JPS5826551Y2 - Lead wire holding device - Google Patents
Lead wire holding deviceInfo
- Publication number
- JPS5826551Y2 JPS5826551Y2 JP1979159997U JP15999779U JPS5826551Y2 JP S5826551 Y2 JPS5826551 Y2 JP S5826551Y2 JP 1979159997 U JP1979159997 U JP 1979159997U JP 15999779 U JP15999779 U JP 15999779U JP S5826551 Y2 JPS5826551 Y2 JP S5826551Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- circuit board
- printed circuit
- notch
- holding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案はリードワイア保持装置に係り、プリント基板に
開口端側より少なくとも小、中、大と順につらなってそ
の幅が３段状の切欠部を形成し、この切欠部内にリード
ワイアを配し、さらに前記プリント基板から切り取った
切欠部に対応する部分からなる仕切部材を前記切欠部に
挿通掛止することにより、リードワイアの配線接続及保
持作業が容易で、かつリードワイアの折り曲げ回数が少
なくてリードワイアが破損しに＜＜、又、仕切部材はプ
リント基板を切欠したそのものであるので、それだけ低
コストで構成できるものとなり、さらにはリードワイア
を取り付けたプリント基板を製品内に配置するのに場所
的制約の少ないリードワイア保持装置を提供することを
目的とする。[Detailed description of the invention] The present invention relates to a lead wire holding device, in which a notch is formed in a printed circuit board in order of small, medium, and large from the open end side, and has a three-step width. By arranging lead wires on the board and further inserting and latching a partition member consisting of a portion corresponding to a notch cut out from the printed circuit board into the notch, wiring connection and holding work of the lead wire is easy, and bending of the lead wire is facilitated. If the number of times is small, the lead wire will be damaged.Also, since the partition member is a cutout of the printed circuit board, it can be constructed at a lower cost, and furthermore, the printed circuit board with the lead wire attached can be placed inside the product. An object of the present invention is to provide a lead wire holding device with fewer space restrictions.
従来、プリント基板にリードワイアを保持するには第１
図に示す如く、プリント基板１の所定位置に孔２を設け
、この孔２に表面を絶縁コーティングした細線３を通し
、この細線３でプリント基板１に取り付けるリードワイ
ア４を束ねていた。Conventionally, in order to hold lead wires on a printed circuit board, the first
As shown in the figure, a hole 2 was provided at a predetermined position on a printed circuit board 1, a thin wire 3 whose surface was coated with insulation was passed through the hole 2, and lead wires 4 attached to the printed circuit board 1 were bundled with the thin wire 3.
しかし、このようにしてリードワイアを保持するには、
リードワイアを保持する度に細線をねじらなければなら
ず、その作業は面倒であり、又全てのリードワイアを一
度に束ねるのでは、リードワイアの配線接続作業が複雑
になる。But to hold the lead wire in this way,
Each time the lead wire is held, the thin wire must be twisted, which is a troublesome task, and if all the lead wires are bundled at once, the wire connection work of the lead wires becomes complicated.
又、リードワイアをプリント基板に保持するのに少なく
とも２回リードワイアを折り曲げなければならず、それ
だけリードワイアが破損しやすい。Furthermore, the lead wire must be bent at least twice to hold it on the printed circuit board, making the lead wire more likely to be damaged.
さらに、リードワイアをプリント基板の外側に保持する
ことになるので、プリント基板を筐の隅に配する場合、
あるいはプリント基板の横に他の部品等がある場合等で
は束ねられたリードワイアが邪魔になり、それだけプリ
ント基板の配置場所が制約を受ける。Furthermore, since the lead wires will be held on the outside of the printed circuit board, if the printed circuit board is placed in the corner of the case,
Alternatively, if there are other components next to the printed circuit board, the bundled lead wires will get in the way, and the placement of the printed circuit board will be restricted accordingly.
又、リードワイアがプリント基板の外側にあるので、リ
ードワイアを破損する危険性が高い。Furthermore, since the lead wires are located outside the printed circuit board, there is a high risk of damaging the lead wires.
本考案は上記欠点を除去したものであり、以下本考案に
係るリードワイア保持装置の実施例について説明する。The present invention eliminates the above-mentioned drawbacks, and embodiments of the lead wire holding device according to the present invention will be described below.
第２図は、本考案になるリードワイア保持装置を説明す
る為の予備説明図である。FIG. 2 is a preliminary explanatory diagram for explaining the lead wire holding device according to the present invention.
同図中、１０はプリント基板であり、１１はプリント基
板に配線接続されるリードワイア、１２はプリント基板
の端部に形成された開口部の幅が狭い略凸形状の切欠部
である。In the figure, 10 is a printed circuit board, 11 is a lead wire connected to the printed circuit board, and 12 is a substantially convex notch with a narrow opening formed at the end of the printed circuit board.
