JPS5823472A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5823472A
JPS5823472A JP12266981A JP12266981A JPS5823472A JP S5823472 A JPS5823472 A JP S5823472A JP 12266981 A JP12266981 A JP 12266981A JP 12266981 A JP12266981 A JP 12266981A JP S5823472 A JPS5823472 A JP S5823472A
Authority
JP
Japan
Prior art keywords
type
input
region
layer
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12266981A
Other languages
Japanese (ja)
Inventor
Norio Iida
典男 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12266981A priority Critical patent/JPS5823472A/en
Publication of JPS5823472A publication Critical patent/JPS5823472A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection

Abstract

PURPOSE:To protect input even under the conditions of surge, discharge time thereof is long, and the opening of a power supply terminal by forming PNPN elements at the input side of a semiconductor circuit, input thereto must be protected. CONSTITUTION:An N<+> type buried layer 12 is formed to a P type substrate 11, and an N type epitaxial layer 13 is shaped onto the layer 12 through vapor growth. An N type island 13' is formed through selective P<+> type isolation and diffusion and the formation of an isolation diffusion layer 14. The base of a normal NPN transistor is diffused to the island 13' while at least two P type diffusion regions 151, 152 mutually separated are molded. An N<+> type diffusion region 16 is shaped by diffusing an N<+> type impurity into the emitter region 152 of a lateral PNP transistor. Contact holes are formed to an insulating film 17 on the regions 151, 16, and electrodes 181, 182 are taken out. Accordingly, the region 151 is connected to the signal input terminal of the semiconductor circuit, input thereto must be protected, and the region 16 is connected to ground.

Description

【発明の詳細な説明】 本発明は半導体集積回路、41に入力保護対策を行なう
半導体装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor integrated circuit and a semiconductor device that takes input protection measures.

第1図は入力保護対策を行な9た従来の差動増幅回路で
ある6図中〒19丁2は差動入力段トランジスタ、R1
は入力fン(端子)1とトランジスタテJのペース関に
設けられた電流制限抵抗、Dlは入力ビン1と接地間に
設けられたサージ保護用ダイオード、R*#R1はトラ
ンジスタテ1.テ2の;レクタと電源VCC間に続され
たトランジスタ、抵抗である。
Figure 1 shows a conventional differential amplifier circuit with input protection measures.
is a current limiting resistor provided between the input pin (terminal) 1 and the transistor TEJ, Dl is a surge protection diode provided between the input pin 1 and ground, and R*#R1 is the transistor TE1. Te2: This is a transistor and a resistor connected between the collector and the power supply VCC.

従来第1図に示すような差動増幅回路、その他の半導体
回路においては、入力fン1からのサージによるFツン
ジスタ破壊を防ぐため、ダイオ−1’DJ及び抵抗IL
1が挿入されている。
Conventionally, in a differential amplifier circuit as shown in FIG. 1 and other semiconductor circuits, a diode-1'DJ and a resistor IL are used to prevent damage to the F-tun transistor due to a surge from the input f-n1.
1 is inserted.

この電流制限抵抗I!1は、集積回路装置においてNw
エピタキシャル層の烏に、ペース拡散と同時に拡散して
作られ、bpsi抵抗であ〕、上記Nll工♂タキシャ
ル層の島には、通常電源VCCO電位が加えられてい為
、その勢価回路を描くとjI2図のようになる。即ち入
力−ン1に加わる負のサージは、ダイオードDIを通り
て接地に流れる。この場合入力ビン1の電位は、接地に
対してダイオードD1の順方向電圧v1分だけ低くなる
。また正のサージに対しては、抵抗R1を通り、このR
1の島にぬけ電源VCCを通りて接地に流す、この時の
入力ビン1の電位は、電源電圧VCCに、抵抗81と島
で形成されるダイオードD2の順方向電圧Vfを加えた
ものに等しくなる。このように従来のサージ保護回路は
、サージを電源vccと接地間の電位差でクリップする
ような構成になっている。
This current limiting resistance I! 1 is Nw in an integrated circuit device
It is made by diffusing into the epitaxial layer at the same time as the pace diffusion, and is a bpsi resistor], and since the normal power supply VCCO potential is applied to the islands of the above Nll engineering female taxial layer, the power supply circuit is drawn. It will be as shown in Figure jI2. That is, the negative surge applied to input 1 flows to ground through diode DI. In this case, the potential of input bin 1 is lower than ground by forward voltage v1 of diode D1. Also, for positive surge, it passes through resistor R1 and this R
The potential of input bin 1 at this time is equal to the power supply voltage VCC plus the forward voltage Vf of the diode D2 formed by the resistor 81 and the island. Become. In this way, the conventional surge protection circuit is configured to clip surges by the potential difference between the power supply VCC and the ground.

