JPS5835136B2 - Embossed film Seizouhouhou - Google Patents

Embossed film Seizouhouhou

Info

Publication number
JPS5835136B2
JPS5835136B2 JP9749875A JP9749875A JPS5835136B2 JP S5835136 B2 JPS5835136 B2 JP S5835136B2 JP 9749875 A JP9749875 A JP 9749875A JP 9749875 A JP9749875 A JP 9749875A JP S5835136 B2 JPS5835136 B2 JP S5835136B2
Authority
JP
Japan
Prior art keywords
film
embossed
composite
layer
embossing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9749875A
Other languages
Japanese (ja)
Other versions
JPS5222054A (en
Inventor
武夫 近藤
俊博 山根
武夫 総山
慎一 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP9749875A priority Critical patent/JPS5835136B2/en
Publication of JPS5222054A publication Critical patent/JPS5222054A/en
Publication of JPS5835136B2 publication Critical patent/JPS5835136B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は、ポリプロピレン2軸延伸(以下PP−BO)
と略称する)フィルムの優れた特性を保持し、かつエン
ボスパターンの転写率と形態保持率の優れたP P −
B O複合エンボスフィルムの製造法に関するっ 従来より、ポリプロピレン、ポリエステル、ナイロン、
ポリスチレン、塩化ビニール等の2軸延沖フイルムは、
紙に比べて引張り強さ、屈曲性等の機械的強さや、耐電
圧、誘電率等の電気的性質が優れているので、この特徴
を活用すべく種々の用途開発が試みられているが、紙に
比べた場合のプラスチックフィルムの欠点として、表面
がj゛・滑であるが故に2枚以上重ねた場チー、にブロ
ッキングしたり、その重ねaせた層間にンコ体が浸入し
いくかつ/−:J、ぬめり感があって感、・、′2が悪
い等の問題があり、対策としてエンボス加:二により凹
凸を施す試みが行われていて、ポリエステルフ・1“ル
パ、や塩化ヒニルフイルムではそれ等L0ニンボスフー
ルムが電気絶縁体、断熱体、ブックカバー等と1で実用
化されている。
Detailed Description of the Invention The present invention relates to polypropylene biaxially oriented (hereinafter referred to as PP-BO)
P P - which maintains the excellent properties of the film (abbreviated as ) and has an excellent transfer rate and form retention rate of the embossed pattern.
Regarding the manufacturing method of BO composite embossed film, conventionally, polypropylene, polyester, nylon,
Biaxially stretched films made of polystyrene, vinyl chloride, etc.
Compared to paper, it has superior mechanical strength such as tensile strength and flexibility, and electrical properties such as withstand voltage and dielectric constant, so attempts have been made to develop various uses to take advantage of these characteristics. The disadvantages of plastic film compared to paper are that the surface is smooth, so if two or more sheets are stacked, they may block, and particles may get into the space between the stacked layers. -: J, There are problems such as a slimy feeling and poor feeling of '2, and as a countermeasure, attempts have been made to create unevenness by embossing, and polyester film 1" Lupa or hinyl chloride film is used as a countermeasure. The L0 nimbos film has been put into practical use as an electrical insulator, heat insulator, book cover, etc.

シカるにP P −B Oフィルム、・てち−いては、
5−ンボス加工の条件、例えばエンボス湿度、圧力、パ
ターン等を種々変えても、エンボスパターンが転写され
に〈<(転写率が悪く)、シかもわずン7・に転写され
たパターンも長時間放置しても・いた)、荷重をかげた
り、100℃前後で加熱したり\トるとパターンがほと
んど消えてしまうというつ斗り形態保持性か悪いという
大きな問題があり、PP−BOフィルムの優れた耐電圧
性や誘電損失(、tano )が小さいといった電気的
性質を利用して、例、′8′−ば絶縁油中で電線、コイ
ル等の層間絶縁体としご複数枚積層して使用せんとして
も、絶縁油の層間浸入が阻害されるため、末だP P
−B Oエンボスフィルムは実用化されていない。
Shikaruni PP-B O film, Techi-ite,
5- Even if you change the embossing conditions, such as embossing humidity, pressure, pattern, etc., the embossed pattern is not transferred (poor transfer rate), and the pattern transferred to the surface is also long. PP-BO film has a major problem of poor shape retention, with the pattern almost disappearing when exposed to a load or heated to around 100°C. Utilizing its electrical properties such as excellent voltage resistance and low dielectric loss (tano), it can be used, for example, as an interlayer insulator for wires, coils, etc., in an insulating oil. Even if it is not used, the insulating oil will be prevented from penetrating between the layers, so it will be useless.
-BO embossed film has not been put into practical use.

