JPS58224730A - Temperature adjusting device of mold for injection molding - Google Patents

Temperature adjusting device of mold for injection molding

Info

Publication number
JPS58224730A
JPS58224730A JP10829182A JP10829182A JPS58224730A JP S58224730 A JPS58224730 A JP S58224730A JP 10829182 A JP10829182 A JP 10829182A JP 10829182 A JP10829182 A JP 10829182A JP S58224730 A JPS58224730 A JP S58224730A
Authority
JP
Japan
Prior art keywords
mold
disk
temperature
injection molding
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10829182A
Other languages
Japanese (ja)
Other versions
JPH0433261B2 (en
Inventor
Yasuhiko Seto
瀬戸 泰彦
Kiyonori Iwama
岩間 清徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp, Pioneer Electronic Corp filed Critical Pioneer Corp
Priority to JP10829182A priority Critical patent/JPS58224730A/en
Publication of JPS58224730A publication Critical patent/JPS58224730A/en
Publication of JPH0433261B2 publication Critical patent/JPH0433261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2642Heating or cooling means therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2642Heating or cooling means therefor
    • B29C2045/2644Heating or cooling means therefor for the outer peripheral ring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C2045/2648Outer peripheral ring constructions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7343Heating or cooling of the mould heating or cooling different mould parts at different temperatures

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent the generation of an residual stress and a sink mark in a resin near the outer peripheral edge of a disk like product, by providing the ring mold which contacts the most outer peripheral edge face of the disk with an independent temperature adjusting means in the mold for injection molding the disk like product. CONSTITUTION:In the mold for injection molding a disk like product to which the first mold 1, the second mold 2, a cavity 3, the coolant passage 4 for adjusting the temperature of the first mold 1, the coolant passage 5 for adjusting the temperature of the second mold 2, a stamper 6, the ring mold member 7 contacting the most outer peripheral edge face of the disk, etc. are provided, the coolant passage 10 for adjusting the temperature independently from the coolant passages 4, 5 for adjusting the temperature of the first and second molds is provided to the ring mold 7 which contacts the most outer peripheral edge face 8 of the disk and it is controlled at the temperature different from these.

Description

【発明の詳細な説明】 本発明はディスク状成形品、特に光学式情報記録ディス
クを射出成形するための金型の温度調節装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a temperature control device for a mold for injection molding a disc-shaped molded product, particularly an optical information recording disc.

従来、この種の装置としては、第1図および第2図(第
1図のA−A矢視断面図)に示すようなものがあった。
Conventionally, there have been devices of this type as shown in FIG. 1 and FIG. 2 (a sectional view taken along the line A-A in FIG. 1).

第1〜第2図において、20は第一金型、30は第二金
型であり、第一金型20と第二金型30との間にキャビ
ティ空間40が形成されている。
In FIGS. 1 and 2, 20 is a first mold, 30 is a second mold, and a cavity space 40 is formed between the first mold 20 and the second mold 30.

また50b、60b、70bはそれぞれ冷却水の環状流
路であり、冷却水人口50a、環状流路50bおよび冷
却水出口50cによって第一冷却区域が形成され、同様
にして冷却水入口60a  (70a)、環状流路60
b(70b)および冷却水出口60 c (70c)に
よって第二(第三)冷却区域が形成されている。
Furthermore, 50b, 60b, and 70b are annular flow paths for cooling water, respectively, and a first cooling area is formed by the cooling water population 50a, the annular flow path 50b, and the cooling water outlet 50c, and similarly, the cooling water inlet 60a (70a) , annular channel 60
b (70b) and the cooling water outlet 60c (70c) form a second (third) cooling zone.

このような複数個の渦巻型冷却流路によって、キャビテ
イ空間40全体にわたって一様な温度に保ち、成形品の
熱による残留応力を低減するように図っていた。
Such a plurality of spiral cooling channels is used to maintain a uniform temperature throughout the cavity space 40 and to reduce residual stress due to heat in the molded product.

しかしながら、このような従来の温度調節装置では、成
形品のほぼ全体にわたって残留応力を低減させることが
できるものの、最外周端部については金型との接触面積
が大きいため、溶融樹脂の冷却速度の差から残留応力お
よびその内周部のひけが生じる等の欠点があった。
However, although such conventional temperature control devices can reduce residual stress over almost the entire molded product, the outermost edge has a large contact area with the mold, so the cooling rate of the molten resin is affected. There were drawbacks such as residual stress and sink marks occurring on the inner periphery due to the difference.

特に、光学式情報記録ディスクのような薄肉成形では、
射出圧力が高いときには外周端部付近の樹脂に密度勾配
ができ、樹脂密度差から冷却時に生じる残留応力も加わ
って複屈折およびひけのために外周部の信号読取りに悪
影響を及ぼしていた。
In particular, in thin-walled molding such as optical information recording disks,
When the injection pressure is high, a density gradient is created in the resin near the outer edge, and residual stress generated during cooling due to the difference in resin density is added, which adversely affects signal reading at the outer edge due to birefringence and sinkage.