しかし、実WAt−ジでトランジスタが破壊されるのは
、ピーク電圧によるのではなく、接合の一部に電力集中
が比較的長時間起るためと考えられる。即ちPN &合
の一部にΔワーが集中し、極所的に高温領域が形成され
る。この高温領域においてシリーンのメルティング(M
@lting )が生じ、再結晶の過@fPN接合が破
壊されるか、高温領域で不純物の異常拡散が生じ、接合
が破壊されるのである。このようなことから、従来のピ
ーク電圧をクリy f しただけの回路では、放電時間
の比較的長いサージに対しては、保護回路としての役目
を果さない、tた集積回路に電源が接続されていない場
合(館記N型エピタキシャル層の島に電源VCCの電位
が加えられていない場合)、正のサージに対してはVC
C電圧が素子のブレークダウン電圧によって決定される
ため、比較的高い電圧が加わる場合がある。
However, it is thought that the reason why a transistor is destroyed in an actual WAt voltage is not due to the peak voltage but because power is concentrated in a part of the junction for a relatively long period of time. That is, Δwar is concentrated in a part of the PN & joint, and a high temperature region is formed locally. Silene melting (M
@lting) occurs and the recrystallized @fPN junction is destroyed, or abnormal diffusion of impurities occurs in the high temperature region and the junction is destroyed. For this reason, the conventional circuit that only clears the peak voltage does not function as a protection circuit against surges with relatively long discharge times, and the power supply is connected to the integrated circuit. (if the potential of the power supply VCC is not applied to the island of the N-type epitaxial layer), for a positive surge, the VC
Since the C voltage is determined by the breakdown voltage of the device, a relatively high voltage may be applied.

本発明は上記実情に鑑みてなされたもので、入力保護を
行なうべき半導体回路の入力側にPNPN素子を設ける
ととによシ、放電時間の長いサージ及び電源端子が開放
の状態でも、入力保護を可能とする半導体装置を提供し
ようとするものである。
The present invention has been made in view of the above-mentioned circumstances. By providing a PNPN element on the input side of a semiconductor circuit to which input protection is to be performed, it is possible to protect the input from surges with long discharge times and even when the power supply terminal is open. The purpose of this invention is to provide a semiconductor device that enables this.

以下図面を参照して本発明の一実施例を説明する。まず
第3図に示される如く、P型基板11にN”!Ill込
層12を形成し、その上に気相成長でN!!!工ぎタキ
シャル層ISを形成する0次に選択的KP+mの分離拡
散を行ない、分離拡散層14を形成することにより、y
rilの島11を形成する。この島JJ’には、通常の
NPN ) ?ンジスタのペース拡散と同時に、互に離
間した少なくとも2つのpm拡散領域Is1 、Isg
を設ける。このとき、離間した領域1!It、IB。
An embodiment of the present invention will be described below with reference to the drawings. First, as shown in FIG. 3, an N''!Ill-containing layer 12 is formed on a P-type substrate 11, and an N''!Ill-containing layer 12 is formed thereon by vapor phase growth. By performing the separation diffusion of y and forming the separation diffusion layer 14,
An island 11 of ril is formed. Is there a normal NPN on this island JJ'? Simultaneously with the pace diffusion of the sensor, at least two pm diffusion regions Is1, Isg separated from each other
will be established. At this time, the spaced area 1! It, IB.

は、2チラルPNP )ツンジスタとして充分な電流増
幅率hν冨を得られるだけの分離間隔にしておかなけれ
ばならない。このラテラルPNP )ツンジスタの工2
.タ領斌153中にN生型不純物を拡散してN+型拡散
領域16を設ける。その後領域15..16上の絶縁膜
11にコンタクト孔を設けて、電極18..1g、を取
シ出す、これによシ領域151は、入力保護を行なう半
導体回路の信号入力端に接続し、領域16は接地に接続
する。
The separation interval must be large enough to obtain a sufficient current amplification factor hv as a tunister (2-chiral PNP). This lateral PNP) Tunjista's work 2
.. An N + type diffusion region 16 is provided by diffusing an N type impurity into the target region 153 . Then area 15. .. A contact hole is provided in the insulating film 11 on the electrode 18 . .. 1g is taken out, so that region 151 is connected to the signal input end of the semiconductor circuit for input protection, and region 16 is connected to ground.

