JPS583972A - Pattern working device - Google Patents

Abstract

PURPOSE:To correct drop-out parts in an extremely short time by disposing the work in a vacuum vessel, and vapor-depositing the melt of the metal or the like melted by a laser on the drop-out parts of the work through an aperture of a shutter. CONSTITUTION:The work 10 is inserted through an insertion port 9b on the work stage 12 in a vacuum vessel 9. A vapor depositing material 16 such as metal oxide is held on a holding table 17 by facing the work 10 through a shutter 13. The inside of the vessel 9 is evacuated, and a laser 24a is released by a laser device 24 to melt the material 16 through a transparent plate 23, whereby the metal oxide is scattered. The scattered metal oxide is deposited and filled in the drop-out part 5 of the patterns 2 of the work 10 through the aperture 25 of the shutter 13. The work 10 is disposed correctly to the prescribed position of the stage 12 by an observation system 11, and the size of the aperture part of the shutter 13 and the correct irradiation of the material 16 by the laser light 24a are controlled by means of knobs 15, 21.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern processing apparatus, and more particularly to an arm turn processing apparatus for processing a peeled part in a metal lean processed on a substrate such as a glass plate.

Conventionally, as a method for modifying a photomask or reticle pattern by turning a metal or metal oxide on a substrate such as a glass plate, as shown in FIG. If an unnecessary no-f turn 3 other than the above-mentioned pattern 2 is formed, the unnecessary no-J? Turn 3 can be easily removed.

However, as shown in FIG. 2(4)(B), if a cutout part 5 is included in the metal turn 2 formed on the substrate 1, a process is required to correct the cutout part. However, it required some complex modifications.

That is, as shown in FIGS. 3(4) to 3(D), a resist material 6 is applied onto the metal pattern 2 having the missing portions 5, and then the resist 6 in the missing portions 5 is developed with a light beam 7. Figure 2 (B)) The resist material in the area irradiated with the light beam 7 is removed, and the metal 8 is deposited on the upper surface of the resist 6 (Figure 3 (B)).
C5) Next, when the resist 6 is peeled off, there is a metal 8 in the missing part 5.
a remains, and the missing portion of the metal or metal oxide on the substrate 1 is replenished, completing the repair.

However, the correction of the rose workpiece in such a process has the disadvantage that it requires a lot of time and man-hours.

The present invention provides a pattern processing apparatus that eliminates the above-mentioned drawbacks, and its feature is that the above-mentioned workpiece is placed in a vacuum container, and a vapor deposit of metal or the like is removed using a laser through a shutter. This is a two-turn processing device that deposits molten metal onto the missing parts of the workpiece.

An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 4 shows a cross-sectional side view of the pattern processing apparatus of the present invention, in which a workpiece 10 such as a photomask or a reticle is arranged in a vacuum container 9, and the workpiece is a glass or the like. A pattern 2 made of metal, metal oxide, etc. is formed on a substrate 1. The workpiece 10 has thousands of turns with missing parts 5. Workpiece l
O is inserted onto the processing table 12 through the workpiece insertion opening 9b.

An observation system 11 such as a microscope is fixed to the upper part of the container 9 at a position facing the workpiece 10, and the pattern 2 of the workpiece 10 is observed through the glass substrate 1.

9a is an exhaust port for exhausting the air inside the container 9, and 9c is an exhaust valve.

The shutter 13 is opened through the operating lever 14 by the adjustment knob 5 which is discharged to the outside of the vacuum container 9. Xl adjustment is made.

A vapor deposited material is held on a vapor deposited material holding table 17 using a vapor deposited material such as metal oxide. The deposit holding table is placed along the groove 18 at A
- It is slid in the A direction.

With the spring 19, the screw 20 discharged to the outside of the container 9 is screwed together with the screw bone 22 on which the host screw is formed, and the knob 21 is fixed to the screw 20 discharged to the outside of the container.

The tip of the screw 20 is brought into contact with the deposit holding table 17 against the spring 19.

A transparent plate 23 made of glass or the like is fixed to the bottom of the container 9, and a laser device 24 is placed outside the container 9 facing the transparent plate 23 made of glass or the like.

For example, the shutter 13 is made by combining four shutter plates 13a, 13b, 13c, and 13d as shown in FIG.

13d is slid in the B-B and C-C directions by rotating the knob 15, and the size of the shirt opening 25 is determined by μ.
It has a configuration that can be finely adjusted to order.

Since the pattern processing apparatus of the present invention is configured as described above, the laser 24 & emitted from the carbon dioxide or YAG laser device 24 melts the metal oxide or metal vapor deposit 16 through the transparent plate 23 to oxidize the metal. scatter things.

The scattered metal oxide is deposited through the opening 25 of the shutter 13 so as to fill the missing part of the pattern 2 of the workpiece 10.

The workpiece 10 is correctly placed at a predetermined position on the mounting table by the observation system. Also, the shutter 13 is set by the knob 15.21.
The size of the opening of the container 9 is controlled so that the vapor deposited material 16 is properly irradiated with the laser beam, and air is removed from the inside of the container 9 through the exhaust port, and the vapor deposition is carried out in the missing parts in a vacuum state. Of course.

Since the present invention is constructed and operated as described above, it is possible to repair missing parts many times in an extremely short time compared to the chemical repair method that requires many steps as shown in FIG. It has the characteristic that it can be carried out.

(5)

[Brief explanation of the drawing]

FIG. 1 is a plan view of a substrate for explaining a conventional unnecessary pattern removal method, FIGS. Fig. 3 (N to Φ) is a sectional side view of the board illustrating the conventional process of repairing all the missing parts in the P-turn, and Fig. 4 is the No. 4 of the present invention.
FIG. 5 is a cross-sectional side view of the turning device, and FIG. 5 is a perspective view showing the structure of the shutter shown in FIG. 4. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Pattern, 3... Unnecessary pattern, 4... Hot wire, 5... Missing part, 6... Resist material, 8... Metal, 9... Vacuum container, 10... Workpiece, 11... Observation system, 13... Shutter, 16
...Vapor deposit, 24...Laser. Patent applicant Fujitsu Limited (6)

Claims (1)

[Claims] A processing mounting table, a shutter device, and a deposited material mounting table are provided in the vacuum container, and an observation system is placed opposite the processing mounting table in the vacuum container, an observation system A pattern processing device in which a transparent plate such as a glass plate is provided opposite to a mounting table, and a heat ray such as a laser beam is irradiated through the transparent plate.