本発明は、かかる問題を解決したもので、従来単なるP
P −B Oフィルムにエンボス加工を施しても、エ
ンボスパターンの転写率が悪く、又転写されたパターン
の形態保持率も悪かったのに対しP P −B Oフィ
ルム層の少なくとも片面KMフィルムよりも融点の低い
重合体複合層が複合されてなる複合フィルムを、該複a
層同志が接する4Lうに2枚以上重ね合せ、該複合層の
融点より低い温度で、全層一体的にエンボスすることに
より]−驚くべきことに、2枚以上重ね合せた該PP−
BO複合フィルムが強固に積層接着され、しかもエンボ
スパターンの転写率が向上し、さらに転写されたエンボ
スパターンの形態保持率も非常によい工ンボスフイルム
が得られることを見出したものである。
The present invention solves this problem, and conventionally only P
Even when the P-BO film was embossed, the transfer rate of the embossed pattern was poor, and the form retention rate of the transferred pattern was also poor, whereas at least one side of the P-BO film layer was better than the KM film. A composite film formed by combining a polymer composite layer with a low melting point is
By stacking two or more 4L seams where the layers touch each other and integrally embossing all the layers at a temperature lower than the melting point of the composite layer] - Surprisingly, the PP with two or more stacked layers -
It has been discovered that an embossed film can be obtained in which the BO composite film is firmly laminated and bonded, the transfer rate of the embossed pattern is improved, and the form retention rate of the transferred embossed pattern is also very good.

な釦、この場罰単なる通常のPP−BOフィルムを2枚
以上重ねて同一条件でエンボス加工を施しても全く接着
せず、その上得られた1枚1枚のエンボスフィルムは転
写率、形態保持事典非常に悪い。
However, even if two or more regular PP-BO films were stacked together and embossed under the same conditions, they would not adhere at all, and each embossed film obtained had poor transfer rate and morphology. Retention encyclopedia very poor.

又本発明で用いるPP−BOの複合フィルムを2枚以上
重ね、通常のカレンダーロールを使用して複合層の融点
より低い温度で同一条件で熱圧着しても接着せず、本発
明の上記構成を採用して、はじめて前述の如き驚くべき
効果を有するエンボスフィルムが得られることを見出し
たものである。
Furthermore, even if two or more PP-BO composite films used in the present invention are stacked and thermocompressed under the same conditions at a temperature lower than the melting point of the composite layer using a normal calendar roll, no adhesion occurs, and the above structure of the present invention does not adhere. It has been discovered that an embossed film having the above-mentioned surprising effects can be obtained for the first time by employing this method.

又前述以外の効果として、従来PP−BOフィルムは、
未延伸フィルムの冷却ヒ、その厚さは高々60μ程度の
もの1でしか工業的に生産されていないが、本発明によ
れば、2枚以上重ねることにより120μ以上の厚さを
ベースとするP P −B Oエンボスフィルムが容易
に得られ、特にP P −B Oがポリエステルフィル
ムに比べて腰がない(軟らかい)ために使われなかった
用途にも、本発明の方法で厚番手化できることにより腰
が向上して使用し得るようになった。
In addition, as an effect other than the above, conventional PP-BO film has the following effects:
Cooling of unstretched film is only industrially produced with a thickness of about 60μ at most, but according to the present invention, by stacking two or more films, P with a base thickness of 120μ or more can be obtained. P-BO embossed film can be easily obtained, and the method of the present invention can be used to increase the thickness, especially in applications where P-BO is not used because it is less stiff (softer) than polyester film. My lower back has improved and I can now use it.