この開口部の幅ａ、内部の幅すの切欠部１２に対して、
中央部の幅Ｃ９端部の幅ｅ、中央部と端部の間の幅ｄが
それぞれａ≧ｃ、ｌ）≧ａ＞ａ。With respect to the width a of this opening and the notch 12 of the internal width,
The width C9 of the center, the width e of the ends, and the width d between the center and the ends are a≧c, l)≧a>a, respectively.
ｅ＞ｂとなるように形成した略段状の仕切部材１３を、
リードワイア１１を配した切欠部１２に矢印方向に挿入
して掛止する。A substantially stepped partition member 13 formed so that e>b,
It is inserted into the notch 12 in which the lead wire 11 is arranged in the direction of the arrow and is hooked.
このようにしてリードワイアをプリント基板に保持する
と、リードワイアは第１図に示す従来の場合よりも折り
曲げ回数が少なく、それだけり−ドワイアが破損しにく
い。When the lead wire is held on the printed circuit board in this manner, the lead wire is bent fewer times than in the conventional case shown in FIG. 1, which makes the lead wire less likely to be damaged.
又、プリント基板にり−ドワイアを配線接続する度にリ
ードワイアを切欠部１２内に入れておけば、仕切部材１
３を用いなくてもリードワイアをプリント基板に仮留め
でき、ノードワイアの配線接続作業が簡単になり、しが
も最後に仕切部材１３を用いるのみでよいから、リード
ワイアの保持作業も容易である。Moreover, if the lead wire is inserted into the notch 12 each time the lead wire is connected to the printed circuit board, the partition member 1
3, the lead wires can be temporarily fixed to the printed circuit board, the wiring connection work of the node wires is simplified, and since only the partition member 13 needs to be used at the end, the work of holding the lead wires is also easy.
さらに、リードワイアはプリント基板の内側に保持され
ているので、プリント基板の配置に際してリードワイア
が邪魔にならず、それだけプリント基板の配置の場所的
制約が少なく、かつリードワイアが破損する危険性も少
ない。Furthermore, since the lead wires are held inside the printed circuit board, the lead wires do not get in the way when the printed circuit board is placed, and there are fewer restrictions on the location of the printed circuit board, and there is also less risk of damage to the lead wires.
又、仕切部材を切欠部に配する際にリードワイアを傷つ
けることもない。Furthermore, the lead wires are not damaged when the partition member is placed in the notch.
しかし、このような構成のリードワイア保持装置では、
切欠部１２の形状が凸形状のものであるので、このプリ
ント基板の一部分である切欠部１２の部分のみをもって
仕切部材１３としようとしても、このような構成の仕切
部材はプリント基板の切欠部１２に掛止できず、仕切部
材の役割を果たせず、従って仕切部材としては切欠部の
部分とは別のもので構成せざるを得なく、それだけコス
ト高のものとなるのみでなく、プリント基板と仕切部材
それぞれを管理しなければならず、それだけ面倒なもの
でもあるといった欠点がある。However, with a lead wire holding device configured like this,
Since the notch 12 has a convex shape, even if only the part of the notch 12, which is a part of the printed circuit board, is used as the partition member 13, the partition member with such a configuration will not fit into the notch 12 of the printed circuit board. Therefore, the partition member must be made of a separate material from the notch part, which not only increases the cost, but also makes it difficult to connect the printed circuit board. There is a drawback that each partition member must be managed, which is a hassle.
第３図は、本考案になるリードワイア保持装置の実施例
の説明図である。FIG. 3 is an explanatory diagram of an embodiment of the lead wire holding device according to the present invention.
同図中、２０はプリント基板、２１はプリント基板に配
線接続されるリードワイア、２２はプリント基板の端部
に形成された開口部の幅が狭く奥部の幅が広い少なくと
も２階段状の、すなわち小、中、大と順につらなった３
段状の切欠部である。In the figure, 20 is a printed circuit board, 21 is a lead wire connected to the printed circuit board, and 22 is an opening formed at the end of the printed circuit board, which is narrow in width and wide at the back, in the shape of at least two steps, i.e. 3 connected in order of small, medium, and large
This is a stepped notch.
２３は、プリント基板２０がら切り取った切欠部に対応
する部分からなる仕切部材である。Reference numeral 23 denotes a partition member having a portion corresponding to a notch cut out from the printed circuit board 20.
そして、前記予備説明の場合と同様にしてリードワイア
をプリント基板に保持する。Then, the lead wire is held on the printed circuit board in the same manner as in the preliminary explanation above.
