JPS5845324B2 - Method for manufacturing headphone pads - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a headphone pad.

An object of the present invention is to provide a method for easily mass-producing pads that are comfortable to the touch of the ear.

In the present invention, a covering material made of synthetic resin coated fabric having a slightly larger diameter than the outer diameter of the recess is placed on the surface of the recess of a vacuum forming machine having an annular recess, and a covering material made of the same material with a large diameter is placed on top of the cover material made of synthetic resin coated fabric. At the same time, the periphery of the material is pressed down and a vacuum machine is operated to adsorb both fabrics along the recessed portions.After that, a donut-shaped cushioning material such as urethane foam is placed in the recessed portion where the art material has been adsorbed. Then, a melt-adhesive fabric such as vinyl is placed on top of it, the inner edge of the recess is welded and cut using a welder, and the outer edge is melt-bonded using a welder.Then, the covering material is turned over and the inner edge is covered with vinyl fabric. This method of manufacturing a headphone pad is characterized in that the outer peripheral edge of the vinyl fabric is welded and cut together with the outer peripheral edge of the vinyl fabric.

Next, an embodiment of the method for manufacturing a headphone pad according to the present invention will be described with reference to the drawings.

First, the embodiments shown in FIGS. 1 to 6 will be described.

In the figure, reference numeral 1 denotes a vacuum forming machine, which has an annular recess 2 formed on its upper surface and communicates with a vacuum chamber 3 leading to a vacuum machine through a small hole 4, and communicates the vacuum chamber 3 with the vacuum machine via a pipe joint 5.

An insulating piece 6 is stretched around the recessed part 2, and a receiving piece 8 of a holding plate 7 is provided on the outside thereof.

Reference numeral 9.10 indicates a covering material and a skin material made of synthetic resin coated fabric. First, a covering material 9 with a slightly larger diameter than the outer diameter of the recessed part 2 is placed on the surface of the recessed part, and then a larger diameter skin material 10 is placed on top of it. Overlap.

At this time, the resin surfaces are brought into contact with each other. In this state, the vacuum machine is operated to suction the art materials 9 and 10, bend them along the recessed part 2, insert a doughnut-shaped cushioning material 11 made of urethane foam into the recessed part, and then place a vinyl fabric 12 (made of nylon or other material) on top of it. Melt adhesive fabric may also be used.

), the large-diameter skin material 10 is held down by the holding plate 7, and the inner peripheral edge of the recessed portion is welded and cut by the welder 13, and the outer peripheral edge is also welded by the welder 14.

Next, the covering material 9 is turned over and placed on the vinyl fabric 12, and the outer periphery of the recessed portion is welded and cut using a welder 15 to complete the process.

In this way, it is possible to manufacture a pad that has a good feel to the touch and has no angular edges at all.

Furthermore, an electrode 17 is provided adjacent to the cutting edge 16 of the welders 13 and 15.
has.

Next, in the modification shown in FIGS. 7 and 8, a fabric 19 that is turned over and covers the headphones 18 is layered under the cover material 9 and welded so as to contact the outer periphery of the outer skin material 10, which is made of urethane foam. The vinyl fabric 12 is placed on top and the inner peripheral edge of the recessed portion 2 is cut by melting, and then the small-diameter covering material 9 is turned over, placed on top of the vinyl fabric, and cut by melting, as in the previous embodiment.

In addition, the vacuum machine may be stopped at an appropriate time. Further, reference numeral 20 in the figure indicates a ventilation hole opened in the covering material 9 and the vinyl fabric 12.

Since the present invention has the above-described structure, it is extremely easy to manufacture and can be made with a low floor, compared to the conventional method using sewing machines or vacuum forming of PVC film. Since the fused portion of the wrapped vinyl fabric 12 is covered by turning the covering member inside out, only the end of the covering material is exposed on the outer periphery of the headphone, so the contact is rough and there is no discomfort like in the conventional case. will not occur.

In conventional products, the cut edges of the exterior material that wrapped the urethane foam etc. had sharp corners, which in some cases caused abrasions on the skin or caused pain when touched.

However, according to the present invention, these risks have been resolved and it has become possible to provide headphones that can be used comfortably.

Moreover, there is no need to worry about producing defective products, and it is possible to provide a pad that is particularly soft to the ear, has good weather resistance, and is robust.

[Brief explanation of the drawing]

The drawings show an embodiment of the headphone pad manufacturing method according to the present invention, in which FIG. 1 is a perspective view of some materials, FIGS. 2 to 5 are sectional views showing the manufacturing state, and FIG. The figure is a cross-sectional view of a welder, Figures 7 and 8 are cross-sectional views of a part in the process of manufacturing showing different embodiments, and Figure 9 shows a state in which a pad manufactured by the method of the present invention is fitted into headphones. It is a partial sectional view. DESCRIPTION OF SYMBOLS 1...Vacuum forming machine, 2...Annular recess, 9...Small diameter synthetic resin coated fabric covering material, 10
・・・・・・Large diameter synthetic resin coated fabric skin material, 11...
...Doughnut-shaped cushioning material, 12...Vinyl fabric, 13,15...Welder.

Claims (1)

[Claims] 1. A covering material made of synthetic resin coated fabric with a slightly larger diameter than the outer diameter of the recess is placed on the surface of the recessed part of a vacuum forming machine having an annular recessed part, and a covering material made of the same material fabric with a large diameter is placed on top of it. At the same time, press the peripheral edges and activate the vacuum machine to adsorb both fabrics along the recessed portions. Then, a donut-shaped cushioning material such as urethane foam is placed in the recessed portion to which the art material was adsorbed. A melt-adhesive fabric such as vinyl is placed on top, the inner edge of the recess is welded and cut using a welder, and the outer edge is melt-bonded using a welder.Then, the covering material is turned over to cover the inner edge and placed on top of the vinyl fabric. A method for manufacturing headphone pads, which comprises welding and cutting the outer periphery of the overlapped material together with the outer periphery of the vinyl fabric.