JPS584357A - Method of treating grinding surface of grinding tool - Google Patents

Abstract

PURPOSE:To create a sharp grinding surface on a grinding tool without wear and tear of the grinding surface, by subjecting the grinding surface to ion sputtering-etching so that the grinding surface is set. CONSTITUTION:A tool 3 to be treated such as a grinding wheel is fixed on a rotary table 2. The vacuum in a vacuum treating vessel 1 is maintained at the order of 10<-1>-10<-5>Torr by an inert gas from a gas cylinder 7. The DC type spattering-etching through a direct current high voltage power source 5 generates ions by electron bombardment by the discharge, due to this electron bombardment the gaseous molecules in the vessel are ionized, and thus generated ions are accelerated by the electric field and strike against the tool 3 to perform the ion etching.

Description

[Detailed description of the invention] The purpose of this invention is to improve the appearance of tools.

Grinding tools are made by attaching hard abrasive grains to a base material such as a disk, fixing it with a hooked cape, and fixing it with a hooked cape.
It can be obtained by forming a blade grinding surface, or by mixing abrasive grains and a binder, homogenizing them, and then forming a porous Km.

Since Ii, when the fF machining head collapses 10, the old surface is removed by a mechanical dresser and a new image is generated*
Although it is processed more than S, it is not necessarily possible to obtain a good surface with V-yap grindability, and
There was a drawback that the tool life was short due to the wear and tear of the grinder due to the grinder.

The present invention provides a processing method that can easily produce a sharp ground surface, and is characterized by processing by etching using ion sputtering.

The present invention will be explained below with reference to an embodiment of the drawings.

Reference numeral 1 denotes a vacuum processing vessel, in which a rotary table 2 is provided, on which a processing tool 3 is fixed. 4
A high-voltage 1-10 KV electric current Il[s is connected to the electric wire with an electrode for ion bombardment between the wire and the treated body ASK, and a discharge is caused. The processing table 2 should be grounded and the negative IIK of the power supply
It is connected.

6 is a vacuum pump that internally exhausts air from the exhaust port 1a of the vacuum container; 7 is a gas supply port 1b that also supplies the required amount of ion-generating gas; the supplied gas is generally an inert gas;
Using Kr, Ar, or in some cases halogen gas such as F or CI, the inside of the vacuum processing vessel 1 is maintained at approximately 10 -1 to 10 '' Thrr by using these gases.

In this DC type sputter etching process using the DC high voltage power supply 5, ions are generated by electron impact caused by a discharge voltage, and the vacuum degree of the processing chamber is 101 to 10''-'
Forr i! Requires H7. The electron bombardment ionizes the gas molecules in the room, and the generated ions collide with the object 3 to be processed due to the electric field, thereby performing ion etching. Further, there is an RF method using a high frequency of 10 to 100 MHz for ion generation, and a power source having a power of about 0.5 to 5 W and a voltage of about 1 to tsxv may be used. The number of ions impacting the object to be processed 3 is 300 to 500.
Impact V energy particles. In this case, the current is α4~
With α5mA or so, processing can be completed in 1 to 2 minutes.

For example, 100ml of the base material is used as a grinding tool for the object to be processed.
The particle size of 8 IC is 150 by phenolic resin.
The degree of vacuum is 10'''' Torr to process the abrasive grains of the Mekshi tool that are glued together so that the concentration is about 90 [K].
OAr#Discharge in the surrounding atmosphere to generate io/energy I
Etching was performed under the conditions of K@V and ion current density of 0.4 mjJtd. Temperature treatment was possible during processing, and the surface of the grinding surface was etched to allow the paper abrasive grains to float, resulting in a sharp finish.

Next, the etched tool is rotated at 4,000 rpm to grind the SKD material with a pressure of approximately 1 kg and 7 cm. When dry grinding is performed with a contact pressure of , the processing speed is approximately α411/crr?
/I was concerned. Approximately α221 without etching treatment
/at? /-, and it was confirmed that the grinding performance was significantly improved by the present invention.

In addition to the above-mentioned embodiments, the present invention can perform etching processing by generating arbitrary ions. For example, by generating a discharge in a certain atmosphere or by applying a high-frequency electromagnetic field, a plasma is generated, The etching process can be performed by extracting the ions, accelerating them, and impacting them onto the object to be processed, or by focusing the ions into a beam and impacting them, and scanning the beam to irradiate a desired portion of the entire surface of the object.

As explained above, the present invention (i) performs self-supporting treatment on the grinding surface of the F-cutting tool by ion bacter etching, so that it is possible to process the grinding surface sufficiently sharply without wasting or wearing it out. In addition, the grinding performance can be extremely improved, the surface layer can be processed without deterioration during processing, and the tool life can be improved, resulting in a favorable grinding effect.

[Brief explanation of the drawing]

The drawing is a configuration diagram of an apparatus according to an embodiment of the present invention. 1 is a vacuum processing container, 2 is a processing table, 3 is a processing object grinding tool, 4 is an electrode, 5 is a high voltage power supply, 6 is a vacuum pump, 7 is a male cylinder Patent applicant

Claims (1)

[Claims] In WI+ cutting tools, which are formed into the desired shape by bonding, tm-setting or sintering high-hardness abrasive grains, during manufacturing and remanufacturing, the ions are applied to the WlfllI11 surface of the grinding tool.
--It is recommended to make it more noticeable by processing the grain.
Processing method for the grinding surface of a grinding tool used as an image