JPS583281A - Photovoltaic type semiconductor device - Google Patents

Abstract

PURPOSE:To secure the optical signal transmission efficiency and the airtightness of a light guide by hermetically sealing in advance an optical part for guiding an optical signal, optically coupling them with the light guide and fixing them. CONSTITUTION:A metallic cylider 31 and a light guide 32 are provided in the hole of a cylindrical insulator 19 in a structure hermetically sealed in acvance. A light guide 17 is fixed at one end with a fixing agent 18 to match to the photodetector of an optical thyristor body 11, is inserted at the other end into the cylinder 31 coated with fixing agent 34, and is fixed by adjusting the confronting distance with the light guide 32. Thus, the light guide 17 is optically coupled to a hermetically sealed light guide 32, and is integrally fixed, and since silicone rubber is used as the agent 34, it can be fixed at a low temperature, and the deterioration of the optical signal transmission characteristic of the light guide 17 is not introduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optically driven semiconductor device that is easy to assemble and has improved reliability.

Optically driven semiconductor devices, such as optical thyristors, have easy electrical insulation between the main circuit and the control circuit, do not malfunction due to foreign noise coming from the control circuit, and are dust-free. It has excellent features such as being easy to use, making it possible to realize an inexpensive and highly reliable device. Taking advantage of these characteristics, application to various ultra-high voltage power conversion devices, including silisk valves for DC power transmission, is attracting attention.

Now, in ultra-high voltage conversion devices such as thyristor pulp for DC power transmission, more than 100 optical thyristors are connected in series.
Power conversion is performed at ultra-high voltages ranging from 100 to 500 kV. For this purpose, several optical thyristors 1m and Ib are installed as shown in FIG.

ICs are connected in series via cooling fins 1m, 2b, lc, 2d, and a plurality of ICs are integrated into one module, and a plurality of ICs are connected in series to form the above-mentioned Iristor pulp. In this case, each party's thyristors Ja, Jb, Jc
includes a light source 31. such as a light emitting diode. Signal lights from Jb and jc are transmitted over several meters via light guides 4m, 4b, and 4a. These optical signals are transmitted to the optical thyristors 1m, 1b and the optical No. 4m introduction window 5m provided in the IC envelope, respectively.

Thyristors 1-9lb, 1 for each party above through 5b, 5c
It is given to each light receiving direction of @.

In the past, nine thyristors comprising such an optical thyristor monoyl t-m are generally constructed as shown in FIG.

The optical thyristor main body 11 has one surface connected to seven node electrodes via a metal plate 12, and the other surface connected to a gold M
It is connected to the cathode turtle 15 via the waist 14. A window for inputting an optical trigger signal is provided in the center of the gold plate ll4jll1114, and a light receiving surface 16 is formed.
A light guide 17 that guides the optical trigger signal through a wire provided on the cathode electrode 15 is disposed in the light receiving direction 16 with one end thereof optically coupled.

This light guide 11 is identified by optically coupling its one end to the light receiving section [J6] using an adhesive 18 such as silicone rubber. The optical thyristor main body 11 is housed inside a cylindrical insulator I9 made of ceramic, and an insulator 190
They are connected to the electrodes 13.15 through metal plates 20a and jOb provided at both ends, respectively, and are hermetically sealed. The optical thyristor main body 11 has a structure that is hermetically sealed inside an envelope constituted by each of these components. Incidentally, the optical Nyristor body 11 includes an anode electrode 11, a P emitter semiconductor layer JJa, an N base semiconductor layer 11b, ? -4- The metal film 14 consists of an N emitter conductor layer 114 and an N emitter conductor layer 114, and the metal film 14 is formed by depositing aluminum on the N conductor layer JJd using a mask. The metal plate 12 is formed by the optical thyristor main body 1.
%0, which is close to the coefficient of thermal expansion of silicon constituting 1, for example, tungsten. On the other hand, the other end of the light guide 1r is inserted into the metal cylinder 11 and airtightly fixed to the metal cylinder 21 with a fixing agent 21 such as low melting point T9, and furthermore, the m-plane of the metal cylinder 21, TTB cylindrical insulator 1
It penetrates the # wall surface and is fixed to this 11th surface by air 1111c. A fixing member 21 for fixing one end of the light guide 4 with a screw is provided at the outer protruding end of the metal cylinder 21 fixed to the 11th surface, thereby allowing the light guide 4 and the two light guides 11 to be fixed together. K'&-p are opposed to each other and optically coupled. That is, the optical signal introduction window 5 is formed by the end portion of the PJFO tube, the metal tube 11, and the fixing member 21.