(光学式ディスクにあっては成形されたディスクが読取
ビームの光路の一部となる。) また、ひけは信号面の保iiI膜コーティングに支障を
きたし、残留応力は経時変化による最外周のクラックの
原因となった。
(In the case of optical discs, the shaped disc becomes part of the optical path of the reading beam.) In addition, sink marks interfere with the protection III film coating on the signal surface, and residual stress causes cracks on the outermost periphery due to aging. This caused the

残留応力やひげを低減する手段として、金型の温度調節
による以外に、金型の外周部に間隙を設けて樹脂を逃が
したり、成形品外周部の肉厚を増加させるなどの手段が
考えられる。しがし、これらの手段では成形品の形状変
更および後加工が必要となるため、好ましくない。
In addition to adjusting the temperature of the mold, possible ways to reduce residual stress and whiskers include creating a gap around the outside of the mold to allow the resin to escape, and increasing the wall thickness around the outside of the molded product. . However, these methods are not preferred because they require changing the shape of the molded product and post-processing.

参考のため、従来の温度調節装置において設定温度を1
00°Cとした場合の金型のキャビティ空間40表面温
度の測定結果を記す。
For reference, set the temperature to 1 on a conventional temperature controller.
The measurement results of the surface temperature of the mold cavity space 40 at 00°C are shown below.

ディスク内周部   83°C ディスク中周部   84℃ ディスク外周部   85・c ディスク最外周端部を形成する環状部材 81℃最外周
端部を形成する環状部材においては、熔融樹脂と金型と
の接触面積が大きいこと等からキャビティ表面温度が他
部に比べて数°C低いことがわかる。
Inner circumference of the disk 83°C Middle circumference of the disk 84°C Outer circumference of the disk 85・c Annular member forming the outermost edge of the disk 81℃ In the annular member forming the outermost edge, the molten resin and the mold It can be seen that the cavity surface temperature is several degrees Celsius lower than other parts due to the large contact area.

本発明の目的は、上記従来の技術の欠点を克服し、成形
品の最外周端部付近の残留応力、ひけ、および複屈折を
低減することのできる温度調節装置をIにイ共すること
にある。
An object of the present invention is to overcome the drawbacks of the above-mentioned conventional techniques and to provide a temperature control device that can reduce residual stress, sink marks, and birefringence near the outermost peripheral edge of a molded product. be.

以下、図によって本発明を具体的に説明する。Hereinafter, the present invention will be specifically explained with reference to the drawings.

第3図は本発明の一実施例よりなる温度調節装置の断面
図、第4図は他の実施例よりなる同装置の断面図である
FIG. 3 is a sectional view of a temperature control device according to one embodiment of the present invention, and FIG. 4 is a sectional view of the same device according to another embodiment.

第3図において、■は第一金型、2は第二金型、3は第
一金型1および第二金型2によって形成されるキャビテ
ィ空間、4は第一金型1の温度調節用冷媒流路、5は第
二金型2の温度調節用冷媒流路、6はスタンパ−17は
ディスク最外周端面と接触する環状金型部材、8はキャ
ビティ外周端部の金型面9はエア・ギャップおよびio
は環状金型部材7の温度調節用冷媒流路である。11は
ブツシュであり溶融樹脂をキャビティ空間3に流入する
ためのスビール12が形成されている。環状金型部材7
の外周端部は第一金型1と、密着させることも可能であ
るが、必要に応じエア・ギャップ】3を設け、エア・ギ
ャップ9と同様に環状金型部材7を熱的に遮断してもよ
い。
In Fig. 3, ■ is the first mold, 2 is the second mold, 3 is the cavity space formed by the first mold 1 and the second mold 2, and 4 is for temperature adjustment of the first mold 1. Refrigerant flow path 5 is a refrigerant flow path for temperature adjustment of the second mold 2, 6 is a stamper 17 is an annular mold member that contacts the outermost peripheral end surface of the disk, 8 is a mold surface 9 at the outer peripheral end of the cavity for air flow.・Gap and io
is a refrigerant flow path for temperature adjustment of the annular mold member 7. Reference numeral 11 denotes a bushing in which a vial 12 for flowing the molten resin into the cavity space 3 is formed. Annular mold member 7
Although it is possible to bring the outer peripheral end of the ring into close contact with the first mold 1, if necessary, an air gap 3 may be provided to thermally isolate the annular mold member 7 in the same manner as the air gap 9. It's okay.