その場合、必要に応じて最外層をP P −B 0層と
しておくことにより、複合層の融点の低い重合体が最外
層に出ないようにしうる利点もある。
In that case, by setting the outermost layer as a P P -B 0 layer as necessary, there is an advantage that the polymer having a low melting point of the composite layer can be prevented from coming out to the outermost layer.

本発明を達成するために用いられるP P −B O複
合フィルムの組成は、ポリプロピメン2軸延伸フィルム
層と、該フィルム層上の少なくとも片面に該フィルム層
よりも融点が低い重合体フィルムの複合層を設けたもの
であり、該複合層としては、ポリピロピレンフィルム層
と複合できればよく特に限定はないが、エチレンプロピ
レン共重合体、ポリエチレン、エチレン酢ビ共重合体等
が該ポリプロピレンフィルム層との接着性がよく、しか
も複合製膜した場合には、エッヂ部分の回収、再溶融押
出し利用ができて特に好1しく、該複合層ば2軸延伸、
1軸延伸、未延伸のいずれでもよい。
The composition of the P P -B O composite film used to achieve the present invention is a composite of a polypropimen biaxially oriented film layer and a polymer film having a melting point lower than that of the film layer on at least one side of the film layer. The composite layer is not particularly limited as long as it can be composited with the polypropylene film layer, but ethylene propylene copolymer, polyethylene, ethylene vinyl acetate copolymer, etc. can be used with the polypropylene film layer. It is particularly preferable that the composite film has good adhesion and that the edge portion can be recovered and remelted and extruded when the composite film is formed.
It may be uniaxially stretched or unstretched.

ここで、本発明でいうエンボスとは、第1図あるいは第
2図の様に複合フィルムの一部の層のみに凹凸変形を与
えたものではなく、第4図の如くに複合フィルムの全て
の層に亘る一体的なエンボス変形を与えるものである。
Here, the embossing in the present invention does not mean giving uneven deformation to only some layers of the composite film as shown in FIG. This provides an integral embossing deformation over the layers.

又1、本発明でいうエンボスパターンの転写率とは、1
対のエンボスロールの凹凸の深さく高さ)をDとし、エ
ンボス加工前のフィルムの厚さを第3図の如くAとし、
n枚重ね合せてエンボス加工されたエンボスフィルムの
見掛の厚さを第4図の如くBとすると、と定義する。
1. The transfer rate of the embossed pattern in the present invention is 1.
The depth and height of the unevenness of the pair of embossing rolls is D, the thickness of the film before embossing is A as shown in Figure 3,
Assuming that the apparent thickness of the embossed film formed by stacking n sheets and being embossed is B as shown in FIG. 4, it is defined as follows.

又、本発明でいうエンボスパターンの形態保持率とは、
n枚重ね合せてエンボス加工された見掛厚さBのエンボ
スフィルムに荷Jiの付与あるいは加熱等の何等かの処
理を与えた後のエンボスフィルムの見掛の厚さを第5図
の如くCとすると、 と定義する。
In addition, the form retention rate of the embossed pattern in the present invention is
The apparent thickness of the embossed film after applying some kind of treatment such as applying a load Ji or heating to the embossed film having an apparent thickness B which has been embossed by stacking n sheets is given as C as shown in Fig. 5. Then, it is defined as .

なお、エンボス方法としては通常の方法が使用できるが
、この場合重要なことは二ンボス温度として、複合層の
ガラス転位点以上、融点より低い温度を採用する点であ
る。
Note that a conventional embossing method can be used, but in this case, it is important to use a temperature higher than the glass transition point of the composite layer and lower than the melting point as the second embossing temperature.