However, since the ζO-like structure manufactured by Hikari Nyristor Co., Ltd. was manufactured using the following procedure, it had the following drawbacks. That is, after fixing the surface of the P emitter layer 11 of the optical Nyristor main body 11 and the metal plate 11 to aluminum via a nium foil, the metal plate 12 is attached to the anode electrode 1.
Fix the soldering to 1. At the F-0 stage, insulator cylinder 1
9, the light guide 11 is airtightly fixed via the anode electrode JjK metal @JOb, and then the light guide 11 is passed through the metal cylinder 21 identified in advance as the cylindrical insulator 1#, and one end of the light guide 110 is The light guide 11 and the metal tube 21 are fixed in accordance with the light receiving part 16 with the fixing agent 1-, and at the same time, the light guide 11 and the metal tube 21 are airtightly fixed using the fixing agent 21. Thereafter, the cathode electrode IJ is joined to the metal plate 14 by aligning the groove 111 so as not to contact the light guide JFK, and the cathode electrode 15 is hermetically sealed and fixed to the cylindrical insulator 19 via the metal plate j01. In this way, an optical thyristor is manufactured.

However, according to this manufacturing process, light guide 1
After fixing the light guide 1 to the light receiving part IC, the light guide 11 is hermetically sealed to the metal tube 11 inside the cylindrical insulator 19 using a fixing agent 22 such as low melting point glass, which has poor workability. Idiot 9 caused the problem of reduced reliability of the hermetically sealed part. Moreover, although this hermetic sealing is performed by heating at 400 to 500° C. or higher, it also has negative effects such as a decrease in light transmission efficiency caused by the light guide ZFK.

The present invention was created with these circumstances in mind, and its purpose is to improve workability during device manufacturing, and to ensure sufficient optical signal transmission and efficiency of the light guide. The object of the present invention is to provide a light-driven semiconductor device that secures its airtightness and has high quality.

That is, in the present invention, an O-light I# component for introducing an optical signal is provided in advance by penetrating the wall surface of the envelope and hermetically sealed, and a cylindrical coupling component whose inner surface is treated to reflect light is used to connect the optical component and the light. By adopting a structure in which the light guide is fixed by condensing light, it is possible to eliminate the need for hermetically sealing the light guide and effectively achieve the above-mentioned objects.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the apparatus of this embodiment, the same parts as those of the conventional apparatus shown in FIG. 3 are denoted by the same reference numerals, and their explanation will be omitted.

The optical thyristor main body 11 is fixed to the anode electrode 13 and attached to the cylindrical insulator 1# in the same manner as in the conventional device. In this case, the cathode electrode III@ is not yet hermetically sealed.

On the other hand, on the wall of the cylindrical insulator 19, a metal tube (joint part) is attached.
31 penetrates the wall surface and is fixed airtightly. The inner surface of the metal tube 31 has been plated with chrome to significantly increase its light reflectance, and the light guide J2 is assembled as an optical component before being attached to the cylindrical insulator 1#. It is fixed airtight using a fixing agent such as 3J, low melting point, f2 gas, etc. The light guide J2 is fitted to a predetermined depth from one opening side of the metal tube 11, and a space into which the light guide 11 is inserted is formed on the other opening side. It is set. by this,
Table 9 shows that the wall surface of the cylindrical insulator 1# has a structure in which a metal tube 31 and a light guide J2 are installed in the hole, and the structure is already hermetically sealed.

After that, one end of the light guide JFii is aligned with the light receiving part of the optical silisk main body 11, and its surroundings are fixed using a fixing agent 11 such as silicone, etc., and the other end of the light guide 11 is fixed with the above-mentioned silicone shim or the like. Fixative 34
Insert the coated metal tube alK, adjust the facing distance with the light guide J2, and fix it. This fixative 18°14
are transparent to the optical signal, and the light guides xr, sx
The light guides J F and JJ are fixed integrally. The fixative 11 made of silicone shim is assimilated by heating at 150 to 200 degrees Celsius.

Thereafter, the cathode electrode IJ is attached to the optical cyrisk main body 11 and hermetically sealed to the cylindrical insulator 1#, thereby completing the present device.