本実施例においては、仕切部材２３かプリント基板の切
欠部の部分よりなるので、それだけ低コストとなり、し
かもプリント基板にミシン目等を入れておき、必要な時
にこのミシン目より折り取って切欠部及仕切部材とする
ようにしておけば、これらの保管及整理が極めて容易で
ある。In this embodiment, since the partition member 23 is formed from the notch part of the printed circuit board, the cost is reduced accordingly.Moreover, the printed circuit board is perforated and can be broken off from the perforation when necessary. If they are made into partition members, it is extremely easy to store and organize them.
尚、仕切部材２３は切欠部２２そのままの形状でなくて
もよく、多少変形させていてもよい。Note that the partition member 23 does not have to have the same shape as the notch 22, and may be slightly deformed.
上述の如く、本考案に係るリードワイア保持装置は、プ
リント基板に開口端側より少なくとも小、中、大と順に
つらなってその幅が３段状の切欠部を形成し、この切欠
部内にリードワイアを配し、さらに前記プリント基板か
ら切り取った切欠部に対応する部分からなる仕切部材を
前記リードワイアが前記切欠部よりはみ出さないように
前記切欠部に挿通掛止することにより、リードワイアの
折り曲げ回数が少なくてリードワイアが破損しにくく、
かつリードワイアの配線接続及保持作業が容易で作業性
に優れ、さらにリードワイアはプリント基板の内側に保
持されるので、リードワイアが破損する危険性が少なく
、かつプリント基板の配置の場所的制約が少なくなり、
そして仕切部材にプリント基板の切欠部の部分を用いる
ようにしているのでそれだけ低コストででき、がっプリ
ント基板及仕切部材の保管整理が容易である等の特長を
有する。As described above, the lead wire holding device according to the present invention forms a notch in the printed circuit board that is connected in order of small, medium, and large from the open end side and has three steps in width, and the lead wire is inserted into the notch. Further, by inserting and hooking a partition member having a portion corresponding to a notch cut out from the printed circuit board into the notch so that the lead wire does not protrude beyond the notch, the number of times the lead wire is bent is reduced. The lead wire is less likely to be damaged.
In addition, the wiring connection and holding work of the lead wire is easy and has excellent workability.Furthermore, since the lead wire is held inside the printed circuit board, there is less risk of lead wire damage and there are fewer restrictions on the location of the printed circuit board. ,
Since the notch portion of the printed circuit board is used as the partition member, it can be made at a lower cost, and the printed circuit board and the partition member can be easily stored and organized.
第１図は従来のり−ドワイア保持の説明図、第２図は本
考案を説明するための予備説明図、第３図は本考案にな
るリードワイア保持装置の実施例の説明図である。
１０．２０・・・・・・プリント基板、１１．２１−・
・−リードワイア、１２．２２・・・・・・切欠部、１
３．２３・・・・・・仕切部材。FIG. 1 is an explanatory diagram of a conventional lead wire holding device, FIG. 2 is a preliminary explanatory diagram for explaining the present invention, and FIG. 3 is an explanatory diagram of an embodiment of a lead wire holding device according to the present invention. 10.20...Printed circuit board, 11.21-...
・-Lead wire, 12.22...Notch, 1
3.23...Partition member.
Claims (1)
につらなってその幅が３段状の切欠部を形成し、この切
欠部内にリードワイアを配し、さらに前記プリント基板
から切り取った切欠部に対応する部分からなる仕切部材
を前記リードワイアが前記切欠部よりはみ出さないよう
に前記切欠部に挿通掛止してなるリードワイア保持装置
。A notch is formed in the printed circuit board in order of at least small, medium, and large from the open end side, and the width is three steps, a lead wire is arranged in this notch, and a lead wire is arranged in the notch cut out from the printed circuit board. A lead wire holding device in which a partition member consisting of corresponding parts is inserted through and hooked into the notch so that the lead wire does not protrude from the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979159997U JPS5826551Y2 (en) | 1979-11-20 | 1979-11-20 | Lead wire holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979159997U JPS5826551Y2 (en) | 1979-11-20 | 1979-11-20 | Lead wire holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5678583U JPS5678583U (en) | 1981-06-25 |
| JPS5826551Y2 true JPS5826551Y2 (en) | 1983-06-08 |
Family
ID=29671178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979159997U Expired JPS5826551Y2 (en) | 1979-11-20 | 1979-11-20 | Lead wire holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826551Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58159787U (en) * | 1982-04-20 | 1983-10-25 | 株式会社富士通ゼネラル | Lead wire temporary fixing structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5233583Y2 (en) * | 1972-03-10 | 1977-07-30 | ||
| JPS5417083Y2 (en) * | 1974-05-24 | 1979-07-03 |
-
1979
- 1979-11-20 JP JP1979159997U patent/JPS5826551Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5678583U (en) | 1981-06-25 |
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