JPS5830121A - Polar chip electronic part - Google Patents

Polar chip electronic part

Info

Publication number
JPS5830121A
JPS5830121A JP56127563A JP12756381A JPS5830121A JP S5830121 A JPS5830121 A JP S5830121A JP 56127563 A JP56127563 A JP 56127563A JP 12756381 A JP12756381 A JP 12756381A JP S5830121 A JPS5830121 A JP S5830121A
Authority
JP
Japan
Prior art keywords
anode
tantalum
electrolytic capacitor
cathode
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56127563A
Other languages
Japanese (ja)
Inventor
白井 紘一
仲田 武彦
義彦 斎木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56127563A priority Critical patent/JPS5830121A/en
Publication of JPS5830121A publication Critical patent/JPS5830121A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は有極性テップ盤電子部品に関し%特にその外部
電極構造に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polar step board electronic component, and particularly to its external electrode structure.

有極性を有する電子部品には、電解コンデンサ。Electrolytic capacitors are electronic components with polarity.

ダイオード等がある。例えば電解コンデンサについて説
明すれば、電解コンデンサの誘電体皮膜はアルミ、タン
タル等の弁作用金属の陽極性に弁作用金属線管R19付
けた後、硫酸水溶液等の電解液中で該弁作用金属線を陽
極として陽極酸化手段によって形成される。
There are diodes, etc. For example, to explain an electrolytic capacitor, the dielectric film of an electrolytic capacitor is formed by attaching a valve metal wire tube R19 to the anode of a valve metal such as aluminum or tantalum, and then placing the valve metal wire in an electrolytic solution such as an aqueous sulfuric acid solution. is formed by anodizing means as an anode.

この様に形成された誘電体皮膜は整流作用を有するため
、電解コンデンナとしての役割會果喪す場合には弁作用
金属線を陽極とし、また二酸化マンガン、グラファイト
、銀ペースト等で形成された対向電極を陰極として使用
しなければならない。
The dielectric film formed in this way has a rectifying effect, so if it loses its role as an electrolytic capacitor, the valve metal wire can be used as an anode, and a counter electrode made of manganese dioxide, graphite, silver paste, etc. The electrode must be used as a cathode.

そのため極性を逆にして回路に接続された場合社、電解
コンデンサ自体が壊滅的に損害を受けるばかりでなく、
関連する電子部品に対しても熱による損害を与える可能
性がある。
Therefore, if the electrolytic capacitor itself is connected to a circuit with reversed polarity, it will not only be catastrophically damaged, but also
Thermal damage may also occur to associated electronic components.

この逆接続実装を解決するために従来は、例えば第1図
四、@に示す如く、陽極部30と陰極部40の形状を変
えた9%ま九陽極部に非磁性体材料31、陰極部に磁性
体材料41t−使用して極性の判別を行っていた。
In order to solve this reverse connection mounting, conventionally, as shown in FIG. The polarity was determined using magnetic material 41t.

しかしながら自動実装装置による高速度実装を行うため
には、あらかじめチップ型電解コンデンサの極性を揃え
てマガジンやカートリッジテープ等圧詰めなければなら
ず、従来手段ではこの配列に多大な工数を必要とし、ま
た新たな配列装置を開発しなければならなかった。さら
に極性を揃える配列装置11t−使用しても、絶対に逆
接続実装がなくなるという保証がないため、実装後の極
性が適性であるかどうか確認する必要があった。また、
ダイオードにおいても近年の高密度実装化に伴いチップ
型ダイオードの要求が高まっているが高速度実装化のた
めには本質的にチップ屋電解コンデンサと同様の問題点
を有しており、高速度実装化への大きな障害となってい
る。
However, in order to perform high-speed mounting using automatic mounting equipment, it is necessary to align the polarity of the chip-type electrolytic capacitors in advance and pack them with equal pressure on magazines or cartridge tapes. Conventional means require a large amount of man-hours for this arrangement, and A new array device had to be developed. Furthermore, even if the arraying device 11t for aligning the polarities is used, there is no guarantee that there will be no reverse connection mounting, so it is necessary to confirm whether the polarity after mounting is appropriate. Also,
With regard to diodes, the demand for chip-type diodes has increased with the recent trend toward high-density mounting, but they essentially have the same problems as chip shop electrolytic capacitors, and high-speed mounting is essential for high-speed mounting. This has become a major obstacle to the development of society.

