JPS5846660A - Manufacture of heat sink - Google Patents
Manufacture of heat sinkInfo
- Publication number
- JPS5846660A JPS5846660A JP14520481A JP14520481A JPS5846660A JP S5846660 A JPS5846660 A JP S5846660A JP 14520481 A JP14520481 A JP 14520481A JP 14520481 A JP14520481 A JP 14520481A JP S5846660 A JPS5846660 A JP S5846660A
- Authority
- JP
- Japan
- Prior art keywords
- fins
- heat sink
- fin
- manufacturing
- fin member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はトランジスタ等を取付けるヒートシンクの製造
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a heat sink for mounting transistors and the like.
通信機器、AC−DC″3ンバータ等の電子機器におい
ては、発熱し且つ熱影響を受けるトランジスタやIC等
をヒートシンクに取付けて配置し、それ自体の温度上昇
を抑えることでランアウェイさらにはブレークダウンす
ることを防止している。In electronic equipment such as communication equipment and AC-DC converters, transistors, ICs, etc. that generate heat and are affected by heat are mounted on heat sinks to prevent runaway or even breakdown by suppressing their own temperature rise. It prevents you from doing so.
出力が大容量の機器においてはそれ相応に放熱容量の大
きなヒートシンクが必要となる。Equipment with a large output capacity requires a heat sink with a correspondingly large heat dissipation capacity.
従来のヒートシンクは一般に第1図に示す如く、熱伝導
率の大きなアルミニウム金属材を押出し加工し、トラン
ジスタ等の取付面IAを有する取付部lと放熱用のフィ
ン2とを一体成形している。As shown in FIG. 1, a conventional heat sink is generally made by extruding aluminum metal material with high thermal conductivity, and integrally molds a mounting portion l having a mounting surface IA for a transistor, etc., and heat dissipation fins 2.
しかし押出し加工法によれば、フィン2の高さhおよび
ピンチPが押出し装置による制約を受ける−例えば放熱
面積を増すためにフィン2の高さhを大きくするには取
付部1の厚さtを不適当に厚くしなけ五ばできず、ピッ
チPも大きくなる。このために望まれる大容量の放熱性
能を得ることが困難になる。However, according to the extrusion processing method, the height h and pinch P of the fin 2 are limited by the extrusion device. This cannot be done without making it inappropriately thick, and the pitch P also becomes large. This makes it difficult to obtain the desired large capacity heat dissipation performance.
このために例えば第2図に示す如く、トランジスタ等の
取付部1に溝1′を形成し、この溝1′にフィンプレー
ト2を植設して伝熱性に優れた合成樹脂剤で接着したシ
ろう付は固着する方法が知られている。しかしこの方法
は組立て作業が繁雑となり、取付部lとフィンプレート
2との間の伝熱性の信頼性が低い。さらにろう付けの場
合には取付部1に対してフィンプレート2の板厚が薄く
、長さが長いためにろう付温度に熱せられた時にフィン
プレート2が一点鎖線のように熱変形し、製品として好
ましくない形状に仕上ってしまうのを避は難く。これを
避けるための適当なろう付治具が従来なかった。また第
3図に示す如く端縁2Aを折曲げ九フィンプレート2を
積ねて配置し、取付部1にプレージングシート3を介し
てろう付は固着する方法も知られているが、同様に一点
鎖線で示すように変形する欠点を避は難い。フィンプレ
ート2の変形を防止するために例えば第4図に示す如く
両面にろう材をクラッドした板2′を用いてハニカム構
造として剛性を高めると、接合部分が増して組立作業が
繁雑となると同時に、過剰なろうが必要以上に接合部よ
りはみ出して中を通る流体の通過抵抗を増大させてしま
うことになる。また何れの方法においても接合部分の剥
離を生じる可能性が大きく、冷却ファン等の振部で異音
を発生するような不具合も起り得る。For this purpose, for example, as shown in Fig. 2, a groove 1' is formed in the mounting part 1 for the transistor, etc., and a fin plate 2 is planted in this groove 1' and bonded with a synthetic resin with excellent heat conductivity. Brazing is a known method of fixing. However, this method requires complicated assembly work, and the reliability of heat transfer between the mounting portion 1 and the fin plate 2 is low. Furthermore, in the case of brazing, the thickness of the fin plate 2 is thinner and longer than the mounting part 1, so when it is heated to the brazing temperature, the fin plate 2 is thermally deformed as shown by the dashed line. It is difficult to avoid ending up with an undesirable shape. Conventionally, there was no suitable brazing jig to avoid this problem. Furthermore, as shown in FIG. 3, a method is known in which nine fin plates 2 are stacked by bending their edges 2A, and are brazed to the mounting portion 1 via a plating sheet 3. It is difficult to avoid the drawback of deformation as shown by the dashed line. In order to prevent deformation of the fin plate 2, for example, as shown in FIG. 4, if a plate 2' clad with brazing metal on both sides is used to increase the rigidity as a honeycomb structure, the number of joints increases and the assembly work becomes complicated. In this case, the excess solder protrudes beyond the joint and increases the resistance to passage of fluid through the joint. In addition, in either method, there is a high possibility that the bonded portion will peel off, and problems such as abnormal noises may occur in the vibrating part of the cooling fan or the like.
