JPS5848990A - Integrated circuit part coating resin - Google Patents

Integrated circuit part coating resin

Info

Publication number
JPS5848990A
JPS5848990A JP14852981A JP14852981A JPS5848990A JP S5848990 A JPS5848990 A JP S5848990A JP 14852981 A JP14852981 A JP 14852981A JP 14852981 A JP14852981 A JP 14852981A JP S5848990 A JPS5848990 A JP S5848990A
Authority
JP
Japan
Prior art keywords
integrated circuit
resin
coating resin
circuit part
part coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14852981A
Other languages
Japanese (ja)
Inventor
宗野 隆一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14852981A priority Critical patent/JPS5848990A/en
Publication of JPS5848990A publication Critical patent/JPS5848990A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は洗濯機等の水を取扱う装置に用いて最適な集積
回路部品被覆用樹脂に関するもので、集積回路部品への
湿度による悪影響を防止することを目的とするものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin for covering integrated circuit components that is most suitable for use in equipment that handles water such as washing machines, and is intended to prevent the adverse effects of humidity on integrated circuit components. It is.

集積回路(I O)部品の進歩にともない、家庭電化製
品の中にもマイクロコンビュ、−夕を応用したものが増
えてきた。洗濯機もその1つであるが、マイクロコンピ
ュータ回路部に使用されているIC部品は湿度によって
特性が変化しやすく、本来の特性を維持するためには耐
湿性に優れた絶縁樹脂で被覆する必要がある。しかしな
がら、IC部品は被覆する樹脂の電気特性、硬化収縮な
どによっても特性が変化しやすく、洗濯機に使用する場
合、季節1設置場所によシ使用温度が大きく変ることか
ら、被覆用樹脂の電気特性や硬度(硬化収縮)が温度に
よって変化しないことが必要であり、かつ洗剤を使用す
るため樹脂表面にキレンなどを生じないことが要求され
る。
With the advancement of integrated circuit (IO) components, the number of home appliances that utilize microcomputers has increased. Washing machines are one such example, but the characteristics of IC components used in microcomputer circuits tend to change depending on humidity, and in order to maintain their original characteristics, they must be coated with an insulating resin that has excellent moisture resistance. There is. However, the characteristics of IC parts tend to change depending on the electrical properties of the resin they are coated with, curing shrinkage, etc., and when used in a washing machine, the operating temperature varies greatly depending on the season and the installation location. It is necessary that the properties and hardness (curing shrinkage) do not change due to temperature, and since a detergent is used, it is required that the resin surface does not generate dust.

本発明は上記点に鑑みて成されたものであり、分子両末
端に水酸基を有する液状ポリブタジェンオリゴマーをイ
ンシアネートで架橋させて得られるゴム状物質を使用す
ることにより、耐湿性、電気特性、耐洗剤性に優れ、温
度による硬度変化の少ないIC部品被覆用樹脂を提供す
るものである。
The present invention has been made in view of the above points, and by using a rubber-like substance obtained by crosslinking a liquid polybutadiene oligomer having hydroxyl groups at both ends of the molecule with incyanate, it has improved moisture resistance and electrical properties. The present invention provides a resin for covering IC parts that has excellent detergent resistance and little change in hardness due to temperature.

分子両末端に水酸基を有する液状ポリブタジェン(例え
ば1・4ポリブタジエン、出光石油化学展、R−4sH
T)は、パラフィン系、ナフテン系オイルと相溶性がよ
いため、ディピング、2、ケ塗りなどの塗布方法にあっ
た任意の粘度が自由に選択でき、かつ、これをインシア
ネートで架橋した硬化物は、−20〜30℃で大きな硬
度変化が々く、3− 電気特性(ε、  j2Lnδ等)、体積抵抗もほとん
ど変化しない。まだ、耐湿性、耐洗剤性においても、体
積抵抗の劣化9表面状態の悪化などがない。従って、オ
イルにより任意の粘度に調整し、インシアネートで架橋
した液状ポリブタジェンをIC部品に被覆することによ
り、高湿度下における特性の悪化を防止することができ
る。
Liquid polybutadiene with hydroxyl groups at both ends of the molecule (e.g. 1,4 polybutadiene, Idemitsu Petrochemical Exhibition, R-4sH
T) has good compatibility with paraffinic and naphthenic oils, so any viscosity that suits the application method such as dipping, coating, etc. can be freely selected, and it is a cured product that is crosslinked with incyanate. There is a large change in hardness at -20 to 30°C, and 3- electrical properties (ε, j2Lnδ, etc.) and volume resistance hardly change. There is still no deterioration in volume resistivity or surface condition in terms of moisture resistance and detergent resistance. Therefore, by coating IC components with liquid polybutadiene that has been adjusted to a desired viscosity with oil and crosslinked with incyanate, it is possible to prevent the characteristics from deteriorating under high humidity conditions.

以下に本発明の実施例を示す。Examples of the present invention are shown below.

プリント基板にNTR線を5朋間隔でハンダ付けした上
に、ポリブタジェンを31nmの厚さで被覆し、85℃
96%R)!中での線間の体積抵抗を測定した。組成を
第1表、体積抵抗の変化を第2表に示す。また第2表に
は、参考として市販のポリウレタンを被覆した場合の値
も併せて示す。
NTR wires were soldered to the printed circuit board at 5-wire intervals, coated with polybutadiene to a thickness of 31 nm, and heated at 85°C.
96%R)! The volume resistance between the wires inside was measured. The composition is shown in Table 1, and the change in volume resistance is shown in Table 2. Table 2 also shows, as a reference, the values when coated with commercially available polyurethane.