本発明の目的はかかる従来の有極性チップ型電子部品の
欠点を解決した有極性チップ型電子部品を提供すること
にある。
An object of the present invention is to provide a polarized chip-type electronic component that solves the drawbacks of the conventional polarized chip-type electronic component.

本発明によれば有極性テップ型電子部品の両端面、i九
は両端面とこの両端面に隣接する局面の一部に一対の外
部電極を有し、かつ一対の外部電極の8寝に一つ以上の
外部電極を設けたことを特徴とする有極性テップ型電子
部品が得られる。
According to the present invention, both end faces of a polarized step-type electronic component, i9, have a pair of external electrodes on both end faces and a part of the curved surface adjacent to the both end faces, and one on every eight of the pair of external electrodes. A polarized tip-type electronic component characterized in that it is provided with three or more external electrodes is obtained.

以下本発明の一実施例をタンタル固体電解コンデンサに
ついて第2図〜第5図を参照して説明する0 〔実施例1〕 第2図は本発明の一実施例であり、それぞれ四は外観図
(IIは縦断面図を示す。タンタル粉末にタンタルリー
ドMlを植立し所望形状に成型してなる陽極体2を陽極
酸化の手段により五酸化タンタルt−陽極体lの周間に
形成し九〇しかる後硝酸マンガン溶液中にこの陽極体2
を浸漬した後、温度250℃の熱雰囲気中で硝酸マンガ
ンの熱分解を行い二酸化マンガンを形成した0この工程
を複数回繰p返し二酸化マンガン層を形成した。さらに
グラファイト層および銀ペースト層を従来の周知技術を
用いて順次形成しコンデンサ素子(以下素子と略す)2
を形成した。しかる後第2図(5)、(ロ)に示す如く
タンタルリード線1の一部及び相対する2つの陰極部2
暑が露出する様に素子20局面を熱硬化性エポキシ樹脂
で覆−絶縁部5t−形成した。
An embodiment of the present invention will be described below with reference to FIGS. 2 to 5 regarding a tantalum solid electrolytic capacitor. [Example 1] FIG. 2 shows an embodiment of the present invention, and 4 is an external view. (II shows a vertical cross-sectional view. An anode body 2 made by planting tantalum lead Ml on tantalum powder and molding it into a desired shape is formed around the tantalum pentoxide t-anode body L by means of anodization. 〇After that, add this anode body 2 to the manganese nitrate solution.
After immersing the substrate, manganese nitrate was thermally decomposed in a hot atmosphere at a temperature of 250° C. to form manganese dioxide. This process was repeated multiple times to form a manganese dioxide layer. Further, a graphite layer and a silver paste layer are sequentially formed using conventional well-known techniques to form a capacitor element (hereinafter abbreviated as element) 2.
was formed. Thereafter, as shown in FIGS. 2(5) and (b), a part of the tantalum lead wire 1 and two opposing cathode parts 2 are
The surface of the element 20 was covered with a thermosetting epoxy resin to form an insulating portion 5t so as to expose it to heat.

しかる後露出したタンタルリードlIi!1の表面を機
械的にこす夕、タンタルリード線lの局面に形成され九
五酸化タンタルを取〕除いた。
After that, the tantalum lead was exposed! By mechanically rubbing the surface of 1, the tantalum 95 oxide formed on the surface of the tantalum lead wire 1 was removed.

次に絶縁部5から突出しているタンタルリード線1と1
部が接続し、絶縁部50局面をリング状に囲む帯状の陽
極部4と陰極部28.2b′ft次のように形成する0
両瑠面の露出している陰極部2a。
Next, tantalum lead wires 1 and 1 protruding from the insulation part 5
The band-shaped anode part 4 and the cathode part 28.2b'ft which surround the insulating part 50 in a ring shape are formed as follows.
Cathode part 2a with exposed Ryoru surface.

