JPS583371B2 - Kotaidenkaicondensano Seizouhouhou - Google Patents
Kotaidenkaicondensano SeizouhouhouInfo
- Publication number
- JPS583371B2 JPS583371B2 JP49117506A JP11750674A JPS583371B2 JP S583371 B2 JPS583371 B2 JP S583371B2 JP 49117506 A JP49117506 A JP 49117506A JP 11750674 A JP11750674 A JP 11750674A JP S583371 B2 JPS583371 B2 JP S583371B2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- anode lead
- covering
- capacitor
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】
本発明は固体電解コンデンサの製造方法の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a solid electrolytic capacitor.
一般に固体電解コンデンサはコンデンサ素子の陽極リー
ドに外部リード線を溶接する際に、半導体層が火花,熱
ショックなどにより破壊されて、陰極と陽極とが短絡し
たり、或いは漏洩電流が増加したりするなどその特性が
著しく損なわれることが知られている。Generally, when an external lead wire is welded to the anode lead of a capacitor element in a solid electrolytic capacitor, the semiconductor layer is destroyed by sparks, thermal shock, etc., resulting in a short circuit between the cathode and anode, or an increase in leakage current. It is known that its properties are significantly impaired.
従って、従来においては陽極リードの根元部分にテフロ
ンワツシャを装着して、溶接時における半導体層への悪
影響を防止しているが、テフロンワツシャが小型である
ために陽極リードへの装着性が悪く、作業性を著しく低
下させるという欠点がある。Therefore, in the past, a Teflon washer was attached to the base of the anode lead to prevent adverse effects on the semiconductor layer during welding, but the small size of the Teflon washer made it difficult to attach it to the anode lead. This method has the disadvantage of significantly reducing workability.
本発明はこのような点に鑑み、特別の作業工程を付加す
ることなく、溶接に起因する電極間短絡ないし漏洩電流
の増加を極めて簡単に防止しうる固体電解コンデンサの
製造方法を提供するもので、以下その一方法について説
明する。In view of these points, the present invention provides a method for manufacturing a solid electrolytic capacitor that can extremely easily prevent short circuits between electrodes or increases in leakage current caused by welding without adding any special work steps. , one method will be explained below.
まず、第1図に示すようにタンタル,ニオブ,アルミニ
ウムなどのように弁作用を有する金属粉末を円柱状に加
圧成形し焼結してなるコンデンサ素子1に予め弁作用を
有する金属線を陽極リード2として植立する。First, as shown in Fig. 1, a metal wire having a valve action is attached as an anode to a capacitor element 1 which is made by press-molding metal powder having a valve action such as tantalum, niobium, aluminum, etc. into a cylindrical shape and sintering it. Plant it as lead 2.
そして酸化層形成工程(化成工程),半導体層形成工程
(分解工程)を経た後、コンデンサ素子1の表面に陰極
層1aを形成する。After passing through an oxide layer forming step (chemical conversion step) and a semiconductor layer forming step (decomposition step), a cathode layer 1a is formed on the surface of the capacitor element 1.
次に第2図に示すように、第1の外部リード線3の下端
をコンデンサ素子1の陰極層1aに当接させると共に半
田などの接続部材にて接続する。Next, as shown in FIG. 2, the lower end of the first external lead wire 3 is brought into contact with the cathode layer 1a of the capacitor element 1 and connected with a connecting member such as solder.
そしてこの状態でコンデンサ素子1をフェノール樹脂,
エボキシ樹脂など液状の樹脂材に侵漬し、引上げること
によりそれの全周面に第1の樹脂材4を被着して第1の
外装を終了する。In this state, capacitor element 1 is covered with phenol resin.
By immersing it in a liquid resin material such as epoxy resin and pulling it up, the first resin material 4 is coated on its entire circumferential surface, thereby completing the first exterior covering.
次に第3図に示すように第2の外部リード線5の自由端
、例えばL形状の屈曲部を陽極リード2に交叉させて溶
接する。Next, as shown in FIG. 3, the free end of the second external lead wire 5, for example, the L-shaped bent portion, is crossed over the anode lead 2 and welded.
そしてX−X部分より陽極リード2のみを切断する。Then, only the anode lead 2 is cut from the XX portion.
然る後、第4図に示すようにコンデンサ素子1をエポキ
シ樹脂,シリコン樹脂など液状の第2の樹脂材6に侵漬
し引き上げることにより、第1の樹脂材4並びに陽極リ
ード2と第2の外部リード線5との溶接部分を完全に被
覆して第2の外装を終了する。Thereafter, as shown in FIG. 4, the capacitor element 1 is immersed in a liquid second resin material 6 such as epoxy resin or silicone resin and pulled up to separate the first resin material 4, the anode lead 2, and the second resin material 6. The welded portion with the external lead wire 5 is completely covered to complete the second sheathing.
