JPS5823446A - Resin sealing method for a semiconductor - Google Patents

Resin sealing method for a semiconductor

Info

Publication number
JPS5823446A
JPS5823446A JP12340081A JP12340081A JPS5823446A JP S5823446 A JPS5823446 A JP S5823446A JP 12340081 A JP12340081 A JP 12340081A JP 12340081 A JP12340081 A JP 12340081A JP S5823446 A JPS5823446 A JP S5823446A
Authority
JP
Japan
Prior art keywords
resin
extrusion pressure
runner
pressure
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12340081A
Other languages
Japanese (ja)
Other versions
JPS624853B2 (en
Inventor
Tadaki Sakai
忠基 酒井
Shinji Yamamoto
伸治 山本
Tsukasa Shiroganeya
司 白銀屋
Akira Ozaki
小崎　彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP12340081A priority Critical patent/JPS5823446A/en
Publication of JPS5823446A publication Critical patent/JPS5823446A/en
Publication of JPS624853B2 publication Critical patent/JPS624853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To control the filling action of a resin in a metal mold and thus seal a semiconductor without breaking or deforming a fine metallic wire between a lead frame and a chip, by dividing the extrusion molding of a thermo-plastic resin into the primary extrusion pressure and the secondary one, when the molding is performed. CONSTITUTION:The fused resin coming out from an extruder passes through a sprue 1 at the high primary extrusion pressure P1 and flows toward a runner 2. Then, a thermo sensor 9 is settled in the neighborhood of the gate 3 of the runner 2, which detects a temperature increase, when the fused resin passes. When the signal for arrival of the fused resin is received from the thermo sensor 9, the extrusion pressure is changed over to the low secondary extrusion pressure P2. This change-over is quickly performed. The primary extrusion pressure P1 is a pressure required for making the sprue 1 and the runner 2 filled as fast as possible normally in the range of 200-800kg/cm<2>. The secondary extrusion pressure P2 is 50kg/cm<2> or less. However, when it is too low, short shots generate. Normally, the secondary extrusion pressure P2 is 10-50kg/cm<2>.

Description

【発明の詳細な説明】 某発明は、熱可塑性樹脂をもって、射出成形により半導
体を封止する半導体の樹脂封止方法に係るものである。DETAILED DESCRIPTION OF THE INVENTION A certain invention relates to a method for resin-sealing a semiconductor by injection molding using a thermoplastic resin.

従来、半導体の樹脂封止には、エポキシ樹脂やシリコン
樹脂などの熱硬化性樹脂が用いられている。Conventionally, thermosetting resins such as epoxy resins and silicone resins have been used for resin encapsulation of semiconductors.

ところが、この熱硬化性樹脂の最大の欠点は硬化時間が
長いことと、その取扱いが面倒なことである。However, the biggest drawbacks of this thermosetting resin are that it takes a long time to cure and is difficult to handle.

この問題を解消せんとして、耐熱性の熱可塑性樹脂を封
止材料として用いることが試みられている力（通常の射
出成形方法を、そのまま応用すると、ポリスルフィド、
ポリエステル系などの高い融点を有する熱可塑性樹脂は
、通常溶融状態で３００〜２０００ポアズ程度の低粘度
材料であって、これをスプルー、ランナ一部に対して低
圧あるいは低速で射出すると、金型キャビティ内で流動
する途上、溶融樹脂温度が下がり、溶融粘度の上昇とか
固化現象を生じ、所謂ショートショットになム金型キャ
ビティ内へ完全に樹脂を充填するためには、パリを生じ
させない程度に高圧あるいは高速で射出することが必要
であるが、金型キャビティ内を溶融樹脂が、早い速度で
流動すると、リードフレームとチップとの間にボンディ
ングされた金属線（例えば金線とかアルミ線）を破断し
たり、まだこれを変形して半導体としての機能、信頼性
に問題を生じる。In an attempt to solve this problem, attempts have been made to use heat-resistant thermoplastic resin as a sealing material.
Thermoplastic resins with a high melting point, such as polyester, are usually low viscosity materials of about 300 to 2,000 poise in the molten state, and when injected into the sprue or part of the runner at low pressure or speed, the mold cavity As the molten resin flows in the mold, the temperature decreases, causing an increase in melt viscosity and solidification phenomena. Alternatively, high-speed injection is required, but if the molten resin flows inside the mold cavity at a high speed, it will break the metal wire (for example, gold wire or aluminum wire) bonded between the lead frame and the chip. However, if this is still modified, problems may arise in its functionality and reliability as a semiconductor.