このような構成よりなる金型の温度調節装置を用いれば
、まず温度調節用冷媒流路4,5を流れる冷媒によって
、キャビティ空間3の表面温度を前面にわたって一様な
温度に保つことができる。
If the mold temperature control device having such a configuration is used, first, the surface temperature of the cavity space 3 can be maintained at a uniform temperature over the front surface by the refrigerant flowing through the temperature control refrigerant channels 4 and 5.

このことは本発明も第1図及び第2図に示すディスクの
平面部を冷却する構成をそのまま包含していることに基
いている。しかしながら本発明はさらに、環状冷媒流路
10を流れは独立した冷媒によって、ディスク最外周端
面と接触する環状金型部材7も温度調節される。したが
って、キャビティ外周端部の金型面8を他のキャビティ
表面と略同−の温度に保つことができることは勿論、場
合によっては異なった温度に保つことができる。
This is based on the fact that the present invention also includes the structure shown in FIGS. 1 and 2 for cooling the flat surface of the disk. However, in the present invention, the temperature of the annular mold member 7 in contact with the outermost peripheral end surface of the disk is also controlled by the independent refrigerant flowing through the annular refrigerant flow path 10. Therefore, it is possible to maintain the mold surface 8 at the outer circumferential end of the cavity at approximately the same temperature as the other cavity surfaces, and it is also possible to maintain the mold surface 8 at a different temperature depending on the case.

なお、上記実施例では環状金型部材7の温度調節を環状
流路10に冷媒を流すことによって行なっているが、第
4図のようにバンドヒータ14によって環状金型部材7
のみを加熱するようにしてもよい。また、環状金型部材
7と第二金型2との接触部分に熔融樹脂が流出しない程
度に数ミクロンのギャップ15を設けて、熱絶縁効果を
あげることもできる(このことは第3図における実施例
の場合も同様である。)。さらに、エア・ギャップ9,
13の代りに断熱材料によるパツキンを用いてもよい。
In the above embodiment, the temperature of the annular mold member 7 is adjusted by flowing a refrigerant through the annular channel 10, but as shown in FIG.
It is also possible to heat only the Furthermore, a gap 15 of several microns can be provided at the contact portion between the annular mold member 7 and the second mold 2 to the extent that the molten resin does not flow out, thereby increasing the thermal insulation effect (this is shown in FIG. 3). The same applies to the examples.) Furthermore, air gap 9,
Instead of 13, a packing made of a heat insulating material may be used.

以上説明したように、本発明の温度調節装置は上記構成
からなるため、ディスク最外周端面と接触する環状金型
部材の温度を独立に調節することができ、したがって成
形品最外周端部の残留応力とそれに伴う複屈折および内
周部に生じるひけを低減することができる。
As explained above, since the temperature control device of the present invention has the above configuration, it is possible to independently adjust the temperature of the annular mold member that comes into contact with the outermost peripheral end surface of the disk. It is possible to reduce stress, birefringence associated with it, and sink marks occurring on the inner circumference.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の温度調節装置の断面図、第2図は第1図
のA−A矢視断面図、第3図は本発明の一実施例よりな
る温度調節装置の断面図および第4図は他の実施例より
なる同装置の断面図である。 1・・・第一金型、2・・・第二金型、3・・・キャビ
ティ空間、4,5・・・温度調節用冷媒流路、7・・・
環状金型部材、10・・・温度調節用冷媒流路、14・
・・バントヒー・夕。 特許出願人  パイオニア株式会社 第1図
FIG. 1 is a sectional view of a conventional temperature control device, FIG. 2 is a sectional view taken along the line A-A in FIG. The figure is a sectional view of the same device according to another embodiment. DESCRIPTION OF SYMBOLS 1... First mold, 2... Second mold, 3... Cavity space, 4, 5... Refrigerant channel for temperature adjustment, 7...
Annular mold member, 10... Temperature adjustment refrigerant channel, 14.
...Banthee Evening. Patent applicant: Pioneer Corporation Figure 1

Claims (1)

【特許請求の範囲】[Claims] ディスク状成形品を射出成形するための金型の温度調節
装置であって、ディスク最外周端面と接触する環状金型
部材に、ディスク平面部の冷却手段とは独立した温度調
節手段を設けたことを特徴とする射出成形用金型の温度
調節装置。
A temperature control device for a mold for injection molding a disk-shaped molded product, wherein a temperature control means independent of a cooling means for the flat surface of the disk is provided in an annular mold member that comes into contact with the outermost peripheral end surface of the disk. A temperature control device for injection molding molds.
JP10829182A 1982-06-25 1982-06-25 Temperature adjusting device of mold for injection molding Granted JPS58224730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10829182A JPS58224730A (en) 1982-06-25 1982-06-25 Temperature adjusting device of mold for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10829182A JPS58224730A (en) 1982-06-25 1982-06-25 Temperature adjusting device of mold for injection molding

