JPS5843229Y2 - radiator - Google Patents

Description

[Detailed explanation of the idea] This invention relates to a radiator.

Generally, semiconductor elements such as transistors and cynostars used in equipment such as amplifiers such as power amplifiers or converters generate heat during operation, and the temperature rise due to the heat generation may cause destruction or unstable operation.

In order to solve this problem, conventionally, as shown in FIGS. 5 and 6, the heating element 13 such as a semiconductor element is
It was attached to a radiator made of extruded aluminum and provided with a large number of fins 12, and the heat generated from the heating element 13 was once absorbed into the radiator main body 11 and then released from the fins 12.

Such a conventional radiator has good heat radiation efficiency, but this is only possible when the heating element 13 is attached when the portion thereof is relatively large compared to the area of the radiator body 11.

However, recently, I,
When C, etc. are used, the area occupied by the heating element 13 is very small, so it becomes almost like a point heat source, and the heat generated from such a point heat source is distributed uniformly to the radiator body 11. The heat is not conducted, but is conducted in a concentrated manner to the fins 12 located close to the heat source, so that the temperature distribution at the upper edge of the fins has a sharp peak near the heating element 13.

In other words, the fins 12 that are far away from the heat source do not contribute to heat radiation.

In reality, even in such a case, there is no particular problem as long as the heatsink as a whole has the required heat dissipation capacity, but in recent years, power amplifiers for audio equipment, etc. have improved as technology has improved. When a heatsink is incorporated into such an amplifier, there is almost no gap between the fins 12 of the heatsink and the top plate of the amplifier case, which reduces the temperature distribution on the top plate surface. The temperature distribution approximates the temperature distribution at the upper edge of the fin of the radiator.

However, the upper limit of the temperature rise on the top plate of the case is regulated by laws and regulations, so if you use a radiator that has a sharp peak in temperature rise near the heating element 13 as described above, the temperature of the top plate will increase. There is a problem that such a heat sink cannot be used because the rise exceeds the legal limit in that part.

By the way, it is possible to disperse the heat generated from the heating element 13 as evenly as possible by increasing the overall thickness of the radiator main body 11, but this would increase the amount of material used for the radiator, resulting in a very high cost. There is a problem with getting high.

This idea was made to solve the above problem, and it is possible to dissipate the heat generated from heating elements such as semiconductor elements in a dispersed state, for example, to reduce the temperature of the top plate of the case of audio equipment, etc. The objective is to provide a heat sink that can make the distribution uniform.

This invention will be explained below based on embodiments shown in the drawings.

In FIGS. 1 to 3, reference numeral 1 denotes a vertical plate-shaped radiator body made of extruded aluminum, on one side of which a large number of parallel fins 2 are vertically cut and raised.

Reference numeral 3 denotes two heating elements made of semiconductor elements such as transistors and thyristors, which are attached to the other surface of the heatsink main body 1 with screws 5.

In the fins 2, the intervals between the three fins 2a close to each heating element 3 are widened, and therefore the arrangement density of these fins 2a is relatively sparse, and the remaining fins 2b are
The cutting and raising intervals of the fins 2b are narrow, so these fins 2b
are arranged relatively densely.

Reference numeral 4 denotes mounting protrusions that are integrally provided at both ends of the lower edge of the radiator body.

In the above, the heat generated by the heating element 3 made of a semiconductor element is first absorbed by the heat sink body 1, and then the heat is absorbed by the fin 2.
However, since the fins 2a near the heating element 3 are relatively sparsely arranged, the fins 2a near the heating element 3
The amount of heat transferred to the fins 2b decreases, while the amount of heat transferred to the fins 2b, which are spaced apart from the heating element 3 and closely spaced, increases.

As a result, the sharp peak of the temperature rise of the fins 2a in the vicinity of the heating element 3 is alleviated, and the temperature distribution on the top plate of the case of the audio equipment or the like is made uniform.

Figure 4 shows another embodiment of this invention.
The difference from the above embodiment is that a large number of fins 2 are cut and raised at equal intervals on the radiator body 1, and the fins 2C on the back side of the mounting portion of the heating element 3 are cut out.

As a result, the two fins 2a close to the heating element 3 are arranged relatively sparsely, and the remaining fins 2b are arranged relatively densely. This reduces the amount of heat transferred to the nearby fins 2a.

The other points in FIG. 4 are the same as those in the embodiment shown in FIGS. 1 to 3 above, and the same parts in the drawings are given the same reference numerals.

In the above embodiment, the radiator main body 1 is made of extruded aluminum, but it may be made of an aluminum plate.

Although the fins 2 are cut and raised on the radiator body 1 using a cutter, the fins 2 are not limited to this, and the fins 2 may be formed integrally with the radiator body 1 by extrusion molding. Fins 2 made of a separate member from the radiator body 1
may be attached to the main body 1 by a method such as brazing.

As mentioned above, in the heat radiator according to this invention, the heating element 3 is attached to the vertical radiator main body 1 provided with a large number of fins 2, and the plurality of fins 2a close to the heating element 3 are Since the fins 2b are sparsely arranged and the remaining fins 2b are relatively densely arranged, the heating elements 3 such as semiconductor elements
The heat generated from the heating element 3 can be released in a dispersed state without being concentrated and released to the fins 2a near the heating element 3, making it possible to equalize the temperature distribution in the case of, for example, audio equipment. It has the effect of being able to do it.

[Brief explanation of drawings]

1 to 4 show two embodiments of this invention. FIG. 1 is a front view of the first embodiment, FIG. 2 is a plan view thereof, and FIG. 3 is a side view thereof. FIG. 4 is a plan view of the second embodiment, FIG. 5 is a front view of the conventional example, and FIG. 6 is a plan view of the same. 1... radiator body, 2, 2 a, 2 b,
2 C...Fin, 3...Heating element.

Claims (1)

[Scope of utility model registration request] A heating element 3 is attached to a vertical radiator body 1 having a large number of fins 2, and a plurality of fins 2 near the heating element 3
A heat radiator in which fins 2b are arranged relatively sparsely and the remaining fins 2b are arranged relatively densely.