafer 2 is used as a mechanism for loading and unloading the wafer. The wafer 2 taken from the guide 11 is transferred to the guide 3.

Transfer intermediate guide 12. It includes a pusher 13 that can move up and down to receive and pass the wafer 2 between the cough transfer intermediate guide 12 and the wafer holder 3. The transfer intermediate guide 12 is connected to the rotating shaft 14
It can be rotated (swung) clockwise by 90 degrees from the horizontal state to the vertical state shown in FIG. Two 15's are placed.

Further, on the downstream side of the intermediate transfer guide 12, a guide 16 is provided for receiving the wafer 2 that has been processed with the processing liquid 7 from the intermediate transfer guide 12 and placing it in the washing tank 17.
is located.

Next, the operation of this embodiment will be explained.

It will be processed! C2 is first conveyed through the guide 11 to the stopper 15 position of the transfer intermediate guide 12 and stopped. In this state, when the intermediate transfer guide 12 is rotated 90 degrees clockwise by the rotating shaft 14, the S intermediate guide 12 becomes straight. Thereafter, the stopper 15 is opened, the wafer 2 is transferred from the intermediate guide 12 to the wafer holder 3 by the squeezer 13 (FIG. 2), and the wafer 2 is immersed in the processing liquid 7 to perform the desired processing. In this way, 411 wafers 2 are loaded into the wafer holder 3, and the first wafer 2 is transferred to the wafer holder 3 by the rotary motor 4.
The wafers are rotated by a predetermined amount so that the next wafer holder 3 is aligned with the opening 9 of the lid 8, so that the wafers are loaded one by one into each wafer holder 3.

The wafer 2 that has been subjected to the predetermined treatment using the treatment liquid 7 is transferred to the bushing 13 by an operation opposite to the carrying-in operation. Stopper 15. The material is sent from the transfer intermediate guide 12 to the washing tank 17 via the guide 16, and after the washing process +L- is completed, it is sent from the washing tank 17 to the next processing type.

In this embodiment, the sea urchins/4 are fed into the processing liquid 7 in the tank one by one, and since the wafer 2 moves in the processing liquid 7 in the tank, the processing liquid 7 that comes into contact with the wafer 2 is All of them are in the same condition.

Further, since only the wafer 2 enters the bath, fluctuations in the temperature inside a are small, uniform processing is obtained, and the yield can be improved. Further, since the wafers 2 are processed one by one, the entire apparatus is compact.

The lid 8 can also suppress heat dissipation from inside the tank to a minimum.

As explained above, according to the present invention, the yield can be improved by uniformly treating sea urchins, and moreover, a compact structure can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a semiconductor soul processing device according to the present invention, and FIG. 2m is a half sectional view taken along line 1 in FIG. l...Cleaning tank, 2...Wafer, 3...Wafer holder. 4... Rotating motor, 5... Heating section, 6... Heat insulation section, 7... Processing liquid, 8... Lid %9... Entrance/exit, ll
...Guide, 12...Transfer intermediate guide, 13...
Gutsusha, 14... rotating wheel, 15... stopper,
16...Guide, 17...Washing tank. Figure 1 Figure 2 201

Claims (1)

[Scope of Claims] 1. A plurality of wafer holders into which wafers are placed one by one are provided in the processing tank, and the transported wafers are automatically transferred one by one into the two wafer holders and transferred to the wafers. A semiconductor processing device equipped with two loading and unloading mechanisms for unloading from a holder. □ 2. The loading and unloading mechanism consists of a transfer intermediate guide rotatable around a rotation axis, a stopper, and a pusher that passes the wafer between the transfer intermediate guide and the holder. A semiconductor processing apparatus according to claim 1.