JPS58371U - Board circuit connection mechanism - Google Patents
Board circuit connection mechanismInfo
- Publication number
- JPS58371U JPS58371U JP1981094644U JP9464481U JPS58371U JP S58371 U JPS58371 U JP S58371U JP 1981094644 U JP1981094644 U JP 1981094644U JP 9464481 U JP9464481 U JP 9464481U JP S58371 U JPS58371 U JP S58371U
- Authority
- JP
- Japan
- Prior art keywords
- connection mechanism
- circuit connection
- board circuit
- connection piece
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例である接続片を示す斜視図、第2図は本
考案の一実施例を示す接続片の斜視図、第3図の410
図は本考案の一実施例である基板回路接続機構を示す斜
視図である。イ図は接続片、口図は接続子を示す。第4
図の490図は本考案の他の実施例を示す斜視図である
。
図において、1,11,21.31は接続片、2.13
は回路基板、3,123.13aは導体面1.4.5は
フィレット、A、 Bは端面、11a。
1 lb、 21a、 22bハフ、リッ1.12は
集積回路基板、14は接続子を示す。FIG. 1 is a perspective view showing a conventional connection piece, FIG. 2 is a perspective view of a connection piece showing an embodiment of the present invention, and 410 in FIG.
The figure is a perspective view showing a board circuit connection mechanism that is an embodiment of the present invention. The figure above shows the connection piece, and the figure above shows the connector. Fourth
Figure 490 is a perspective view showing another embodiment of the present invention. In the figure, 1, 11, 21.31 are connection pieces, 2.13
3,123.13a is the conductor surface 1.4.5 is the fillet, A and B are the end faces, 11a. 1 lb, 21a, 22b, 1.12 is an integrated circuit board, and 14 is a connector.
Claims (1)
固定する接続片において、該接続片の少くも前記導体面
に接する下面に切り込みを設けたことを特徴とする基板
回路接続機構。1. A board circuit connection mechanism, characterized in that a connection piece is fixed to a conductor surface forming a pattern of a circuit board using a bonding material, and a notch is provided in at least a lower surface of the connection piece that contacts the conductor surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981094644U JPS58371U (en) | 1981-06-26 | 1981-06-26 | Board circuit connection mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981094644U JPS58371U (en) | 1981-06-26 | 1981-06-26 | Board circuit connection mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58371U true JPS58371U (en) | 1983-01-05 |
Family
ID=29889566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981094644U Pending JPS58371U (en) | 1981-06-26 | 1981-06-26 | Board circuit connection mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58371U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5026939U (en) * | 1973-07-05 | 1975-03-28 |
-
1981
- 1981-06-26 JP JP1981094644U patent/JPS58371U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5026939U (en) * | 1973-07-05 | 1975-03-28 |
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