尚、本発明は何ら上記実施例にのみ制約されることなく
、例えば外装は侵漬法の他、樹脂粉末による流動侵漬法
,プラズマジェットによる溶射法などにて行うこともで
きる。It should be noted that the present invention is not limited to the above-described embodiments; for example, in addition to the dipping method, the exterior packaging may be performed by a fluid dipping method using resin powder, a thermal spraying method using a plasma jet, or the like.
以上のように本発明によれば、陽極リード2に第2の外
部リード線5を溶接する前に、コンデンサ素子1の全周
面が第1の樹脂材によって一次外装されるために、両者
の溶接時に発生する火花などによって半導体層が破壊さ
れることはない。As described above, according to the present invention, before welding the second external lead wire 5 to the anode lead 2, the entire circumferential surface of the capacitor element 1 is primarily covered with the first resin material. The semiconductor layer will not be destroyed by sparks generated during welding.
しかも、この外装は本来最終工程において一括して行な
われているものを単に分離したものであるから、何ら作
業性を損なわないのみならず、この一次外装は半導体層
の形成直後に行われるので、同層の吸湿性を軽減できコ
ンデンサ特性を改善することができる。Moreover, since this packaging is simply separated from what was originally done all at once in the final process, it not only does not impair workability, but also because this primary packaging is performed immediately after the formation of the semiconductor layer. The hygroscopicity of the same layer can be reduced and the capacitor characteristics can be improved.
第1図〜第4図は本発明方法を説明するための正断面図
である。1 to 4 are front sectional views for explaining the method of the present invention.
Claims (1)
の外部リード線を接続する工程と、この工程後、コンデ
ンサ素子の全周面を第1の樹脂材にて被覆する第1の外
装工程と、この第1の外装工程後、陽極リードに第2の
外部リード線を溶接する工程と、陽極リードの不要部を
除去する工程と、除去工程後、陽極リードと第2の外部
リード線との溶接部分並びに第1の樹脂材を第2の樹脂
材にて完全に被覆する第2の外装工程とを含むことを特
徴とする固体電解コンデンサの製造方法。1. The first
After this step, a first covering step of covering the entire circumferential surface of the capacitor element with a first resin material; After this first covering step, a second covering step is performed on the anode lead. a step of welding the external lead wire of the anode lead, a step of removing unnecessary parts of the anode lead, and a step of welding the welded part of the anode lead and the second external lead wire and the first resin material to a second resin material after the removal step. A method for manufacturing a solid electrolytic capacitor, the method comprising: a second packaging step of completely covering the capacitor with a second packaging step.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49117506A JPS583371B2 (en) | 1974-10-11 | 1974-10-11 | Kotaidenkaicondensano Seizouhouhou |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49117506A JPS583371B2 (en) | 1974-10-11 | 1974-10-11 | Kotaidenkaicondensano Seizouhouhou |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5142954A JPS5142954A (en) | 1976-04-12 |
JPS583371B2 true JPS583371B2 (en) | 1983-01-21 |
Family
ID=14713428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49117506A Expired JPS583371B2 (en) | 1974-10-11 | 1974-10-11 | Kotaidenkaicondensano Seizouhouhou |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS583371B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0215013Y2 (en) * | 1983-11-30 | 1990-04-23 | ||
JPH0257777U (en) * | 1988-10-21 | 1990-04-25 | ||
JPH0542952Y2 (en) * | 1987-09-30 | 1993-10-28 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5723880A (en) * | 1980-07-18 | 1982-02-08 | Ricoh Elemex Corp | Train wheel construction of watch |
JPS5723881A (en) * | 1980-07-19 | 1982-02-08 | Ricoh Elemex Corp | Train wheel construction for watch |
JP2607026B2 (en) * | 1993-03-10 | 1997-05-07 | 学 福田 | carrying case |
-
1974
- 1974-10-11 JP JP49117506A patent/JPS583371B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0215013Y2 (en) * | 1983-11-30 | 1990-04-23 | ||
JPH0542952Y2 (en) * | 1987-09-30 | 1993-10-28 | ||
JPH0257777U (en) * | 1988-10-21 | 1990-04-25 |
Also Published As
Publication number | Publication date |
---|---|
JPS5142954A (en) | 1976-04-12 |
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