JPS5831276B2 - Flux composition for soldering - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to a flux composition for soldering, and in particular, by adding diisobutyl adibate to the flux base material, the concentration of the flux is stabilized, and the soldering properties are made uniform. Furthermore, it can be used in various ways, improves stability during controlled storage, and eliminates smoke toxicity.

Liquid resin-based fluxes and non-water-soluble organic fluxes, which are mainly used for electrical and electronic equipment, assembly of their parts, and wiring, are resins or activated resins dissolved in one or more solvents, or organic fluxes. It is made by melting and dispersing acids and organic salts in one or more kinds of solvents, or by adding P, E, G, etc. to them.

Most of the solvents used in these products generally evaporate completely below the soldering temperature, and the flux-effective components are designed to directly and effectively act on the base metal surface, so the boiling point Alcohols and ethers, which are classified as solvents with relatively low levels of volatility and high volatility, are used as solvents.

Therefore, during the course of its use, the concentration of the flux changes significantly, making it difficult to maintain and manage the concentration, which poses a problem in achieving uniform soldering.

This change in concentration is particularly noticeable when the temperature condition of the usage environment is higher than room temperature.

Among the alcohols and ethers, it is known that pendel alcohol and butyl ethyl ether are used for the purpose of preventing the concentration change.

However, pendel alcohol has the disadvantage that it generates a large amount of smoke during soldering, and butyl ethyl ether has the disadvantage that its properties are harmful to the human body.

When flux is used as so-called resin-cored solder glue, "gloss breakage" is a problem that must be taken care of in the upper stages of manufacturing this resin-cored solder.

This is because a portion of the tubular solder does not have any solder, making it impossible to apply flux to the workpiece.

This type of "gloss breakage" occurs because there is an extremely large difference in the coefficient of thermal expansion between the tubular 1-j: solder and the flux sealed in it, and as the outer solder tube shrinks as it cools. This is due to the fact that the flux shrinks even more, creating a cavity in the solder tube.

This invention solves these problems of conventional fluxes.

That is, an object of the present invention is to provide a flux that allows substantially uniform soldering with little concentration change, and an object of the present invention is to provide a non-toxic flux; It is an object of the invention to provide a flux that emits less smoke during soldering operations, and a further object of the invention is to provide a flux that can be used in many different ways. In particular, the purpose of this invention is to have a thermal expansion coefficient that has a small difference from that of solder, and which is suitable for use as a flux cored solder.
The purpose is to provide a flux that does not cause nicks.

The above-mentioned objects of the present invention can be distantly related by the following configuration.

That is, the present invention provides a flux base selected from the group consisting of resins, activated resins, organic acids, and organic salts;
It relates to a soldering flux composition consisting of diimbutyl adibate, and more specifically, a flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and the total amount of flux. 2-90 against
(by weight) percent diisobutyl adibate and a flux composition for soldering.

A feature of the structure of this invention is that diisobutyl adibate is added and dispersed in the base.

Therefore, the amount of diimbutyl adibate to be added can be selected from various values.

For example, even if diisobutyl adibate is added at 1.5 to 1.9 weight percent (hereinafter referred to as weight percent) based on the total amount of flux, the effect is not completely absent.

However, specifically for use in flux cored solder, coating, preflux, and liquid flux, it is preferable that diisobutyl adibate be at least 2%.

However, as the ratio of diisobutyl adibate added increases, the physical properties of the flux become liquid without losing its viscosity.

Therefore, the amount of diisobutyl adibate to be added can be determined as follows depending on the use.

Diisobutyl' Application base Azibate (1) 98-85% 2-15% For cored solder, coating, Graflux (2) 90-70% 10-30% For cream solder, paste (3) 98 ~60% 2-40% For liquid flux, (general use) 0) 70-10% 30-90% For liquid flux,
(For High Temperature Applications) When the content of diisobutyl adipate exceeds 90%, the physical properties (covering power, viscosity) as a flux for so-called soldering are extremely reduced, and the action of the base material is not substantially performed.

The base material used here may be a resin (such as Matsuyani), an activated resin, an organic acid, an organic salt, or a suitable combination thereof, and the composition of these base materials is known.

In particular, the activated resin uses cyclohexylamine hydrochloride as an activator.

The organic acids are -logenides of derivatives of amines and amines, such as stearic acid, palmitic acid, and lauric acid.

Further, as the organic salt, amine hydrochloride such as cyclohexylamine hydrochloride is used.

These flux bases can be used alone or in combination with diisobutyl adibate.

The combination of flux bases is selected depending on the specific use of the flux.

According to this invention, the flux has a stable concentration and can exhibit the performance required in various uses.

In particular, when used as a flux for flux-cored solder, so-called flux breakage does not occur.

In addition, soldering generally allows for uniformity of properties, improves stability during controlled storage, suppresses smoke generation, and eliminates toxicity.