係る条件を本発明の複合フィルムに採用することによっ
て、該複合層のエッヂ部分からのはみ出し及び流出等の
問題が起らず、従ってエンボスロールを汚さず、目詰捷
り等惹起することなく能率的に作業ができ、かつ複合層
の収縮も生じないので均質なエンボスパターンを得るこ
とができ、かつ接着力の点に訃いてもすぐれているもの
である。
By adopting such conditions for the composite film of the present invention, problems such as protrusion and outflow from the edge portion of the composite layer will not occur, and therefore the embossing roll will not be soiled and the efficiency will be improved without causing clogging etc. It can be used in a uniform manner, and since the composite layer does not shrink, a homogeneous embossed pattern can be obtained, and it has excellent adhesive strength.

エンボスパターン(エンボス形状)としては用途に応じ
て適宜のものが使用でき、実施例ニ示すものはその一部
の例に過ぎず、これに限定されるものではない。
As the emboss pattern (emboss shape), any appropriate one can be used depending on the application, and the one shown in Example 2 is only a part of the example, and the present invention is not limited thereto.

エンボスフィルムの接着力は、ASTM−()903−
49に準じて180度剥離法で測定した。
The adhesive strength of the embossed film is ASTM-()903-
It was measured by the 180 degree peeling method according to No. 49.

なお本発明でいう融点とは、サンフル10mgを走査型
熱量計(DSC)にセントして、N2気流中で5℃/m
inの昇温速度で昇温しで行った場合の融解ピーク温度
である。
Note that the melting point in the present invention refers to 10 mg of Sanflu placed in a scanning calorimeter (DSC) at 5°C/m in a N2 stream.
This is the melting peak temperature when the temperature is increased at a temperature increase rate of in.

実施例 1 135℃テトラリ/溶液による極限粘度が2.3、融点
が161℃のアイソタクチックポリプロピレンを溶融押
出法により押出しキャストし、タテ方向に5倍延伸して
厚さ280μの1軸延伸シートとなし、次に別の押出機
から、極限粘度1.6、エチレン含有量が2.1重量係
、融点が147℃の結晶性エチレンプロピレン共重合体
を溶融押出しして前記1軸延伸ポリプロピレンシート上
に40μの厚さでラミネートし、この複合フィルムを1
50℃の熱風中でヨコ方向に8倍延伸後熱セントして、
PP−BO基体層が35μ、1軸延伸エチレンプロピレ
ン共重合体層が5μ、合計40μの厚さのポリプロピレ
ン複合フィルムを得た。
Example 1 Isotactic polypropylene with an intrinsic viscosity of 2.3 and a melting point of 161°C in a 135°C tetragonal solution was extruded and cast using a melt extrusion method, and stretched 5 times in the vertical direction to obtain a uniaxially stretched sheet with a thickness of 280μ. Then, from another extruder, a crystalline ethylene propylene copolymer having an intrinsic viscosity of 1.6, an ethylene content of 2.1% by weight, and a melting point of 147° C. is melt-extruded to obtain the uniaxially stretched polypropylene sheet. This composite film is laminated with a thickness of 40μ on top.
After stretching 8 times in the horizontal direction in hot air at 50°C, heat centrifuge.
A polypropylene composite film having a total thickness of 40 μm, including a PP-BO base layer of 35 μm and a uniaxially oriented ethylene propylene copolymer layer of 5 μm, was obtained.

次に該複合フィルムを、エチレンプロピレン共重合体複
合層が内側になるように2枚重ね合せて、タテ0.66
閣、ヨコ0.66 rrrm、深さく高さ)0.2y+
+mのピラミント型凹凸が1−当り225個ある金属ロ
ールとペーパーロールヨリなる1対のエンボスロールを
使用して、30 kq/cmの圧力と、130℃の温度
rでエンボス加工を行ない、見掛厚さが168μの1枚
に積層接着されたエンボス複合フィルムを得た。
Next, two of the composite films were stacked so that the ethylene propylene copolymer composite layer was on the inside, and the height was 0.66.
Cabinet, width 0.66 rrrm, depth and height) 0.2y+
Using a pair of embossing rolls consisting of a metal roll and a paper roll, each having 225 piramint-shaped irregularities of +m, embossing was carried out at a pressure of 30 kq/cm and a temperature of 130°C. An embossed composite film having a thickness of 168 μm and laminated and bonded together was obtained.

