JPS58501648A - 冷却手段を備えた半導体組立体 - Google Patents

冷却手段を備えた半導体組立体

Info

Publication number
JPS58501648A
JPS58501648A JP82500649A JP50064982A JPS58501648A JP S58501648 A JPS58501648 A JP S58501648A JP 82500649 A JP82500649 A JP 82500649A JP 50064982 A JP50064982 A JP 50064982A JP S58501648 A JPS58501648 A JP S58501648A
Authority
JP
Japan
Prior art keywords
chip
semiconductor assembly
semiconductor
alloy
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP82500649A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222531B2 (OSRAM
Inventor
ハツサン、ヤバンチユ・ケイ
オクタイ、セブジン
パイバナス、ジヨン・エイ
スペクター、クラレンス・ジエイ
Original Assignee
インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション filed Critical インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション
Publication of JPS58501648A publication Critical patent/JPS58501648A/ja
Publication of JPS6222531B2 publication Critical patent/JPS6222531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP82500649A 1981-12-29 1981-12-29 冷却手段を備えた半導体組立体 Granted JPS58501648A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1981/001754 WO1983002363A1 (en) 1981-12-29 1981-12-29 Cooling means for integrated circuit chip device

Publications (2)

Publication Number Publication Date
JPS58501648A true JPS58501648A (ja) 1983-09-29
JPS6222531B2 JPS6222531B2 (OSRAM) 1987-05-19

Family

ID=22161583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP82500649A Granted JPS58501648A (ja) 1981-12-29 1981-12-29 冷却手段を備えた半導体組立体

Country Status (4)

Country Link
EP (1) EP0097157B1 (OSRAM)
JP (1) JPS58501648A (OSRAM)
DE (1) DE3176475D1 (OSRAM)
WO (1) WO1983002363A1 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS6115353A (ja) * 1984-06-29 1986-01-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション チツプ冷却装置
DE19802117C1 (de) * 1998-01-21 1999-06-02 Fne Gmbh Thermisch steuerbare Anordnung
KR102228516B1 (ko) * 2019-08-05 2021-03-16 엘지전자 주식회사 다수의 사용자가 포함된 사용자 그룹을 운송하는 자율 주행 차량 및 이의 제어 방법과, 상기 자율 주행 차량을 제어하는 제어 서버

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271638A (en) * 1963-11-04 1966-09-06 Emil M Murad Encased semiconductor with heat conductive and protective insulative encapsulation
US3536460A (en) * 1966-12-28 1970-10-27 Great Lakes Carbon Corp Connections between electrical conductors and carbon bodies and method of making same
US3449818A (en) * 1967-05-16 1969-06-17 North American Rockwell Superconductor joint
US3996447A (en) * 1974-11-29 1976-12-07 Texas Instruments Incorporated PTC resistance heater
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites

Also Published As

Publication number Publication date
WO1983002363A1 (en) 1983-07-07
EP0097157A4 (en) 1985-03-08
EP0097157B1 (en) 1987-09-30
JPS6222531B2 (OSRAM) 1987-05-19
EP0097157A1 (en) 1984-01-04
DE3176475D1 (en) 1987-11-05

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