Publications (2)

Publication Number Publication Date
JPS58224730A true JPS58224730A (en) 1983-12-27
JPH0433261B2 JPH0433261B2 (en) 1992-06-02

Family

ID=14480946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10829182A Granted JPS58224730A (en) 1982-06-25 1982-06-25 Temperature adjusting device of mold for injection molding

Country Status (1)

Country Link
JP (1) JPS58224730A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166433A (en) * 1984-02-10 1985-08-29 Shigeru Tsutsumi Method and apparatus for injection-molding synthetic resin
JPS60187034U (en) * 1984-05-23 1985-12-11 株式会社テクノプラス Outer mounting structure of stamper for forming disc-shaped recording media
JPS6287812U (en) * 1985-11-22 1987-06-04
JPS62214914A (en) * 1986-03-17 1987-09-21 Mitsubishi Metal Corp Transfer molding and mold therefor
FR2649640A1 (en) * 1989-07-13 1991-01-18 Sistac Sa B Localised cooling device for thermoplastic injection moulds
JPH0526335U (en) * 1991-02-25 1993-04-06 テイーデイーケイ株式会社 Injection mold
JPH06285937A (en) * 1993-03-31 1994-10-11 Seikosha Co Ltd Injection molding machine
EP0846542A1 (en) * 1996-12-04 1998-06-10 Sony DADC Austria AG Method of and apparatus for molding with multiple temperature adjusting channels
NL1005502C2 (en) * 1997-03-12 1998-09-15 Ict Axxicon Bv Die for manufacturing disc-shaped objects.
NL1016726C2 (en) * 2000-11-29 2002-05-31 Otb Group Bv Injection molding method, has temperature of ring around first mold section regulated in order to control distance of gap between ring and mold section
EP1348531A1 (en) * 2002-03-25 2003-10-01 AWM Mold Tech AG Injection mould for producing disc-shaped information carriers
NL1027454C2 (en) * 2004-11-09 2006-05-10 F T Engineering B V Injection molding die component useful in the manufacture of optical data carriers comprises a venting ring that surrounds a central part with a gap dependent on the axial position of the ring
CN108326144A (en) * 2018-01-10 2018-07-27 东风商用车有限公司 A kind of drive axle end cap hot stamping forming die and its manufacturing method
EP3981572A1 (en) * 2020-10-09 2022-04-13 Toyota Jidosha Kabushiki Kaisha Mold cooling structure

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166433A (en) * 1984-02-10 1985-08-29 Shigeru Tsutsumi Method and apparatus for injection-molding synthetic resin
JPS60187034U (en) * 1984-05-23 1985-12-11 株式会社テクノプラス Outer mounting structure of stamper for forming disc-shaped recording media
JPS633799Y2 (en) * 1984-05-23 1988-01-29
JPS6287812U (en) * 1985-11-22 1987-06-04
JPS62214914A (en) * 1986-03-17 1987-09-21 Mitsubishi Metal Corp Transfer molding and mold therefor
FR2649640A1 (en) * 1989-07-13 1991-01-18 Sistac Sa B Localised cooling device for thermoplastic injection moulds
JPH0526335U (en) * 1991-02-25 1993-04-06 テイーデイーケイ株式会社 Injection mold
JPH06285937A (en) * 1993-03-31 1994-10-11 Seikosha Co Ltd Injection molding machine
EP0846542A1 (en) * 1996-12-04 1998-06-10 Sony DADC Austria AG Method of and apparatus for molding with multiple temperature adjusting channels
NL1005502C2 (en) * 1997-03-12 1998-09-15 Ict Axxicon Bv Die for manufacturing disc-shaped objects.
EP0864411A1 (en) * 1997-03-12 1998-09-16 Axxicon Moulds Eindhoven B.V. Mould for manufacturing disc-like objects
NL1016726C2 (en) * 2000-11-29 2002-05-31 Otb Group Bv Injection molding method, has temperature of ring around first mold section regulated in order to control distance of gap between ring and mold section
EP1348531A1 (en) * 2002-03-25 2003-10-01 AWM Mold Tech AG Injection mould for producing disc-shaped information carriers
NL1027454C2 (en) * 2004-11-09 2006-05-10 F T Engineering B V Injection molding die component useful in the manufacture of optical data carriers comprises a venting ring that surrounds a central part with a gap dependent on the axial position of the ring
CN108326144A (en) * 2018-01-10 2018-07-27 东风商用车有限公司 A kind of drive axle end cap hot stamping forming die and its manufacturing method
EP3981572A1 (en) * 2020-10-09 2022-04-13 Toyota Jidosha Kabushiki Kaisha Mold cooling structure

Also Published As

Publication number Publication date
JPH0433261B2 (en) 1992-06-02

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