このエンボスパターンの転写率は44%と優れ、又接着
力は116 f/cmと優れていた。
The transfer rate of this embossed pattern was excellent at 44%, and the adhesive strength was excellent at 116 f/cm.

該エンボスフィルムを脱湿するため120℃の熱風中で
24時間放置した後、室温筐で冷却してその見掛厚さを
測定したところ166μあり、形態保持率は98係と非
常に優れていた。
The embossed film was left in hot air at 120°C for 24 hours to dehumidify it, then cooled in a room temperature cabinet and its apparent thickness was measured to be 166μ, with an excellent form retention rate of 98. .

比較実施例 1 実施例1と同じ原料のアイソタクチックポリプロピレン
を、何も複合しない通常の方法で溶融押出ししてタテ5
倍、ヨコ8倍の2軸延伸、熱セントを行ない、厚さ40
μの通常のP P −B Oフィルム単体を得た。
Comparative Example 1 Isotactic polypropylene, which is the same raw material as in Example 1, was melt-extruded in a normal manner without any compounding and
Biaxially stretched by 8 times in the horizontal direction and 8 times in the horizontal direction, and heated to a thickness of 40
A single ordinary P P -BO film of μ was obtained.

該フィルムを2枚重ねて実施例1と同様な条件でエンボ
ス加工したところ、厚さ146μのエンボスフィルムが
得られたが、転写率は33%と低く、接着力は測定のた
めにサンプルを短冊状に切断する際に2枚に分離してし
筐い、測定できずOf/cmであった。
When two sheets of the film were stacked and embossed under the same conditions as in Example 1, an embossed film with a thickness of 146 μm was obtained, but the transfer rate was as low as 33%, and the sample was cut into strips to measure the adhesive strength. When it was cut into pieces, it separated into two pieces and could not be measured, resulting in Of/cm.

又実施例1と同一条件で120℃熱風中に24時間放置
したところ、自然に2枚のフィルムに剥離してし昔い、
それぞれの見掛厚さは52μであり、形態保持率は37
係と低かった。
Also, when it was left in hot air at 120°C for 24 hours under the same conditions as in Example 1, it naturally peeled off into two films.
The apparent thickness of each is 52μ, and the shape retention rate is 37
It was low compared to the person in charge.

一方、厚さ40μのエチレンプロピレン共重合体フィル
ム単体を同様にしてエンボス加工し、形態保持率を求め
たところ、42%と低かった。
On the other hand, when a single ethylene propylene copolymer film with a thickness of 40 μm was embossed in the same manner and the shape retention rate was determined, it was as low as 42%.

又実施例1でエンボス温度のみをエチレンプロピレン共
重合体の融点より5℃高い152’Cf−[−ンボス加
工したところ、エンボス1llKパターンが戻ってしま
い、転写率は27係と低く、更にエンボス時にエチレン
プロピレン共重合体がエッヂ部分から流出してエンボス
ロールを汚損する欠点が生じた。
In addition, in Example 1, when the embossing temperature was 152'Cf-[- which was 5°C higher than the melting point of the ethylene propylene copolymer, the embossed 1llK pattern returned, the transfer rate was as low as 27, and furthermore, during embossing, A drawback occurred in that the ethylene propylene copolymer flowed out from the edge portion and stained the embossing roll.