第3図の構成でなる入力保護素子SCR1を用いた半導
体回路側を第4図に示す、なおこの図の差動増幅回路は
、第1図のものと対応させた場合の例であるから、対応
個所には同一符号を付して説明を省略する。しかしてこ
の第4図の回路は、入力端子1から接地側を見ると、第
3図のPNPN素子8CR1が間に入りていることにな
る。とのPNPN素子の特性は、第5図に示されるよう
に負性抵抗領域をもっている。入力側に正、接地側に負
の電圧を加えた場合、上記PNPN素子はブレークオー
Δ電圧を越えたところでターンオンし、順方向のインー
ーダンスが非常゛に小さくなる。この時のインピーダン
スは、通常のPNN金倉順方向インピーダンスに略等し
馳。またターンオン電圧に至るまでは、入力側と接地間
のインーーダンスはPN接合の逆方向インピーダンスに
等しい、このためブレークオーバ電圧以下では、入力ビ
ン1と接地間は完全に回路的に分離されている。
The semiconductor circuit side using the input protection element SCR1 having the configuration shown in FIG. 3 is shown in FIG. 4. Note that the differential amplifier circuit in this figure is an example in which it corresponds to the one in FIG. 1. Corresponding parts are denoted by the same reference numerals and their explanation will be omitted. However, in the circuit of FIG. 4, when looking from the input terminal 1 to the ground side, the PNPN element 8CR1 of FIG. 3 is interposed therebetween. The characteristics of the PNPN element have a negative resistance region as shown in FIG. When a positive voltage is applied to the input side and a negative voltage is applied to the ground side, the PNPN element turns on when the break-over Δ voltage is exceeded, and the forward impedance becomes extremely small. The impedance at this time is approximately equal to the normal PNN Kanakura forward impedance. Further, until the turn-on voltage is reached, the impedance between the input side and the ground is equal to the reverse impedance of the PN junction, so below the breakover voltage, the input bin 1 and the ground are completely separated in terms of the circuit.

第4図の回路において入力ビン1に大きな正のサージが
加わりた場合% PNPN素子SCR1はオンし、サー
ジ電流を接地に流してしまう。サージがなくなると、ハ
明凍子8CRfはオフして通常の使用状態にもどる。こ
のように正のサージ電圧が加わりた場合のみ、PNPN
素子SCR1はインピーダンスが低くなシ、該PNPN
素子での発熱を小さくおさえ、入力素子を保護する役目
を果す0通常のNPN )ランジスタにおいて、最もサ
ージに弱いペース、エン、夕接合にサージが加わった場
合でも、ペース6エオ、り接合が破壊される最小Of−
り電力は、PNPN素子のブレークオーバ電圧とブレー
クオーバ電流の積よりはるかに大きいものである。この
ため瞬時に加わる高電位に対しても充分に保護素子とし
て動作し、良好なサージ保護回路となる。tたPNPN
素子SCR1は正のサージでターンオンするため、島状
抵抗R1を形成するNfiエピタキシャル層に電源VC
Cが加えられていない場合においても、問題を生じるこ
とがなくなる。
In the circuit shown in FIG. 4, when a large positive surge is applied to the input bin 1, the PNPN element SCR1 turns on, causing the surge current to flow to ground. When the surge disappears, HaMeikyoko 8CRf turns off and returns to normal usage. Only when a positive surge voltage is applied like this, the PNPN
The element SCR1 has a low impedance, and the PNPN
In a normal NPN transistor, which plays the role of suppressing heat generation in the element and protecting the input element, even if a surge is applied to the PACE, E, or Y junction, which is the most susceptible to surges, the PACE, E, or R junction will be destroyed. Minimum of -
The resulting power is much greater than the product of the breakover voltage and breakover current of the PNPN device. For this reason, it sufficiently operates as a protection element even against instantaneously applied high potential, resulting in a good surge protection circuit. ttaPNPN
Since the element SCR1 is turned on by a positive surge, the power supply VC is connected to the Nfi epitaxial layer forming the island resistor R1.
Even if C is not added, no problem will occur.