According to the structure of this device, there is no need to hermetically seal and fix the light guide 11 in a metal tube as in the conventional case. Since the guide (optical component) 32, metal tube J1, and fixing agent SX are hermetically sealed, the light and Y-id 11 are inserted into the metal tube 31 and optically coupled to the light guide 32. However, if this is fixed, the purpose will be fully achieved. Moreover, by using a silicone shim as the fixing agent 34,
℃1! It is possible to perform reliable fixing at very high temperatures, and it is simple and can ensure sufficient mechanical strength. Moreover, as mentioned above, since the immobilization treatment can be performed at a low temperature,
Causes deterioration of optical signal transmission characteristics of light guide 1F <III
There is no doubt that Io. In addition, the light guide 11° 31 is effectively optically coupled by light reflection on the inner surface of the metal cylinder 31. In addition, when silicone as the fixing agent J4 is filled inside the light guide 11, the fixing agent 34 is By solidification, the two light guides 1r and II function optically as if they were one light guide, so the optical signal transmission efficiency can also be improved in this respect. Furthermore, since the positional deviation of the light receiving section 16 can be adjusted by the facing distance of the light guide IF, 81, the positioning accuracy of fixing the optical thyristor main body II to the 7-node electrode 13 is greatly reduced. becomes possible. As a result, the overall workability of assembling the device can be simplified, and it is possible to significantly improve work efficiency. In addition, in this structure, the optical signal introduction window 5 is hermetically sealed before the device is assembled, so it is effective to prevent accidents such as deterioration of the characteristics of the sealed area due to clumsiness during assembly. By preventing this from occurring, it has a tremendous effect on color discoloration, etc.

FIG. 4 shows the configuration of another embodiment of the device 0III of the present invention, in which the metal tube 31 in the previous embodiment is divided into two parts, and is composed of a first metal tube 3X- and a 20th metal tube Jlb. are doing. The first metal tube JJa has both ends protruding from each other, the light guide 32 is inserted therein, and the light guide 32 is hermetically sealed and fixed. At the same time, the first metal tube JJa is penetrated through the cylindrical insulator 11 and hermetically sealed and fixed. has been done. The Tsumashikodogo introduction window 5 is inserted through the first metal cylinder 11apc9 and the light guide 32 and is hermetically sealed to the envelope and provided thereon. On the other hand, the third metal cylinder 31b has an inner surface polished to a J6J mirror surface, for example.
The light 01 radiation is significantly increased, and the ISK is optically bright and is filled with a fixing agent J4 having a refractive index of O'@ and the light guides xr, xz. But lever C1
1I212) The light guides xv and sz are inserted into the metal @JMb from both ends facing each other, and both light guides 17132 are optically and mechanically coupled by weight.

If the structure is as shown in FIG. can.

Figure 5 shows another embodiment of the light guide 1.
1, a plate-shaped optically transparent optical component 1j is used.

Even in the case of the ζO surface structure, the above-mentioned optical component SS can be hermetically sealed and fixed to the envelope in advance, so the same effect as in the previous embodiment can be obtained -d! It's not even a moat where it's played.

In short, the present invention can be used by changing the shapes of optical parts and coupling parts in various ways according to specifications, and is also suitable for use not only with optical thyristors but also with optical transistors and other optically driven semiconductor devices. The embodiments are not particularly limited.

As explained above, according to the present invention, it is possible to ensure sufficient airtightness of the envelope, and also to greatly improve workability during assembly. In addition, there are no holes that cause a decrease in optical signal transmission efficiency, and the reliability of the optically driven semiconductor device can be dramatically improved. II can be provided.

[Brief explanation of drawings]

Figure 1 is a diagram showing an example of the configuration of an optical thyristor module, J
Figure 1F2 is a schematic diagram of the conventional device O, Figure 3 is a schematic diagram of the scissors device according to the present invention, and Figures 4 and 5 are diagrams of the main parts of another embodiment of the present invention. It is. 11... Optical thyristor body, JJ- anode electrode,
15... Cando electrode, 16-- Light receiving section, 11...
Light guide, 19--cylindrical insulator, 31--metal cylinder (coupling ISJ&), Jj--light guide (optical component), JJ, JJ--fixing agent, JJ--- optical component.

Claims (4)

[Claims] (1) A light-driven semiconductor element, an envelope in which the light-driven semiconductor element is housed and hermetically sealed, and an outside of the envelope that is fixed airtightly through the wall of the outer container. an optical component that introduces an optical signal from the light source into the interior of the envelope; a light guide that connects one end to the light receiving surface of the optically driven semiconductor element and supplies light introduced from the other end to the light receiving surface; 1. A light-driven semiconductor device, comprising: a cylindrical coupling component whose inner surface is treated to reflect light, which is fitted to the other end of the light guide to optically couple the optical component and the light guide. (2) The coupling part is a joint in which an optical part is fitted and integrally fixed to the wall of the envelope in an airtight manner, and the light guide is installed inside the cylindrical interior of the envelope. The optically driven semiconductor device according to claim 1, which is fitted and fixedly held. (3) The coupling component has a cylindrical interior filled with a light-transmitting optical material having a refractive index of approximately 1 kIj with the light guide and the optical component to be optically coupled. Light-driven semiconductor device. (4) The optically driven semiconductor device according to claim 1, wherein the internal light reflection treatment of the cylindrical joint component is performed by mirror polishing or coating with a light reflector.