又実施例1で得られた複合フィルムを、実施例1と同じ
ように2枚重ね合せて、平滑な金属ロールとペーパーロ
ールよりなる同一周速のカレンダーロールを使用して、
実施例1と同じ30 hy/cmの圧力と130℃の温
度でカレンダー加工したが、2枚の複合フィルムは全く
接着しなかった。
Also, two sheets of the composite film obtained in Example 1 were stacked together in the same manner as in Example 1, and a calender roll made of a smooth metal roll and a paper roll with the same circumferential speed was used.
Although calendering was carried out at the same pressure of 30 hy/cm and temperature of 130° C. as in Example 1, the two composite films did not adhere at all.

実施例 2 厚さ40μの通常のP P −B Oフィルム上に、通
常の方法により融点が100℃の低密度ポリエチレンを
エクストルージョンラミネートして、PP−BO基体層
が40μ、複合未延伸ポリエチレン層が10μからなる
合計厚さが50μの複合フィルムを得た。
Example 2 Low-density polyethylene with a melting point of 100° C. is extrusion laminated on a regular PP-BO film with a thickness of 40μ by a conventional method to form a PP-BO base layer of 40μ and a composite unstretched polyethylene layer. A composite film having a total thickness of 50μ and consisting of 10μ was obtained.

該複合フィルムをポリエチレン複合層が内側になるよう
[2枚重ね合せて、底辺の1辺が1mmで、高さが0.
45mmの亀甲状パターンを有する1対の金属ロールと
ペーパーロールよりなるエンボスロールで、35kq/
cmの圧力と、90℃の温度下でエンボス加工して、見
掛厚さ293μの1枚に積層接着されたエンボス複合フ
ィルムを得た。
The composite film was stacked so that the polyethylene composite layer was on the inside, one side of the base was 1 mm, and the height was 0.
An embossing roll consisting of a pair of metal rolls and a paper roll with a 45mm hexagonal pattern, 35kq/
Embossing was carried out under a pressure of cm and a temperature of 90°C to obtain a single laminated and bonded embossed composite film with an apparent thickness of 293μ.

該フィルムの転写率は43%であり、接着力ば270
y/cmと優れていた。
The transfer rate of the film was 43%, and the adhesive strength was 270%.
y/cm, which was excellent.

該エンボス複合フィルムを80℃熱風中に24時間放置
した結果、見掛厚さは285μあり、形態保持率は96
係と良好であった。
As a result of leaving the embossed composite film in hot air at 80°C for 24 hours, the apparent thickness was 285μ, and the shape retention rate was 96.
I was on good terms with the person in charge.

比較実施例 2 厚さ50μの低密度ポリエチレンフィルム単体1枚に実
施例2と同様にエンボス加工を行ない形態保持率を求め
たところ、38係と低かった。
Comparative Example 2 A single low-density polyethylene film having a thickness of 50 μm was embossed in the same manner as in Example 2, and the shape retention rate was determined to be as low as 38.

又実施例2でエンボス温度のみを低密度ポリエチレンの
融点より20℃高い120℃でエンボス加工したところ
、転写率は29係と低く、又エッヂ部分から低密度ポリ
エチレンが流出してエンボスロールを汚損する問題が生
じた。
Furthermore, in Example 2, when embossing was carried out at only the embossing temperature of 120°C, which is 20°C higher than the melting point of low-density polyethylene, the transfer rate was as low as 29 degrees, and the low-density polyethylene flowed out from the edge portion, staining the embossing roll. A problem arose.

更に又、実施例2で、エンボスロールヲ平滑ナカレンダ
ーロールに変えて実施例2と同一の圧力と温度でカレン
ダー加工したが、2枚の複合フィルムは接着しなかった
Furthermore, in Example 2, the embossing roll was replaced with a smooth calender roll and calendering was carried out at the same pressure and temperature as in Example 2, but the two composite films did not adhere.

