JPS5836073B2 - Continuous plating device for the striatum - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous plating apparatus for filament bodies that is suitable for mass production and that efficiently performs high-speed plating and/or thick plating.

In general, materials in which conductive filaments made of Cu, At, Fe, or alloys thereof are electroplated with dissimilar metals selected from Cu, Sn, Ni, and Zn and/or noble metals such as Au and Ag are used industrially. It is widely used, and Au>AgtCu5Ni7Sn is widely used in linear nonconductors such as plastics and fibers.
Materials plated by chemical plating or a combination of chemical plating and electroplating are widely used in industry.

In the production of these materials, in order to obtain plating of a predetermined thickness, plating must be carried out for a predetermined time determined by the type of plating bath and plating conditions.

Therefore, when plating at high speed for thick plating and/or mass production, the filament to be plated must be held in the plating bath over a long distance.

Moreover, since the current carrying capacity is limited depending on the shape and physical properties of the filament to be plated, it becomes necessary to divide the required amount of electricity (minus) and feed it.

For this reason, in the past, a plating device was used in which several dozen plating tanks were arranged in series and a power supply was provided between each plating tank, and the filament to be plated was run horizontally in a straight line, and the plating tank was sequentially moved through the plating tank. Plating is performed by passing through the

Such plating equipment requires a large amount of space, and therefore has the drawback of being a heavy economic burden.

In order to reduce this burden, a method is used in which multiple filaments to be plated are passed through the same plating tank in parallel to save the number of tanks for the same production volume, but this method is expensive. Therefore, a large number of coilers had to be used, which was not necessarily rational.

On the other hand, a plating bath is provided between a pair of rotating drums having vertical rotation axes, and by winding the filament to be plated around both drums and running between the two drums, power is supplied to the filament by the drum. At the same time, an apparatus has been proposed in which the filament is passed through a plating bath many times for plating.

In addition, three or more rotating drums are used, a plating tank is provided between each drum, and the filament to be plated is wound around each drum, so that the filament is sequentially passed through each plating tank many times. A plating device has also been proposed.

These devices have the advantage that they can be made much more compact than the aforementioned plating devices in which the filament to be plated is moved linearly and horizontally.

However, there is a limit to the amount of filaments that can be wound around one drum, and it cannot be used for high-speed plating as in the case of mass production.

In addition, for plating equipment that uses three or more drums, it is possible to increase the plating speed according to the number of drums used.
Although it is possible to increase production, the winding angle of the filament wound around the drum decreases, which limits the number of drums that can be used from the viewpoint of power supply. cannot be done.

In view of this, as a result of various studies, the present invention has developed a plating device for filament bodies suitable for mass production that efficiently performs high-speed plating and/or thick plating. A plurality of unit plating devices are arranged in which the filament to be plated is sequentially wound around a rotating drum from the lower stage to the upper stage, and the filament is passed between the drums, and plated by passing it through a plating tank provided between the drums many times, The present invention is characterized in that a step roll is provided between each unit plating device for guiding the filament from the upper drum of the previous device to the lower drum of the next device.

This will be explained in detail using the drawings.

Fig. 1 is a plan view showing an example of the apparatus of the present invention, Fig. 2 is a front view thereof, and Fig. 3 is a side view. device, 2a, 2
b indicates two stepped rolls, each unit plating device 1a,
Ib, ic consists of a pair of rotating drums 4a, 4b each having a vertical rotating shaft 3, and a plating tank 5 provided between both drums 4a and 4b, and each unit plating device 1a,
1b, 1crl The filament a supplied from the lower stage of the rotating drum 4a is sequentially wound from the lower stage to the upper stage of both drums 4a, 4b and made to travel between both drums 4a, 4b,
Plating is performed by passing through the plating tank 5 between the two drums 4 a z 4 b many times, and the plated filament a is taken out from the upper stage of the drum 4 a.

These unit plating devices 1a, 1b, 1c are arranged in parallel, and at least two step rolls 2a, 2b are provided between each unit plating device 1a, 1b, ic, so that the unit plating device 1a in the previous stage, for example, The filament body a emerging from the upper stage of the rotating drum 4a is guided to the lower stage of the rotating drum 4a of the unit plating device 2a at the next stage.

The filament to be plated a is subjected to pre-treatments such as degreasing and activation as necessary, and then supplied to the lower stage of the rotating drum 4a of the unit plating device 1a at the frontmost stage for plating.
The striated body a coming out from the upper stage a is rolled into two stepped rolls 2a.
, 2b to the lower stage of the rotating drum 4a of the next stage unit plating device 1b, and plating is performed in the same manner sequentially.
Plated filament a leaving the final unit plating device 1c
After washing with water and drying as necessary, it is wound up on a recoiler, etc. (not shown in the figure).

The rotating drum is driven as necessary, and is connected to the negative side of the plating power source to serve as a power supply contact and to turn the filament in direction.