2bと陽極部3の形成個所を除いた絶縁部5上の一部に
マスキングテープを貼りつけた後、銅の無電解メッキ法
によりキャップ状の陰極部4.4′および帯状幅の陽極
s3をリング状に形成し、三電極を有する四角柱状チッ
プ型メンタル固体電解コンデン?を作製した。
After pasting masking tape on a part of the insulating part 5 except for the area where the anode part 2b and the anode part 3 are formed, a cap-shaped cathode part 4.4' and a band-shaped anode part s3 are formed by electroless copper plating. Square column chip type mental solid electrolytic capacitor formed in a ring shape and having three electrodes? was created.

〔実施例2〕 第3図四、@はタンタル金属粉末を成型した後[*する
2本のタンタルリード@ l a 、 1 bを素子2
11R9付け、前述実施例1の製造方法と同様にキャッ
プ状の陰極1ft14 、4’および帯状幅の陽極部3
a、3b  をリング状に形成した四電極を有する四角
柱状チップ型固体タンタル電解コンデンナである。
[Example 2] Fig. 3 4, @ shows two tantalum leads @ la, 1 b after molding the tantalum metal powder.
11R9, a cap-shaped cathode 1ft14, 4' and a band-like width anode part 3 in the same way as in the manufacturing method of Example 1 described above.
This is a square columnar chip type solid tantalum electrolytic capacitor having four electrodes in which a and 3b are formed into a ring shape.

〔実施例3〕 第4図四、@はタンタル金属粉末を成型した後成形体の
相対する面にそれぞれタンタルリード巌01部を突出さ
せて取シ付け、前述実施例の製造方法と同様にキャップ
状OS極部13.13’および帯状幅の陰極部14t−
17ング状に形成した三電極含有する四角柱状チップ型
固体タンタル電解コンデンサである。
[Example 3] Figure 4 4, @ shows that after molding tantalum metal powder, the tantalum lead parts 01 are projected and attached to the opposing surfaces of the molded body, respectively, and a cap is formed in the same manner as in the manufacturing method of the previous example. shaped OS pole part 13.13' and strip-shaped cathode part 14t-
This is a square columnar chip type solid tantalum electrolytic capacitor containing three electrodes formed in a ring shape.

〔実施例4〕 第5図(5)、(ロ)は実施例3の構造に帯状幅のリン
グ状陰極部を一つ新しく併設した四電極を有する四角柱
状チップ型固体タンタル電解コンデンサである。
[Embodiment 4] FIGS. 5(5) and 5(b) show a quadrangular columnar chip type solid tantalum electrolytic capacitor having four electrodes in which a ring-shaped cathode portion with a band-like width is newly added to the structure of Embodiment 3.

本実施例の銅の無電解メッキ法で形成した帯状の電極は
、銅表面の酸化防止のため形成後半田で覆うといっそう
好ましく、まえ両端面だけでなく両端面に隣接する局面
の絶縁部の一部にも電極を形成するとプリント基板への
中日付けが一層強固となる。なお本実施例で鉱銅の無電
解メッキ法で外部電極を形成したが何等銅だけに制限さ
れることはなく例えばスズ、ニッケル等中日かけできる
金属の無電解メッキ法で形成してもよい。また無電解メ
ッキ法だけでなく金属のイオンプレーティング法、スパ
ッタリング法、真空蒸着法及び導電性接着剤、金属のキ
ャップ状端子等を用いて形成してもよい。
It is more preferable to cover the band-shaped electrode formed by the copper electroless plating method in this example with solder after formation to prevent oxidation of the copper surface. Forming electrodes on some parts will further strengthen the bonding to the printed circuit board. Although the external electrodes were formed by electroless plating of copper ore in this example, they are not limited to copper in any way; for example, they may be formed by electroless plating of metals such as tin, nickel, etc. that can be coated on a day-to-day basis. . Further, in addition to the electroless plating method, it may be formed using a metal ion plating method, a sputtering method, a vacuum evaporation method, a conductive adhesive, a metal cap-shaped terminal, or the like.