Example I W W Rosin 96% Diisobutyl adibate 4% 100% This is a flux for flux cored solder, and is JIS-
Z-3197 soldering showed no abnormalities in the dryness test of the resin-based Franks test method, and no abnormalities were observed in the same copper plate corrosion test.

In particular, the insulation resistance value was 4.0-10×1012.

Example 2 Maleic acid modified resin 5% WW rosin 85% Diisobutyl adibate 10% ioo% No abnormality was found in the same dryness test as in Example 1, and no abnormality was found in the same copper plate corrosion test.

The insulation resistance value was 1.0 to 5.4 x 1012.

Example 3 Hydrogenated rosin 5% W W Rosin 88% Cyclohexylamine hydrochloride (as activator) 1% Diisobutyl adibate 6% 100% No abnormalities were found in the same dryness test and copper plate corrosion test as in Example 1. The insulation resistance value u was 1.0 to 3.0×10 11 .

Example 4 Polymerized rosin 10% WW Rosin 78% Cyclohexylamine hydrochloride (as activator) 4% Diisobutyl adibate 8% 100% No abnormality was observed in the same dryness test and copper plate corrosion test as in Example 1. There wasn't.

Moreover, the insulation resistance value was 5.0 to 10×10 10 .

In Examples 1 to 4, this flux was filled into a glass pipe as described below, and the number and size of bubbles formed therein were compared with those of a conventional example, and the possibility of so-called slitting was measured.

According to this, it has been found that the flux of the above-mentioned example used in the present invention has a very small proportion of bubbles in the glass pipe, and the possibility of so-called scorching is lower than that of the conventional flux of this type.

Changes in the occurrence of cavities in pine resin due to the addition of DIBA. This is a visual check of the number of

The amount of diisobutyl adibate added was expressed in weight % based on the weight of pine resin.

Example 5 WW Rosin 30% Isopropyl alcohol 66.9% Diisobutyl adipate 3% Antioxidant 0.1% 100% This formulation is an example of so-called preflux, and the addition of diisobutyl adipate improves the coating film. cracks,
There was no damage and the adhesion to the substrate was good, providing good protection for the substrate.

Example 6 W W Rosin 30% Cyclohexylamine Hydrochloride (as activator) 1% Isopropyl Alcohol 58.9% Diisobutyl Adibate
10% Surfactant 0.1% 100% This example uses flux for normal soldering.
Inbutyl adibate inhibits the transpiration of inpropyl alcohol.

Example 7 WW Rosin 20% Cyclohexylamine hydrochloride (as activator) 1% Diisobutyl adibate 79% 100% This is also a flux used for normal soldering, and is particularly effective in preventing concentration changes. There was almost no change in the specific gravity even after leaving it for 8 hours.

Example 8 Valmitic acid 10% Diisobutylazibate 90% 100% This is particularly suitable for soldering electronic equipment.

Example 9 Lauric acid (10% diisobutyladipei) 90% 100% As in Example 9, it is suitable for soldering electronic equipment.

Example 1O Cyclohexylamine hydrochloride 5% Isopropyl alcohol 85% Diisobutyl adibate 10% 100% Cyclohexylamine hydrochloride is difficult to dissolve, but becomes soluble when combined with isopropyl alcohol.

Concentration changes are particularly small, allowing for stable soldering.

Example 11 Stearic acid 10% Toluene 30% Isopropyl alcohol 50% Diimbutyl adibate 10% 100% This is an example suitable for normal soldering, and solvents such as doluol and isopropyl alcohol are diisobutyl adibate. This effectively suppresses volatilization.

Example 12 Stearic acid 10% Triethanolamine 10% Isopropyl alcohol 50% Toluene 20% Diisobutyl adibate IO% ioo% A flux suitable for ordinary soldering.

Claims (1)

[Scope of Claims] 1. A soldering flux composition comprising a flux base selected from the group consisting of resins, activated resins, organic acids, and organic salts, and diisobutyl adibate. 2. A flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and 2 to 90 percent (by weight) of diisobutyl adibate based on the total amount of flux. Flux-kumi kaimono mentioned in the section. 3. A flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and 2 to 15 percent (by weight) of diisobutyl adibate based on the total amount of flux. A flux composition for flux-cored solder, coating, and preflux as described in Section 1. 4. A flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and 10 to 30 percent (by weight) of diisobutyl adibate based on the total amount of flux. The flux composition for cream solder and paste according to item 1. 5. A flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and 2 to 40 percent (by weight) of diimbutyl adibate based on the total amount of flux. The flux composition for liquid flux (general use) according to item 1. 6. A flux base selected from the group consisting of resins, activated resins, organic acids, organic salts, and 30 to 90 percent (by weight) of diisobutyl adibate based on the total amount of flux. A flux composition for liquid flux (for high temperature use) as described in .