このため溶融樹脂を出来る限シ低圧、低速で射出するこ
とは、リードフレームとチップとを結ぶ微細な金属線の
破断や変形を防ぐに必要な要件であるが、これは前記の
ように、溶融樹脂温度の低下とかその粘度の上昇とか固
化現象を招き、またこのような状態で無理に金型キャビ
ティ内に充填すると、矢張り金属線の破断とか変形を生
じる。Therefore, it is necessary to inject the molten resin at the lowest possible pressure and speed to prevent the fine metal wires connecting the lead frame and the chip from breaking or deforming. A decrease in the resin temperature or an increase in its viscosity may cause solidification, and if the resin is forcibly filled into the mold cavity under such conditions, the metal wire may break or become deformed.

本発明はこのような問題点を解決せんとするものである
。The present invention aims to solve these problems.

これを図面に基いて説明する。This will be explained based on the drawings.

第１図において、（７）はリードフレーム、（６）はそ
の中央に取付けられたチップで、リードフレーム（’／
）とチップ（６）の間には微細な金属線（５）（５）・
・・・がボンディングされている。In Figure 1, (7) is a lead frame, (6) is a chip attached to the center of the lead frame ('/
) and the chip (6) there is a fine metal wire (5) (5).
...is bonded.

（８）はリードフレーム（））に形成されている透孔で
ある。(8) is a through hole formed in the lead frame ().

今、このチップ（６）を熱可塑性樹脂（ｌＯ）でその表
裏より封止せんとするのであるが、このためには、この
リードフレーム（））を、第２図および第３図で示す金
型キャビティ（４）内に設置する。Now, we are going to seal this chip (6) with thermoplastic resin (IO) from the front and back, but for this purpose, we will need to seal this lead frame ( ) with a thermoplastic resin (lO) as shown in Figures 2 and 3. Place it inside the mold cavity (4).

そして射出された熱可塑性樹脂（ユ０）の溶融物は、ス
プルー（１）ランナー（２）を経てゲート（３）より金
型キャビティ（４）内に注入される。The injected melt of the thermoplastic resin (U0) is injected into the mold cavity (4) through the sprue (1), the runner (2), and the gate (3).

金型温度は樹脂の融点より低く設定されているので射出
圧力が低いとスプルー（１）あるいはランナー（２）で
固化してしまうか、あるいは金型Φヤビテイ（４）内に
充満しない内に固化してしまう。The mold temperature is set lower than the melting point of the resin, so if the injection pressure is low, it will solidify at the sprue (1) or runner (2), or solidify before it fills the mold cavity (4). Resulting in.

また射出圧力を高（１１５０７２以上にすると、樹脂ｍ
　ｃ は金型キャビティ（４）内に充満するが、ボンディング
された微細な金属線（５）を破断したシ変形させたりす
る。Also, if the injection pressure is high (115072 or higher), the resin m
C fills the mold cavity (4), but breaks and deforms the bonded fine metal wires (5).

この金属線を変形させないための射出圧力は、金型温度
を樹脂の融点以上に保つことにより確認できる。The injection pressure required to prevent the metal wire from deforming can be confirmed by keeping the mold temperature above the melting point of the resin.

また実験の結果１．金型温度を樹脂の融点より５０゜］
ｃｇ 〜ｌｏｏ’ｏ程度低く設定しても、射出圧力を５０／２
ｍ 以下に保てば、金属＃（５）の変形が殆んど起、らない
ことが確認された。Also, experimental results 1. Set the mold temperature to 50° from the melting point of the resin]
Even if you set it as low as cg ~ loo'o, the injection pressure will be 50/2.
It was confirmed that if the temperature was kept below m, deformation of metal #(5) hardly occurred.

そこで本発明はスプルー（１）およびランナー（２）に
おいては高い一次射出圧力（Ｐｌ）で充填し、金型キャ
ビティ（４）内は低い二次射出圧力（Ｐ２）で充填する
ものである。Therefore, in the present invention, the sprue (1) and runner (2) are filled with a high primary injection pressure (Pl), and the inside of the mold cavity (4) is filled with a low secondary injection pressure (P2).