本発明はこれらの従来技術の欠点を排除し、大放熱容量
のヒートシンクを容易に製造できる製造法の提供を目的
とする。The present invention aims to eliminate these drawbacks of the prior art and provide a manufacturing method that can easily manufacture a heat sink with a large heat dissipation capacity.
この念めに本発明の製造法は、2枚のフィンと、両フィ
ンを間隔を置いた状態で連結する補強部とを有する略々
梯子状断面のフィン部材を押出し加工し、このフィン部
材を隣接フィン部材との間にてフィン間隔を有するよう
に配置して取付部に固着することを特徴とする、
すなわち、多数のフィンを一体に押出し加工するうえで
のピッチ等の問題を2枚のフィンのみ押出し加工するこ
とで解決し、しかも2枚のフィンの間に補強部を形成す
ることによりフィン長さの長いフィンの押出し加工を可
能にするとともK。In order to keep this in mind, the manufacturing method of the present invention involves extruding a fin member having a roughly ladder-like cross section, which has two fins and a reinforcing portion that connects both fins with a space between them. The fins are arranged so that there is a fin spacing between adjacent fin members and are fixed to the mounting part. In other words, problems such as pitch when extruding a large number of fins as one body can be solved by combining two fins. This problem can be solved by extruding only the fins, and by forming a reinforcing part between two fins, it is possible to extrude long fins.
補強部によってフィン部材の剛性を高めてろう何時の熱
変形を防止するものである。The reinforcement portion increases the rigidity of the fin member to prevent thermal deformation during soldering.
以下に本発明の製造法により作られる好ましいヒートシ
ンクの実施例にもとづき第5図〜第8図を参照して説明
する。A preferred embodiment of a heat sink manufactured by the manufacturing method of the present invention will be described below with reference to FIGS. 5 to 8.
第5図に示すヒートシンクは、一対の取付部10の間に
、・2枚のフィyllA、IIBおよびその間を結合す
る補強部11Cを一体に押出し加工したフィン部材11
を並べて配置し、各端面と取付部10との間に両面ろう
材クラッドのプレージングシート12を介装してろう付
は固着した構造のものである。このように両面ろう材ク
ラッドのブレ、−ジ/グシー)120代わシに、ろう材
のみよりなる薄板を用いることや、あるいは、取付部l
。The heat sink shown in FIG. 5 has a fin member 11 formed by integrally extruding two fins A and IIB and a reinforcing part 11C connecting them between a pair of mounting parts 10.
are arranged side by side, and a plating sheet 12 made of double-sided brazing material cladding is interposed between each end face and the mounting portion 10 to securely braze them. In this way, it is possible to use a thin plate made only of brazing material instead of the double-sided brazing material cladding, or to use a thin plate made of only brazing material, or
.
自体を片面ろう材クラッド板となしプレージングシート
を使用しないようにすることができる。このヒートシン
クでは例えばトランジスタ(図示せず)は取付面10A
に公知手段で取付けられる。It is possible to avoid the use of a single-sided braze metal clad plate and no plating sheet. In this heat sink, for example, a transistor (not shown) is attached to the mounting surface 10A.
be attached by known means.