実施例 3 通常の未延伸ポリプロピレンフィルムの片面に複合層と
して融点が86℃のエチレン酢ビ共重合体(酢ビ含有量
12重量%)フィルムを熱プレスでリミネートしてから
フィルムストレッチャーで5×8倍の2軸延伸を行ない
、P P −B O基体層が25μ、エチレン酢ビBO
複合層が5μ、合計厚さが30μの複合フィルムを得た
Example 3 An ethylene-vinyl acetate copolymer (vinyl acetate content: 12% by weight) film with a melting point of 86°C was laminated as a composite layer on one side of a normal unstretched polypropylene film using a heat press, and then stretched 5x using a film stretcher. 8 times biaxial stretching, P P -BO base layer is 25μ, ethylene vinyl acetate BO
A composite film with a composite layer of 5μ and a total thickness of 30μ was obtained.

該複合フィルムを、エチレン酢ビ共重合体複合層が内側
になるように2枚重ね合せて実施例1と同じエンボスロ
ールで35 kV/cmの圧力と80℃の温度でエンボ
ス加工を行ない、見掛厚さが144μの1枚に積層接着
されたエンボス複合フィルムを得た。
Two of the composite films were stacked so that the ethylene vinyl acetate copolymer composite layer was on the inside, and embossing was performed using the same embossing roll as in Example 1 at a pressure of 35 kV/cm and a temperature of 80°C. An embossed composite film having a thickness of 144 μm and laminated and bonded together was obtained.

この転写率は42係と優れ、又接着力は28497cm
と優れていた。
The transfer rate is excellent at 42%, and the adhesive strength is 28497 cm.
It was excellent.

つぎに該エンボスフィルムラ70℃の熱風中に24時間
放置したところ、見掛厚さは140μあり、形態保持率
は95係と良好であった。
Next, when the embossed film was left in hot air at 70° C. for 24 hours, the apparent thickness was 140 μm, and the shape retention rate was good at 95%.

比較実施例 3 実施例3に卦いて、厚さ30μのエチレ/酢ビ共重合体
の単体フィルム1枚に、実施例3と同様にエンボス加工
を行ない転写率と形態保持率を求めたところ、夫々31
係と35俤と低かった。
Comparative Example 3 Contrary to Example 3, a single film of ethylene/vinyl acetate copolymer with a thickness of 30 μm was embossed in the same manner as in Example 3, and the transfer rate and form retention rate were determined. 31 each
The price was as low as 35 yen.

以上の如く、本発明によれば、エンボスパターンの転写
率が低く、かつ形態保持性の悪いPP−BOフィルムに
、同様に転写率と形態保持性の悪いP P −B Oよ
りも融点の低い他ポリマーを少なくとも片面に複合して
、該複合フィルムを融点の低い複合層同志が接するよう
に2枚以上重ね合せて、該複合層の融点よりも低い温度
で全層に亘るエンボス加工を施すことにより、驚くべき
ことに、1枚に積層接着された転写率と形態保持性のよ
いP P −B O複合エンボスフィルムが容易に得ら
れることを見出したものであり、特に最外層をPP−B
O基体層としておくことにより、複合層ばPP−BO層
で完全に被覆されるので、PP−BOフィルムの有する
優れた機械的、電気的、化学的性質をその筐ま保持した
優れたエンボスフィルムが得られるものであり、特に絶
縁流体が循環するトランスの如き電気機器の層間材料に
好適であり更に又従来品々60μの厚さ昔でしか工業生
産できなかったPP−BOフィルムが、本発明によれば
任意の厚さ乞ベースとしたエンボスフィルムが得られる
わけであり、その実用的効果は極めて大なるものである
As described above, according to the present invention, a PP-BO film with a low transfer rate and poor shape retention of an emboss pattern is coated with a PP-BO film having a lower melting point than PP-BO, which also has a poor transfer rate and shape retention. Composite other polymers on at least one side, stack two or more composite films so that the composite layers with low melting points are in contact with each other, and perform embossing over the entire layer at a temperature lower than the melting point of the composite layer. Surprisingly, it was discovered that a PP-BO composite embossed film laminated into a single sheet with good transfer rate and shape retention can be easily obtained, especially when the outermost layer is made of PP-B
By using the O base layer, the composite layer is completely covered with the PP-BO layer, resulting in an excellent embossed film that retains the excellent mechanical, electrical, and chemical properties of the PP-BO film. It is particularly suitable for interlayer materials in electrical equipment such as transformers in which insulating fluid circulates.Furthermore, the PP-BO film, which could only be industrially produced in the past with a thickness of 60 μm, has been improved by the present invention. According to this method, an embossed film having an arbitrary thickness can be obtained, and its practical effects are extremely large.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はP P −B O基体層の片面のみに複合層が
あり、該複合層のみをエンボス変形した本発明の対象外
であるエンボスフィルムの断面図の1例である。 第2図ばPP−BO層の両面に複合層があり、該複合層
のみをエンボス変形した本発明の対象外であるエンボス
フィルムの断面図である。 第3図は、P P −B O基体層の片面に複合層を有
する複合フィルムの1例である。 第4図は第3図の複合フィルムを、複合層同志が接する
ように内側に向けて2枚重ね合せてエンボス加工を施し
、1枚に積層接着された本発明のエンボス複合フィルム
の断面図の1例である。 第5図は、第4図のエンボス複合フィルムに処理を加え
た後の断面図の1例である。 1 :PP−BO基体層、2:複合層。
FIG. 1 is an example of a cross-sectional view of an embossed film, which is outside the scope of the present invention, in which there is a composite layer on only one side of the P P -BO base layer, and only the composite layer is embossed. FIG. 2 is a cross-sectional view of an embossed film, which is outside the scope of the present invention, in which there is a composite layer on both sides of the PP-BO layer, and only the composite layer is embossed. FIG. 3 is an example of a composite film having a composite layer on one side of a P P -BO substrate layer. FIG. 4 is a cross-sectional view of the embossed composite film of the present invention in which two composite films of FIG. This is one example. FIG. 5 is an example of a cross-sectional view of the embossed composite film shown in FIG. 4 after being processed. 1: PP-BO base layer, 2: composite layer.