第1表 第2表 (85℃95チRH) 第2表から明らかなように、本発明の被覆用樹脂は50
時間が経過した後も体積抵抗に変化がなく、優れた特性
を示している。
Table 1 Table 2 (85°C, 95°RH) As is clear from Table 2, the coating resin of the present invention
There was no change in volume resistivity even after the passage of time, indicating excellent characteristics.

次に、第1表のN11の組成の樹脂を用い、−20℃〜
30’C,の温度範囲での硬度変化をJISゴム硬度計
で測定した。その結果を第3表に示すが。
Next, using a resin having the composition of N11 in Table 1, -20℃~
Changes in hardness in a temperature range of 30'C were measured using a JIS rubber hardness meter. The results are shown in Table 3.

本発明の樹脂はこの範囲において十分な硬度を有してい
る。
The resin of the present invention has sufficient hardness within this range.

6−1 第3表 次に、上述の場合と同様に、第1表の隘1の組成の樹脂
を用い、2.0〜2.5 mmt、  65φに注型し
た円板で一20℃、1000時間までの誘電率。
6-1 Table 3 Next, in the same way as in the above case, using the resin having the composition of No. 1 in Table 1, cast a disc with a diameter of 2.0 to 2.5 mm and 65φ at -20°C. Dielectric constant up to 1000 hours.

誘電正接9体積抵抗を測定した。その結果を第1図、第
2図、第3図に示す、 更に、第1表の陥1の組成の樹脂を用い、2・0〜2.
5 mmt、  65φに注型した円板を60℃1%ザ
ブ(商品名)水溶液中に浸漬し、1oOo時間までの誘
電率、誘電正接1体積抵抗の測定と表面状態を観察した
。その結果、表面状態には同等変化がなかった。また、
この時の測定値を第4図。
Dielectric loss tangent 9 volume resistance was measured. The results are shown in FIGS. 1, 2, and 3.Furthermore, using the resin having the composition in Table 1, 2.0 to 2.0 to 2.0.
A cast disc having a diameter of 5 mm and a diameter of 65 φ was immersed in a 1% Zabu (trade name) aqueous solution at 60° C., and the dielectric constant, dielectric loss tangent, and volume resistance were measured and the surface condition was observed for up to 100 hours. As a result, there was no equivalent change in the surface condition. Also,
Figure 4 shows the measured values at this time.

第6図、第6図に示す。It is shown in FIG.

以上の説明および各図に示した結果から明らかなように
、本発明の被覆用樹脂を用いることにより、湿度、洗剤
等によるXC部品の特性の劣化を防止することができる
ため、洗濯機などの水を取扱う機器に使用した場合、そ
の信頼性を大幅に改善でき、産業上の価値の大なるもの
である。
As is clear from the above explanation and the results shown in each figure, by using the coating resin of the present invention, it is possible to prevent the characteristics of XC parts from deteriorating due to humidity, detergent, etc. When used in equipment that handles water, it can greatly improve its reliability and is of great industrial value.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図、第3図、第4図、第5図、第6図は本
発明に係る集積回路部品被覆用樹脂の時間に対する各種
特性の変化を示す図である。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第2図 第3図 第4図 1 清    吟間、i 第5図 □□□1下 第6図 時間(Ar)
FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, and FIG. 6 are diagrams showing changes in various characteristics over time of the resin for covering integrated circuit components according to the present invention. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4 Figure 1 Sei Ginma, i Figure 5 □□□1 Lower Figure 6 Time (Ar)

Claims (1)

【特許請求の範囲】[Claims] 分子両末端に水酸基を有する液状ポリブタジェンオリゴ
マーを主成分とし、これをインシアネートで架橋させて
得られるゴム状物質から成ることを特徴とする集積回路
部品被覆用樹脂。
1. A resin for covering integrated circuit parts, characterized in that the main component is a liquid polybutadiene oligomer having hydroxyl groups at both ends of the molecule, and a rubber-like substance obtained by crosslinking this with incyanate.
JP14852981A 1981-09-18 1981-09-18 Integrated circuit part coating resin Pending JPS5848990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14852981A JPS5848990A (en) 1981-09-18 1981-09-18 Integrated circuit part coating resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14852981A JPS5848990A (en) 1981-09-18 1981-09-18 Integrated circuit part coating resin

Publications (1)

Publication Number Publication Date
JPS5848990A true JPS5848990A (en) 1983-03-23

Family

ID=15454816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14852981A Pending JPS5848990A (en) 1981-09-18 1981-09-18 Integrated circuit part coating resin

Country Status (1)

Country Link
JP (1) JPS5848990A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61114876U (en) * 1984-12-28 1986-07-19
JPS63263795A (en) * 1987-04-22 1988-10-31 日東電工株式会社 Electronic component mounting circuit board
JPH01281668A (en) * 1987-05-20 1989-11-13 Sanyo Electric Co Ltd Alkaline storage battery and manufacture thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61114876U (en) * 1984-12-28 1986-07-19
JPH0238464Y2 (en) * 1984-12-28 1990-10-17
JPS63263795A (en) * 1987-04-22 1988-10-31 日東電工株式会社 Electronic component mounting circuit board
JPH01281668A (en) * 1987-05-20 1989-11-13 Sanyo Electric Co Ltd Alkaline storage battery and manufacture thereof
US4880435A (en) * 1987-05-20 1989-11-14 Sanyo Electric Co., Ltd. Alkaline storage cell and manufacturing method therefor
JP2584280B2 (en) * 1987-05-20 1997-02-26 三洋電機株式会社 Alkaline storage battery and method of manufacturing the same

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