また図示していないがこのヒートシンクは冷却用のファ
ンで紙面に垂直な方向へ送風冷却するようになすことが
好ましい。Although not shown, it is preferable that the heat sink be cooled by blowing air in a direction perpendicular to the paper surface using a cooling fan.
このフィン部材11は両端にフィン外面間寸法より幅広
のボス11Dが一体に形成されており、ボス側面同志を
密着させて各フィン部材11を積ね合わせることによシ
各フィン部材間のフィン間隔dを定められるようになっ
ている。従ってフィン部材間のフィン間隔dは製造上の
制約を受けることなく任意に(細かく)設定できる。フ
ィン部材11を固着する取付部10は別体加工されるの
であるから、この肉厚tも使用態様に合せて各々適当に
選定できる。This fin member 11 is integrally formed with a boss 11D wider than the dimension between the outer surfaces of the fins at both ends, and by stacking each fin member 11 with the sides of the boss in close contact with each other, the fin spacing between each fin member can be adjusted. d can be determined. Therefore, the fin spacing d between the fin members can be arbitrarily (finely) set without being subject to manufacturing restrictions. Since the mounting portion 10 for fixing the fin member 11 is processed separately, the wall thickness t can be appropriately selected depending on the usage mode.
ここで、フィン部材11の押出し加工につき説明すれば
、このように補強部11Ct−有する略々梯子状断面と
されていることから、補強部11Cの存在が金属の流れ
に好ましく作用してフィン長さhを大巾に長くできる。Here, to explain the extrusion process of the fin member 11, since it has a substantially ladder-like cross section with the reinforcing part 11Ct, the existence of the reinforcing part 11C has a favorable effect on the metal flow, and the fin length is The length can be made very long.
例えばフィンIIAおよび補強部11Cの肉厚t′を1
mとした場合、押出し加工によってフィン部材11にお
けるフィン間隔d′を約2mに、またフィン長さhを約
120−程度に成形できることが確認されている。For example, the thickness t' of the fin IIA and the reinforcing part 11C is 1
It has been confirmed that the fin member 11 can be formed with a fin spacing d' of about 2 m and a fin length h of about 120 m by extrusion.
このようなフィン部材11を押出し加工し、一対の取付
部10の間にろう付けする本発明の製造法によれば、フ
ィン部材11の曲げ剛性が著しく高まり、ろう付は時の
締付は力および加熱によるフィンIIAの変形を回避で
きる。また押付は力を高めることで密着性および固着の
信頼性も高め得る。また製造されたヒートシンクはフィ
ンIIAの間隔が細かく且つフィン長さhが大きいこと
から放熱容量が大巾に向上される、
第6図はフィン部材の他の実施例を示す。このフィン部
材は端部のボス20の側端に互いに嵌合する突部20A
および凹部20Bを形成したことを特徴とする。このよ
うな突部20Aおよび凹部20Bの形成はフィン部材の
積ね合せ作業を容易化する効果を得られる。またフィン
部材は押出し加工するので、突部および凹部の加工精度
が扁く、取付部に対する密着性を悪化させることにはな
らない。According to the manufacturing method of the present invention in which such a fin member 11 is extruded and brazed between a pair of attachment parts 10, the bending rigidity of the fin member 11 is significantly increased, and the tightening force during brazing is reduced. Also, deformation of the fin IIA due to heating can be avoided. Furthermore, by increasing the pressing force, the reliability of adhesion and fixation can also be improved. Furthermore, the manufactured heat sink has a narrow interval between the fins IIA and a large fin length h, so that the heat dissipation capacity is greatly improved. FIG. 6 shows another embodiment of the fin member. This fin member has a protrusion 20A that fits into the side end of the boss 20 at the end.
and a recessed portion 20B is formed. The formation of such protrusions 20A and recesses 20B has the effect of facilitating the work of stacking the fin members. Further, since the fin member is extruded, the processing accuracy of the protrusions and recesses is low, and the adhesion to the mounting portion is not deteriorated.