Furthermore, if necessary, grooves may be provided in multiple stages on the outer peripheral surface of the rotating drum so that winding of the filament, direction turning, power feeding, etc. can be performed completely and smoothly.

The stepped roll is composed of at least two rolls each having a horizontal rotation axis, and the roll diameter and number of rolls must be selected so as not to excessively deform the filament or damage the plating surface.

Further, although the filament can be moved by winding force from a recoiler, it is preferable to drive the rotating drum.

As described above, the apparatus of the present invention can plate the filament by repeatedly passing the filament to be plated in multiple stages through a large number of plating tanks, so it is not only possible to greatly improve the production amount per line, but also to It is economical because it requires only one set of expensive pre-treatment, coiler and uncoiler.

That is, the same production volume can be obtained by operating three unit plating apparatuses as shown in FIG. 1 separately, but three sets of recoilers, uncoilers, etc. are required.

Furthermore, the device of the present invention can be put to practical use by providing step rolls between the unit plating devices, and if there is no step roll, the filament coming out from the upper stage of the rotating drum of the previous unit plating device will be transferred to the next step. This means that the rotating drum of the unit plating device is wound from the upper stage to the lower stage, but this is not possible due to operational reasons.

It is also conceivable to set each unit plating device in a stepwise manner at a higher position, but this would complicate the equipment structure and work.

Furthermore, it is conceivable to separately wind the filament bodies around the rotating drum of each unit plating device and connect the filament bodies on the upper or lower stage of the rotating drum of the adjacent device by welding, etc., but this would not only complicate the work but also , during operation, the connection part may break due to fatigue, causing an accident.

In the above explanation, unit plating devices 1a, 1b, 1c
All of them are used for plating, but at least a part of them may be used for plating pre-treatment or post-treatment, and a part of the pre- or post-treatment can also be used as the unit device.

Next, embodiments of the apparatus of the present invention will be described.

As shown in Fig. 1, using the apparatus of the present invention in which three unit plating apparatuses are arranged in parallel and two step rolls are provided between each apparatus, a copper wire with a diameter of 2.3M is coated on a line of 50m/m++. Sn plating with a thickness of 30 μm was performed by running at high speed.

First, the copper wire supplied from the uncoiler is pickled with 10% H2SO in a conventional manner, then washed with water, and then supplied to the lower stage of the rotating drum of the first unit plating device, and the copper wire coming out from the upper stage of the drum is The copper wire is guided to the lower stage of the rotating drum of the second unit plating device by two stepped rolls, and the plated copper wire is similarly passed through the second and third unit plating devices and washed with water when it exits the third unit plating device. Then, it was dried through a hot air oven and wound up on a Karari coiler.

The rotating drum was made of stainless steel, had a diameter of 30011g1, a height of 70011m1, and had 50 concave grooves at a 1OM pitch on its circumferential surface.

The plating bath between both drums had a length of 1500 meters and was placed opposite a copper wire running on an Sn plate to serve as an anode, and the Sn plate and the rotating drum were connected to the positive and negative terminals of a plating power source.

The plating solution contains H2SO4100g/t, S n SO,
i 80 g/t, glue 5j; l/t, liquid temperature 1
Using a temperature of 5° C., the solution was allowed to overflow from the end of the tank where the copper wire enters and exits, and was circulated by a pump using a liquid storage tank.

In this way, a current of IOOOA was passed through each unit plating device.

In addition, the stepped rolls installed between each unit plating device are made of stainless steel rolls with a diameter of 200M, and grooves are provided on the outer periphery of the roll to accommodate copper wire.The rotating drums of each unit plating device are connected by a chain, and a torque limiter is installed. The step roll was driven by a motor, and the stepped roll was not driven.

As a result, good plating was obtained at a high line speed of 5 Q yl /trtin.

As described above, the apparatus of the present invention is capable of efficiently performing high-speed plating and/or thick plating, and has a remarkable industrial effect as an economical apparatus suitable for large-scale production.

[Brief explanation of drawings]

The drawings show an example of the device of the present invention, and FIG. 1 is a plan view thereof, FIG. 2 is a front view thereof, and FIG. 3 is a side view thereof. a...Striatal body to be plated, ia, 1b, 1c...
...Unit plating equipment, 2 a, 2 b...
Step roll, 3... Rotating shaft, 4a, 4b...
...Rotating drum, 5...Plating tank.

Claims (1)

[Claims] 1. The filament to be plated is sequentially wound around at least two rotating drums having vertical rotating shafts from the lower stage to the upper stage, and is run between the drums, passing through the plating tank provided between the drums many times. Multiple unit plating devices are lined up to perform plating,
A continuous plating device for linear bodies, characterized in that a step roll is provided between each unit plating device for guiding the linear body coming out from the upper stage of the drum of the previous stage device to the lower stage of the drum of the next stage device.