さらにチップ型電解コンデンサの形状としては四角柱だ
けでなく三角柱、五角柱等の多角柱及び円柱、隋円柱、
板状型等でもよいことは勿論である。
Furthermore, the shapes of chip-type electrolytic capacitors include not only square prisms but also polygonal prisms such as triangular prisms and pentagonal prisms, cylinders, Sui cylinders, etc.
It goes without saying that a plate-like type or the like may also be used.

以上、本発明法によれば素子の両端面に一対の電極と、
その内11に一つ以上の対向電極を有するので極性判別
時のミスがない。従って配列方法になんら工夫を必要と
せず抵抗、セラミックコンデンサ等の無極性電子部品と
同じ配列装*”を使用できるという利点がある。さらに
電極部が両端面だけでなくその内側に対向電極を有する
ので電極部のインダクタンスが減少し、従って高周波で
のインピーダンス特性が改善される。
As described above, according to the method of the present invention, a pair of electrodes are provided on both end surfaces of the element,
Since 11 of them has one or more opposing electrodes, there is no error in polarity discrimination. Therefore, there is an advantage that the same arrangement *'' as used for non-polar electronic components such as resistors and ceramic capacitors can be used without requiring any ingenuity in the arrangement method.Furthermore, the electrode section has opposing electrodes not only on both end surfaces but also on the inside thereof. Therefore, the inductance of the electrode portion is reduced, and the impedance characteristics at high frequencies are improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図囚は従来例による陰極部と陽極部の形状が異なる
チップ型電解コンデンサめ斜視図。 第1図(IIは従来例による陰極部が磁性体材料。 陽極部が非磁性体材料からなるチップ型電解コンデンサ
の斜視図。 第2図四、@は両端面に一対の陰極部を有し。 その内側に一つの陽極部を有するチップ型電解コンデン
サの斜視図および縦断面図。 第3図(5)、@は両端面に一対の陰極部を有し。 その内側に一対の陽極部を有するチップ型電解コンデン
サの斜視図および縦断面図。 第4図囚、(llFi両端面に一対の陽極部を有し、そ
の内側に一つの陰極部を有するチップ型電解コンデンサ
の斜視図、および縦断面図。 第5区間、(ロ)は両端面に一対の陽極部を有し。 その内側に一対の陰極部含有するチップ型電解コンデン
サの斜視図および縦断面図0 1@1!@lb@1lalllb−・−夕7/にリード
線。 2−−−−−・コンデン?素子%3.3JII3b@1
3f13’・−・−・陽極部%4.4’ 、1114J
l@14b・・・−・陰極部、5・・・−絶縁部。 代理人 弁理士  内 原   晋″)゛、ノ専ゐ、。 (ンつJ                    r
B)第3 父 6tツメ−/lfノ (f)/−ノt−ノ(f)
FIG. 1 is a perspective view of a conventional chip type electrolytic capacitor in which the cathode part and the anode part have different shapes. Fig. 1 (II is a perspective view of a chip-type electrolytic capacitor in which the cathode part is made of a magnetic material according to a conventional example. The anode part is made of a non-magnetic material. Fig. 2 4, @ has a pair of cathode parts on both end faces A perspective view and a vertical cross-sectional view of a chip type electrolytic capacitor that has one anode part on its inside. Figure 3 (5), @ has a pair of cathode parts on both end faces. A pair of anode parts on its inside. A perspective view and a longitudinal cross-sectional view of a chip-type electrolytic capacitor having a pair of anode portions on both end faces and a cathode portion inside the anode portion. Top view. The fifth section (b) has a pair of anode parts on both end faces. A perspective view and a vertical cross-sectional view of a chip type electrolytic capacitor containing a pair of cathode parts inside 0 1@1!@lb@ 1lalllb-・-Lead wire to 7/. 2-----・Condenser?Element%3.3JII3b@1
3f13'・-・-・Anode part%4.4', 1114J
l@14b...-Cathode part, 5...-Insulating part. Agent: Susumu Uchihara, patent attorney
B) 3rd Father 6t Tsume-/lfノ(f)/-nott-ノ(f)

Claims (1)