第7図1)はフィン部材のフィン30に補強部30A以
外の突起30Bをさらに形成した実施例を示す。この突
起30Bは第7図(blに示す如くフィンを積層したと
き各々のフィン間の空間の面積が等」−<なり、冷却流
体の通過抵抗を均一にする目的および押出し加工時の金
属の流れを良くする目的で設けたものである。このよう
に突起30Bを適当箇所に形成することで、さらに密で
且つ長い寸法のフィン30を形成可能とする。FIG. 7 1) shows an embodiment in which a protrusion 30B other than the reinforcing portion 30A is further formed on the fin 30 of the fin member. This protrusion 30B is designed to uniform the passage resistance of the cooling fluid and to prevent the flow of metal during extrusion. By forming the protrusions 30B at appropriate locations in this manner, it is possible to form the fins 30 that are denser and longer.
以上説明したように本発明の製造法は2枚のフィンおよ
びそれを連結する補強部を有する梯子状断面のフィン部
材を押出し加工し、これを積ね合わせて取付部に固着さ
せるもので、特にフィン部材としての押出し加工によっ
てフィン高さを大きくでき、またフィン間隔の小さなヒ
ートシンクを形成できるので、放熱容量の大きなヒート
シンクを得られるとともに、その組立作業の簡単化によ
る製造コストの低減も達成できる。As explained above, the manufacturing method of the present invention involves extruding a fin member with a ladder-like cross section having two fins and a reinforcing part connecting them, stacking them together and fixing them to a mounting part. By extruding the fin member, the fin height can be increased, and a heat sink with small fin spacing can be formed, so a heat sink with a large heat dissipation capacity can be obtained, and manufacturing costs can be reduced by simplifying the assembly work.
尚、本発明では、例えば第8図に示す如くボス40の端
面に凹部40Aを形成し、ろう付は時の締付は力をボス
の脚部で吸収する構造となすように、フィン部材の形状
は様↑に変更できる。In the present invention, for example, as shown in FIG. 8, a concave portion 40A is formed in the end face of the boss 40, and the fin member has a structure in which the force during brazing and tightening is absorbed by the legs of the boss. The shape can be changed in various ways.
第1図〜第4図は従来のヒートシンクの構造を示す側面
図。
第5図は本発明による製造法で製造されるヒートシンク
の一実施例を示す断面図。
第6図は他の実施例とせる747部材の部分的拡大断面
図。
第7図(a)および第7図(b)はさらに他の実施例と
せるフィン部材の部分的断面図および組立状態を示す断
面図。
第8図はさらに他の実施例とせるフィン部材の端部を示
す部分的拡大断面図。
1.10・・・・・・・・・・・・・・・取付部2.2
′・・・・・・・・・・・・・・・・・・フィンプレー
ト11・・・・・・・・・・・・・・・・・・・・・フ
ィン部材□
11A、11B、30・・・フィン
11C,30A・・・・・・・・・補強部11D、20
.40・・・ボス
30B・・・・・・・・・・・・・・・・・・・・・突
起特許出願人 日本軽金属株式会社
特許出願人 株式会社菱三電気
代理人弁理士 渡 辺 辿 孝第7図(b
)1 to 4 are side views showing the structure of a conventional heat sink. FIG. 5 is a sectional view showing an embodiment of a heat sink manufactured by the manufacturing method according to the present invention. FIG. 6 is a partially enlarged sectional view of a 747 member according to another embodiment. FIG. 7(a) and FIG. 7(b) are a partial sectional view and a sectional view showing an assembled state of a fin member according to still another embodiment. FIG. 8 is a partially enlarged sectional view showing an end portion of a fin member according to still another embodiment. 1.10・・・・・・・・・・・・Mounting part 2.2
′・・・・・・・・・・・・・・・・・・Fin plate 11・・・・・・・・・・・・・・・・・・Fin member □ 11A, 11B, 30... Fins 11C, 30A... Reinforcement parts 11D, 20
.. 40...Boss 30B...Protrusion patent applicant Nippon Light Metal Co., Ltd. Patent applicant Patent attorney Ryosan Electric Co., Ltd. Taku Watanabe Filial 7th figure (b
)
Claims (1)
部とを有する略々梯子状断面のフィン部材を押出し加工
し、フィン部材を並置して取付部に固着することで製造
するヒートシンクの製造法。 (2) フィン部材の端部にフィン外面間距離より幅
広のボスを形成し、該ボスの側面を接して各フィン部材
を積ね合わせることを特徴とする特許請求の範囲第1項
