JPS5835995A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This Takamei relates to a method for manufacturing printed wiring boards, 4IK-
The present invention relates to a method of manufacturing a print arrangement suitable for use in forming a thick conductive pattern on a heat-resistant insulating substrate such as a heat-resistant insulating substrate. Currently there are 5 on the 1b board
When repeatedly forming a conductor pattern with a length of 0^11L or more, equipment and operation costs are low and relatively good pattern accuracy can be easily obtained.
Screen printing method is heavily used. However, as the pattern density of printing materials becomes denser, signal transmission,
It became necessary to increase the thickness of the corresponding part of the pattern in order to accommodate the power supply, mounting parts, and JI1 corrosion resistance.

Conventionally, in such cases, different screen printing substrates were used to print different thicknesses of patterns on the same printing plate.
Either double print or use the same screen printing plate to print thicker! Printing was performed by changing the squeegee, printing pressure, and printing ink viscosity depending on the portion numbered.

According to such a method, the former method requires several screen-printed substrates that are partially divided according to different printing thickness numbers, and alignment to these JI5wtb collections [ Since it is necessary to print after printing, 1kJ positioning work is required. As described above, the manufacturing cost of the screen printing board is high, the manufacturing precision of the screen printing plate is high, the printing technology is required, and the multiple printing requires a large number of man-hours. In the latter method, the difference in thickness of the printed film on the same screen printed substrate must be recognized each time printing is performed, and the printing pressure of the squeegee and the printing ink must be adjusted to correspond to the thickness of the printed film. It is necessary to select and use the pattern, which is extremely careful and requires a large number of man-hours, and has the disadvantage that if the pattern density is dense, the work becomes even more difficult.

In view of this situation, it is an object of the present invention to use the same screen printing plate, the same squeegee, printing pressure, and printing ink to obtain different printing film thicknesses in the same printing operation.

That is, in the present invention, when the printing thickness on the printing surface is the same as the material and shape of the squeegee, the printing pressure, the material and viscosity of the printing ink, etc., the opening for the unit area to be supported and press-fitted with the stencil is Focusing on the dependence on area, when using the screen used in the present invention, the diameter of the filaments in the printed film thickness areas of different patterns may be changed by plating or the like, or the material of the filaments may be made of M0T plastic material. The same screen can be heated and pressurized to change the cross-sectional shape of the filament, or the cross-sectional shape of the filament can be permanently deformed by applying pressure to the same screen. A printing plate, printing ink, and printing operation form a pattern on the same printing surface using different printing film surfaces.

According to the present invention, it takes a shorter time to print on a plurality of notters, and since multiple printing is not required, there is no need to worry about positioning each plate during printing, and there is no need to worry about positioning each plate during printing. There is no need to select the pressure and viscosity of the printing ink, or to recognize parts of the pattern based on the thickness of the printed film, making printing simple, and it is possible to prevent quality deterioration and damage due to careful work. or,
When patterns formed by different printing films are connected to each other, a reliable connection can be obtained without overlapping or separating the patterns, and even with dense pattern density, different printing can be achieved. This has the effect of making it possible to mix the film arbitrarily depending on the film thickness.

Next, the present invention will be explained by examples.

The case where the printing film thickness of printed notches mixed on the same printing surface is a simple arrangement in the printing area is shown in Figure 1 (voice 2).
As shown in the figure.

FIG. 1 shows that the printed film thickness of the pattern P to be printed on the illustrated substrate is divided into two regions, Pl, which is uniformly thin, and P2, which is uniformly thick. FIG. 2 shows a screen So corresponding to pattern P. The screen So- is composed of a screen S1 corresponding to the region P1 of the pattern section 1 in FIG. 1, and a screen S2 corresponding to the second region P2 of the pattern made of Al11L. The screen f3o is a sand cloth woven from synthetic resin fibers, and the warp pitch A is the same as that of the screen S1 and the screen S2.
are the same in the area, but the weft pitches B1 and B2
is small in the area of screen S1.
The fabric is woven to a large extent in the second area.

When a stencil for opening turns is bonded to such a screen S and printed on the printing surface as a printing substrate, the printing ink film thickness in the screen S2 area can be made to be the same as the printing ink film thickness in the screen S1 area.

The thickness of the printing ink film can be determined mainly by the viscosity of the printing ink and the printing pressure.In order to simultaneously obtain the thickness of the pattern P1 area) (turn P2 area) in the same printing, screen S1 weft pitch B
1 and weft pitch B1 of screen S2 and screen S2
It is obtained by correlating the weft pitch B2 of .

Next, cases in which the mixture of anisotropic printing film thicknesses on the printing surface is not simple but complex in the printing surface region are shown in FIGS. 3, 4, and 5. Among the patterns in which different printing film thicknesses are mixed at 11% in the pattern P area, one continuous pattern po is a pattern P1 with a thin printing film thickness, and a pattern P2 with a thick printing film thickness is rare in two patterns P1. The screen S corresponding to the pattern PO in Figure 3 of Brain 4 Zusha, the stencil C, and the stencil C were woven using a thermoplastic synthetic resin grade. The entire area of the screen S is made of the same warp and warp threads.

Join stencil/I/C to screen S, pattern p
Heat and pressurize the screens Sl and S2 corresponding to the pattern P1 and pattern P2 of the screen S to be Shimadad in the opening of the stencil C corresponding to o in the screen Sl area of the pattern P1 where the printing film thickness is thin, and ，
As shown in Fig. 145, the hinge for the pattern P2 with a thick printed film thickness is circular with a cross-sectional diameter of dl, and the hinge corresponding to the pattern PI with a thin printed film thickness is attached to the printed board so as to be perpendicular to the printing pressure direction. In parallel, the cross-sectional shape is flat, and the dimension in the flat direction is set to d2.

Therefore, the effective mesh J of the screen in the screen 61 area is large, and the -1 opening area is small. Since the number of mesh gourds in this area can be effectively different from that of the screen S2 area, the openings of the stencil C engraved by the screen S1 and the openings of the stencil C engraved by the screen S2 in the same printing are different from each other. It is possible to make the printing film thickness by the printing ink different, and it is possible to
The printing MN can be arbitrarily set by processing the dimension d2 in the deformation of the filament.

With this method, effective screen printing is possible even if the printed film thickness is intersected in a very complicated manner within the pattern to be printed. There is also no need for cumbersome positioning work.

Processing of the above-mentioned hiscimento shape without using heat and pressure is a must! It is possible to obtain the same result by partially applying non-uniform plating to the parts. In addition, if the hinge material is not a synthetic resin but a metal such as stainless steel, similar a can be practiced using methods such as electrolytic plating.
Similar results can be obtained.

It goes without saying that the printing ink used in this printing method can be used not only for conductive materials but also for screen printing of insulating materials, solder resist materials, and the like.

[Brief explanation of drawings]

FIGS. 1 to 5 are diagrams showing *embodiments of the present invention. Pl・・・・・・Pattern area P with thin printing film thickness
2...Pattern area S1 with thick printing film thickness
......Thin screen area S2 of printed PIilJ#... Thick screen area of printed film thickness 1c1 ゛Mushroom 2 diagram

Claims (1)

[Claims] In a method for manufacturing a printed wiring board, which includes a step of forming a screen on the surface of a substrate by a screen printing method, the screen printing stencil used in the step has at least two regions with different opening areas, A method for manufacturing a printed wiring board, characterized in that the thickness of the printing ink formed on the aS surface differs in two regions by at least 1%.