一次射出圧力（Ｐｌ）は出来る限り早くスプルー（１）
とランナー（２）を充填させるのに必要な圧力とし、通
この圧力が余り高過ぎると、圧力の切換えの際、慣性力
で樹脂を金型キャピテイ（４）内に早い速度で柱身下と
する。しかしこれが余り低いとショートショット使用す
る熱可塑性樹脂としてはボリフエニレンサルフイト−ポ
リプチレンテレフタトトなどであるが、溶融時の粘度と
しては３００〜２０００ポアズが望ましい。The primary injection pressure (Pl) is adjusted to the sprue (1) as soon as possible.
If the pressure in the runner (2) is too high, the inertia force will force the resin into the mold cavity (4) under the column body at a high speed. do. However, if this is too low, the thermoplastic resin used for short shot is polyphenylene sulfite-polybutylene terephthalate, etc., but the viscosity at the time of melting is preferably 300 to 2000 poise.

また金型温度は樹脂の融点に近い方が低い圧力で充填し
易いが、その反面、冷却時間が長くな不ので、融点よ６
５ｏ’〜１０δ０程度低く設定する。Also, if the mold temperature is close to the melting point of the resin, it will be easier to fill with a lower pressure, but on the other hand, the cooling time will be longer, so the melting point will be lower than the melting point.
Set as low as 5o' to 10δ0.

前記における一次射出圧力よプニ次射出圧力への切換え
は次のよ′うＫして行う。Switching from the primary injection pressure to the secondary injection pressure in the above is performed as follows.

射出機からでた溶融樹脂は、高い一次射出圧力（Ｐｌ）
でスプルー（１）を通りランナー（２）に向って流動す
る。そこでランナー（２）のゲート（３）近くに、第３
図で示すように、感熱素子（９）を設置し、溶融樹脂が
通過すると温度上昇を検知する。The molten resin coming out of the injection machine has a high primary injection pressure (Pl)
Then, it flows through the sprue (1) toward the runner (2). Therefore, near the gate (3) of the runner (2), a third
As shown in the figure, a heat sensitive element (9) is installed to detect a temperature rise when the molten resin passes through.

感熱素子（９）から溶融樹脂到達の信号を受けると、射
出圧力は低い二次射出圧力（Ｐ　）に切換える。そして
この切換えは急激に行う。When receiving a signal indicating that the molten resin has arrived from the heat sensitive element (9), the injection pressure is switched to a lower secondary injection pressure (P). This switching is then performed rapidly.

第４図で示すように、−次射出圧力（Ｐ　’）より二次
射出圧力（Ｐ、）Ｋ切換える場合、ある長さだけ溶融樹
脂が慣性的に流動する。しかしゲート（３）を通過後は
二次射出圧力（Ｐ２）Ｋ切換っているように４しなけれ
ばならない。As shown in FIG. 4, when the secondary injection pressure (P, )K is switched from the negative injection pressure (P'), the molten resin flows inertially over a certain length. However, after passing through the gate (3), the secondary injection pressure (P2) must be switched to 4.

油圧の制御を厳密に行うためには、サーボ弁方式の油圧
調節・機構が望ましいが、通常の電磁式制御方式のもの
でも充分である。In order to strictly control the hydraulic pressure, a servo valve type hydraulic pressure adjustment mechanism is desirable, but a normal electromagnetic control type is also sufficient.

感熱素子（９）は多数個数シ金型にあっては何れかのダ
ート（３）の附近に１個所取付けるだけで充分である。If the mold has a large number of heat-sensitive elements (9), it is sufficient to attach one heat-sensitive element (9) near one of the darts (3).

また感熱素子（９）は熱電対、サーミスターなど既存の
ものでもよいが、応答性を速くするため保護部を薄くす
るなどの工夫が必要である。Further, the heat-sensitive element (9) may be an existing one such as a thermocouple or a thermistor, but it is necessary to take measures such as making the protective part thinner in order to speed up the response.