【特許請求の範囲】[Claims] 有極性チップ屋電子部品の両端面、または両端面と該両
端面に隣接する周面の一部に一対の外部電極を有し、か
つ該一対の外部電極の内側に一つ以上の外部電極を設け
たことt?特徴とする有極性ナツプ減電子部品。
A polar chip electronic component has a pair of external electrodes on both end surfaces, or both end surfaces and a part of the peripheral surface adjacent to the both end surfaces, and one or more external electrodes are placed inside the pair of external electrodes. Did you set it up? Features a polarized nap-reducing electronic component.
JP56127563A 1981-08-14 1981-08-14 Polar chip electronic part Pending JPS5830121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56127563A JPS5830121A (en) 1981-08-14 1981-08-14 Polar chip electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56127563A JPS5830121A (en) 1981-08-14 1981-08-14 Polar chip electronic part

Publications (1)

Publication Number Publication Date
JPS5830121A true JPS5830121A (en) 1983-02-22

Family

ID=14963120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56127563A Pending JPS5830121A (en) 1981-08-14 1981-08-14 Polar chip electronic part

Country Status (1)

Country Link
JP (1) JPS5830121A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335301A (en) * 1986-07-30 1988-02-16 橋本鉄工株式会社 Short-sized sheet material stripping device
JPH02125603A (en) * 1988-11-04 1990-05-14 Nec Corp Four-terminal chip type solid state electrolytic capacitor
JPH0448618U (en) * 1990-08-28 1992-04-24
JPH04367212A (en) * 1991-06-14 1992-12-18 Nec Corp Chip-shaped solid electrolytic capacitor
JPH05217787A (en) * 1992-01-31 1993-08-27 Nec Corp Capacitor
JPH06267779A (en) * 1993-03-11 1994-09-22 Nec Corp Surface mount capacitor
WO2005015588A1 (en) * 2003-08-12 2005-02-17 Rohm Co., Ltd. Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure
JP2008153702A (en) * 2008-03-10 2008-07-03 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2008182260A (en) * 2008-03-10 2008-08-07 Sanyo Electric Co Ltd Solid electrolytic capacitor mounting assembly
US7646589B2 (en) 2004-02-05 2010-01-12 Rohm Co., Ltd. Solid electrolytic capacitor with first and second anode wires
JP2010034596A (en) * 2009-11-12 2010-02-12 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2015216345A (en) * 2014-05-07 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド. Tantalum capacitor

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335301A (en) * 1986-07-30 1988-02-16 橋本鉄工株式会社 Short-sized sheet material stripping device
JPH02125603A (en) * 1988-11-04 1990-05-14 Nec Corp Four-terminal chip type solid state electrolytic capacitor
JPH0448618U (en) * 1990-08-28 1992-04-24
JPH04367212A (en) * 1991-06-14 1992-12-18 Nec Corp Chip-shaped solid electrolytic capacitor
JPH05217787A (en) * 1992-01-31 1993-08-27 Nec Corp Capacitor
JPH06267779A (en) * 1993-03-11 1994-09-22 Nec Corp Surface mount capacitor
US7385804B2 (en) 2003-08-12 2008-06-10 Rohm Co., Ltd. Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure
JPWO2005015588A1 (en) * 2003-08-12 2007-10-04 ローム株式会社 Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure
WO2005015588A1 (en) * 2003-08-12 2005-02-17 Rohm Co., Ltd. Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure
JP4640988B2 (en) * 2003-08-12 2011-03-02 ローム株式会社 Solid electrolytic capacitor
US7929275B2 (en) 2003-08-12 2011-04-19 Rohm Co., Ltd. Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure
US7646589B2 (en) 2004-02-05 2010-01-12 Rohm Co., Ltd. Solid electrolytic capacitor with first and second anode wires
JP2008153702A (en) * 2008-03-10 2008-07-03 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2008182260A (en) * 2008-03-10 2008-08-07 Sanyo Electric Co Ltd Solid electrolytic capacitor mounting assembly
JP2010034596A (en) * 2009-11-12 2010-02-12 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2015216345A (en) * 2014-05-07 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド. Tantalum capacitor

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