Claims (1)

【特許請求の範囲】[Claims] 1 ポリプロピレン2軸延伸フイルムの少なくとも片面
に、該フィルムよりも融点の低い重合体からなる複合さ
れてなるポリプロピレン2軸延伸複合フィルムを、該複
合層同志が接するように2枚以−E重ね合せ、該複合層
の融点より低い温度で、全層に亘るように一体的にエン
ボス加工を施したことを特徴とするエンボスフィルムの
製造方法。
1. On at least one side of a biaxially stretched polypropylene film, two or more biaxially stretched polypropylene composite films made of a polymer having a lower melting point than that of the film are stacked so that the composite layers are in contact with each other, A method for producing an embossed film, characterized in that the entire layer is integrally embossed at a temperature lower than the melting point of the composite layer.
JP9749875A 1975-08-13 1975-08-13 Embossed film Seizouhouhou Expired JPS5835136B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9749875A JPS5835136B2 (en) 1975-08-13 1975-08-13 Embossed film Seizouhouhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9749875A JPS5835136B2 (en) 1975-08-13 1975-08-13 Embossed film Seizouhouhou

Publications (2)

Publication Number Publication Date
JPS5222054A JPS5222054A (en) 1977-02-19
JPS5835136B2 true JPS5835136B2 (en) 1983-08-01

Family

ID=14193918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9749875A Expired JPS5835136B2 (en) 1975-08-13 1975-08-13 Embossed film Seizouhouhou

Country Status (1)

Country Link
JP (1) JPS5835136B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2848813C2 (en) * 1978-11-10 1981-10-01 Uni-Cardan Ag, 5200 Siegburg Universal joint
AT383542B (en) * 1985-01-25 1987-07-10 Harald Dipl Ing Schobermayr STIFF MOLDED BODY COMPRISED ORIENTED PLASTIC CARRIER AND METHOD FOR THE PRODUCTION THEREOF
JPS6357921A (en) * 1986-08-26 1988-03-12 Hiroshi Teramachi Universal coupling

Also Published As

Publication number Publication date
JPS5222054A (en) 1977-02-19

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