JPS5840835U

JPS5840835U - Substrate holder for heat treatment

Info

Publication number: JPS5840835U
Application number: JP13568681U
Authority: JP
Inventors: 今仲　清治
Original assignee: 三菱電機株式会社
Priority date: 1981-09-12
Filing date: 1981-09-12
Publication date: 1983-03-17

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図Ａは従来の熱処理用基板保持具の一例を示す平面
図、第１図Ｂは第１図ＡのＩＢ−ＩＢ線での断面図、第
１図Ｃは第１図ＡのＩＣ−ＩＣ線での断面図、第２図Ａ
およびＢはそれぞれ半導体基板が保持された上記従来例
の基板保持具を熱処理炉に挿入する際の状態を熱処理炉
を断面にして示す平面図および側面図、第３図は第２図
Ａの■−■線での拡大断面図、第４図Ａはこの考案の一
実施例の熱処理用基板保持具を示す平面図、第４図Ｂは
第４図ＡのＩＶＢ−ＩＶＢ線での断面図、第４図Ｃは第
４図ＡのＩＶＣ−ＩＶＣ線での断面図である。図において、１ａおよび１ｂはそれぞれ第１および第２
の基板保持棒（第１および第２の基板保持体）、２ａお
よび２ｂはそれぞれ第１および第２の基板挿入溝、３ａ
および３ｂはそれぞれ第１および第２の支持棒（第１お
よび第２の基板保持体）、５は連結丸棒、５７は車輪で
ある。なお、図中同一符号はそれぞれ同一もしくは相当
部分を示す。1A is a plan view showing an example of a conventional substrate holder for heat treatment, FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. 1A, and FIG. 1C is an IC- Cross-sectional view along IC line, Figure 2A
and B are a plan view and a side view, respectively, showing the state in which the conventional substrate holder holding a semiconductor substrate is inserted into the heat treatment furnace, with the heat treatment furnace taken as a cross section. 4A is a plan view showing a heat treatment substrate holder according to an embodiment of this invention; FIG. 4B is a sectional view taken along line IVB-IVB of FIG. 4A; FIG. 4C is a sectional view taken along the line IVC-IVC in FIG. 4A. In the figure, 1a and 1b are the first and second
board holding rods (first and second board holders), 2a and 2b are respectively the first and second board insertion grooves, 3a
and 3b are first and second support rods (first and second substrate holders), 5 is a connecting round bar, and 57 is a wheel. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

The first
and a second substrate holder, a substrate for holding a semiconductor substrate, which is provided in pairs on the opposing surfaces of the first and second substrate holders, sequentially spaced apart from each other at a predetermined interval, and into which a portion of the periphery is inserted. an insertion groove; at least two connecting round bars provided to connect the first and second substrate holders to portions of the first and second substrate holders where the substrate insertion grooves are not formed; , and a heat treatment substrate holder comprising wheels mounted on both ends of each of the connecting round bars so as to be able to rotate independently of each other.