記載のヒートシンクの製造法。 (3) フィン部材のボスの側面に互いに嵌合する突
部および凹部を形成し、該突部と凹部との嵌合で積ね合
せるフィン部材の位置決め保持を得ることを特徴とする
特許請求の範囲第2項記載のヒートシンクの製造法。 (4) フィン部材のフィンに冷却用流体(空気等)
の通過抵抗を均一にすると同時に押出し加工時の金属の
流れを良くするために補強部以外に突部を形成したこと
を特徴とする特許請求の範囲第1項から第3項までの何
れかに記載したヒートシンクの製造法。[Claims] (By extruding a fin member having a roughly ladder-like cross section, which has 122 fins and a reinforcing portion that connects both fins to each other, the fin members are juxtaposed and fixed to a mounting portion. A method of manufacturing a heat sink. (2) A method of manufacturing a heat sink. (2) A method of manufacturing a heat sink. A method for manufacturing a heat sink according to scope 1. (3) Forming a protrusion and a recess that fit into each other on the side surface of a boss of the fin member, and positioning the fin member to be stacked by fitting the protrusion and the recess. A method for manufacturing a heat sink according to claim 2, characterized in that the heat sink is provided with a cooling fluid (air, etc.) in the fins of the fin member.
According to any one of claims 1 to 3, a protrusion is formed in addition to the reinforcing part in order to uniform the passing resistance of the metal and to improve the flow of metal during extrusion processing. Method of manufacturing the heat sink described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14520481A JPS5846660A (en) | 1981-09-15 | 1981-09-15 | Manufacture of heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14520481A JPS5846660A (en) | 1981-09-15 | 1981-09-15 | Manufacture of heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5846660A true JPS5846660A (en) | 1983-03-18 |
Family
ID=15379807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14520481A Pending JPS5846660A (en) | 1981-09-15 | 1981-09-15 | Manufacture of heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5846660A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236596U (en) * | 1985-08-21 | 1987-03-04 | ||
JPS63500413A (en) * | 1985-08-07 | 1988-02-12 | ノ−ス アメリカン スペシヤリテイ−ズ コ−ポレ−シヨン | radiator |
JPS63303265A (en) * | 1987-05-30 | 1988-12-09 | Suzuki Motor Co Ltd | Piston model |
US5682948A (en) * | 1995-03-24 | 1997-11-04 | Alusuisse Technology & Management Ltd. | Heat exchanger for cooling semi-conductor elements or the like |
WO2017007828A1 (en) * | 2015-07-06 | 2017-01-12 | General Electric Company | Thermal management system |
JP2017228748A (en) * | 2016-06-24 | 2017-12-28 | 三協立山株式会社 | Heat sink |
-
1981
- 1981-09-15 JP JP14520481A patent/JPS5846660A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63500413A (en) * | 1985-08-07 | 1988-02-12 | ノ−ス アメリカン スペシヤリテイ−ズ コ−ポレ−シヨン | radiator |
JPS6236596U (en) * | 1985-08-21 | 1987-03-04 | ||
JPH0310695Y2 (en) * | 1985-08-21 | 1991-03-15 | ||
JPS63303265A (en) * | 1987-05-30 | 1988-12-09 | Suzuki Motor Co Ltd | Piston model |
US5682948A (en) * | 1995-03-24 | 1997-11-04 | Alusuisse Technology & Management Ltd. | Heat exchanger for cooling semi-conductor elements or the like |
WO2017007828A1 (en) * | 2015-07-06 | 2017-01-12 | General Electric Company | Thermal management system |
JP2017228748A (en) * | 2016-06-24 | 2017-12-28 | 三協立山株式会社 | Heat sink |
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