なお本発明は前記実施例に限られることなく、種々の応
用が可能である0例えば第3図において、各半導体層の
、導電製を逆にした構造にも本発明を通用できる。また
実施例では、入力保護素子を設ける半導体回路の入力側
は、入力トランジスタのペース電極 または電流制限抵
抗を通して入カド2ンジスタのペース電極に接続したが
、入力トランジスタのコレクタまたはニオ、りが入力と
なる場合にも、同様にして適用できる。
Note that the present invention is not limited to the above-mentioned embodiments, and can be applied in various ways. For example, in FIG. 3, the present invention can be applied to a structure in which the conductivity of each semiconductor layer is reversed. In addition, in the embodiment, the input side of the semiconductor circuit provided with the input protection element is connected to the pace electrode of the input transistor or the pace electrode of the input transistor through the current limiting resistor, but the collector of the input transistor or the input side is connected to the pace electrode of the input transistor through the current limiting resistor. It can be applied in the same way even if

以上説明した如く本発明によれば、半導体回路の入力側
K PNPN素子を設けたので、放電時間の長いサージ
でありてもまた集積回路の電源が開放状態であっても、
半導体回路の入力保護を可能とする半導体装置が提供で
きるものである。
As explained above, according to the present invention, since the K PNPN element is provided on the input side of the semiconductor circuit, even if there is a surge with a long discharge time or the power supply of the integrated circuit is in an open state,
A semiconductor device that enables input protection of a semiconductor circuit can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は入力保護を施こした従来の差動増幅回
路図、第3図は本発明の一実施例を示す構成図、第4図
は同構成を用いた差動増幅回路図、第5図は同構成のI
−V特性図である。 1・・・入力♂ン(端子)、11・・・pm基板、12
・・・N”mm込層、13・・・Nllエピタキシャル
層、11・・・島、14・・・P+型分離層、151 
。 151−・・P型層、1#・・−N+票層、11・・・
絶縁膜、111%、11g−・電極、5CRJ・−PN
PN素子。
Figures 1 and 2 are diagrams of conventional differential amplifier circuits with input protection, Figure 3 is a configuration diagram showing an embodiment of the present invention, and Figure 4 is a differential amplifier circuit using the same configuration. Figure 5 shows I of the same configuration.
-V characteristic diagram. 1... Input ♂ (terminal), 11... pm board, 12
...N'' mm layer, 13...Nll epitaxial layer, 11...Island, 14...P+ type separation layer, 151
. 151-...P type layer, 1#...-N+ vote layer, 11...
Insulating film, 111%, 11g-・electrode, 5CRJ・-PN
PN element.

Claims (1)

【特許請求の範囲】[Claims] 第1導電減の半導体基体と、この基体上に形成された第
2導電減のエピタキシャル層と、この層と前記基体との
間に形成された第2導電屋の埋込層と、この層上の前記
エピタキシャル層の一部を分離して島とする第1導電盤
の分離層と、前記高上に互に離間して形成された第1導
電製の第1.第2の領域と、この第2の領域上に形成さ
れた第2導電Wiの第3の領域とを具備し、前記[1の
領域を、入力保賎を行なう半導体回路の信号入力側に接
続し、前記第3の領域を接地側に接続したことを特徴と
する半導体装置。
a first conductive semiconductor substrate; a second conductive epitaxial layer formed on the substrate; a second conductive buried layer formed between the layer and the substrate; a separation layer of a first conductive plate formed by separating a part of the epitaxial layer to form an island; and a first conductive plate formed on the height at a distance from each other. a second region and a third region of the second conductive Wi formed on the second region, and the region [1] is connected to the signal input side of the semiconductor circuit that performs input protection. A semiconductor device, wherein the third region is connected to a ground side.
JP12266981A 1981-08-05 1981-08-05 Semiconductor device Pending JPS5823472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12266981A JPS5823472A (en) 1981-08-05 1981-08-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12266981A JPS5823472A (en) 1981-08-05 1981-08-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5823472A true JPS5823472A (en) 1983-02-12

Family

ID=14841699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12266981A Pending JPS5823472A (en) 1981-08-05 1981-08-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5823472A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324641A (en) * 1991-04-24 1992-11-13 Sanyo Electric Co Ltd Semiconductor integrated circuit
US5442219A (en) * 1992-05-18 1995-08-15 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor device for controlling electric power

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324641A (en) * 1991-04-24 1992-11-13 Sanyo Electric Co Ltd Semiconductor integrated circuit
US5442219A (en) * 1992-05-18 1995-08-15 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor device for controlling electric power

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