本発明は、以上のように、熱可塑性樹脂の射出成形に当
って、これを−次射出圧力と二次射出圧力とに分けるこ
とＫよって、金型内の樹脂の充填挙動を制御して、リー
ドフレームとチップとの間の微細な金属線を破断したり
変形させたシすることなく、この半導体の封止をするこ
とができる。ｔたその操作中ショートショットになるよ
うな恐れも全くない。As described above, the present invention controls the filling behavior of the resin in the mold by dividing the injection molding into the secondary injection pressure and the secondary injection pressure during injection molding of thermoplastic resin. This semiconductor can be sealed without breaking or deforming the fine metal wires between the lead frame and the chip. There is no fear of short shots during the operation.

また−次と二次の射出圧力の切換えＫはランナーに配置
した感熱素子をもってこれを行うので、その切換えが安
定して行われ、金型温度の変動や溶融樹脂温度の変動に
よく対応することができ、金属線の破断、変形を防止す
ることができる。Furthermore, since switching between the next and second injection pressures is carried out using a heat-sensitive element placed on the runner, the switching is stable and can respond well to changes in mold temperature and molten resin temperature. This can prevent metal wires from breaking or deforming.

し九がって、本発明によれば、熱硬化性樹脂による場合
と比較して成形サイクルが短く生産性が向止し、また、
その作業が容易となる上、半導体としての不良製品の発
生を防止し、かつその信頼性の向上に寄与することがで
きるとともに、作業環境の向上と製造コストの低減化が
可能となる。Therefore, according to the present invention, the molding cycle is shorter than in the case of using thermosetting resin, and productivity is reduced, and
In addition to making the work easier, it is possible to prevent the occurrence of defective semiconductor products and contribute to improving the reliability of semiconductor products, and it is also possible to improve the working environment and reduce manufacturing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はリードフレームの平面図、第２図は金型キャビ
ティの平面図、第３図は金型キャビティ要部の平面図、
第４図は射出圧力の変化を示すグラフである。 １・・・・スプルー　２６１１１１ｅランナー　４・１
・金型キャビティ　９・・・・感熱素子　１０．、、・
熱可塑性樹脂３１＆Ｌ ワ 痴　）　占 ラ　　３　東 ζ ′ｋ　　＋　　鉦 −ラ　−Fig. 1 is a plan view of the lead frame, Fig. 2 is a plan view of the mold cavity, Fig. 3 is a plan view of the main parts of the mold cavity,
FIG. 4 is a graph showing changes in injection pressure. 1... Sprue 261111e Runner 4.1
・Mold cavity 9...Heat-sensitive element 10. ,,・
Thermoplastic resin 31&L wa shi) Zanra 3 East ζ ′k + gong-ra −

Claims (2)

【特許請求の範囲】[Claims] （１）熱可塑性樹脂をもって射出成形により半導体の封
止を行うに当って、射出機より、スプルー、ランナーを
力として射出圧力を２段に分けて行う半導体の樹脂封止
方法。(1) A semiconductor resin encapsulation method in which a semiconductor is encapsulated by injection molding using a thermoplastic resin, and the injection pressure is applied in two stages using a sprue and a runner from an injection machine. （２）−次射出圧力と二次射出圧力との切換えは、ラン
ナーに配置した感熱素子をもって行う特許請求の範囲第
１項記載の半導体の樹脂封止方法。(2) The method for resin-sealing a semiconductor according to claim 1, wherein switching between the secondary injection pressure and the secondary injection pressure is performed using a heat-sensitive element disposed on a runner.
JP12340081A 1981-08-06 1981-08-06 Resin sealing method for a semiconductor Granted JPS5823446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12340081A JPS5823446A (en) 1981-08-06 1981-08-06 Resin sealing method for a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12340081A JPS5823446A (en) 1981-08-06 1981-08-06 Resin sealing method for a semiconductor

Publications (2)

Publication Number Publication Date
JPS5823446A true JPS5823446A (en) 1983-02-12
JPS624853B2 JPS624853B2 (en) 1987-02-02

Family

ID=14859611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12340081A Granted JPS5823446A (en) 1981-08-06 1981-08-06 Resin sealing method for a semiconductor

Country Status (1)

Country Link
JP (1) JPS5823446A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040163A (en) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション Improved sealing method for electronic parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040163A (en) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション Improved sealing method for electronic parts
JPH0535189B2 (en) * 1983-07-27 1993-05-25 Hoechst Celanese Corp

Also Published As

Publication number Publication date
JPS624853B2 (en) 1987-02-02

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